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74LX1GU04CTR

STMicroelectronics

74LX1GU04CTR by STMicroelectronics

74LX1GU04CTR from STMicroelectronics is a CMOS logic gate with a supply voltage range of 1.65V to 5.5V and a low propagation delay of just 7 ns. It features a compact design with a max operating temp of 125 °C, ideal for military applications. This surface-mount device supports high-speed operations while maintaining low load capacitance at 50 pF.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 10,336 parts In-Stock

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10,336

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Vyrian

USA . 8,869 parts In-Stock

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8,869

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Anansix

USA . 2,881 parts In-Stock

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2,881

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Digiode

USA . 2,584 parts In-Stock

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2,584

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J2 Sourcing AB

Sweden . 913 parts In-Stock

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913

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Distributors (Availability)

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Native Components

USA . 609 parts In-Stock

1+ parts

$0.169

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-

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$0.162

609

$0.169

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$0.162

Northwest PG Solutions

USA . 472 parts In-Stock

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$0.185

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-

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$0.163

472

$0.185

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$0.163

Microchip USA

USA . 103 parts In-Stock

1+ parts

$2.067

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103

$2.067

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AZTECH Wire

Italy . 95 parts In-Stock

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$10.840

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95

$10.840

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IDEA Electronic Components Group

UK . 569 parts In-Stock

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$20.968

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$18.871

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569

$20.968

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$18.871

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MKK Technologies

India . 1,597 parts In-Stock

1+ parts

$39.428

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1,597

$39.428

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DigiPath Technology Company

USA . 1,597 parts In-Stock

1+ parts

$39.428

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1,597

$39.428

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Perfect Parts

USA . 10,302 parts In-Stock

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10,302

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A-Z Elektronik GmbH

Germany . 4,757 parts In-Stock

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Corphita

USA . 2,125 parts In-Stock

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Parana Technologies

USA . 1,624 parts In-Stock

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$25.070

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1,624

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$25.070

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Overview

Unlock unparalleled performance and reliability with the 74LX1GU04CTR from STMicroelectronics, a leader in innovation and quality in logic gates. Designed for demanding applications, this compact, surface-mount component operates across extreme temperatures, ensuring consistent functionality even in the harshest environments. Experience faster processing speeds, reduced power consumption, and enhanced durability—perfect for automotive, industrial, and consumer electronics. Elevate your projects with unmatched precision and dependability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and resistance to environmental factors, making it ideal for reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and is suitable for automated assembly, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and is widely compatible with various PCB layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal voltage of 1.8V makes this product suitable for power-sensitive applications, contributing to overall energy efficiency.

Load Capacitance (CL): 50 pF

A low load capacitance ensures high speed and performance in fast switching environments, making it ideal for modern digital circuits.

Power Supplies (V): 3.3

Compatibility with a 3.3V power supply makes it versatile for a variety of digital systems commonly used in consumer electronics.

No. of Terminals: 5

Having five terminals allows for multiple input/output configurations, providing flexibility in design and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile help save space on PCBs, accommodating compact designs without sacrificing performance.

Maximum I (ol): 24 Amp

A high output current capability of 24 Amps allows the product to drive significant loads, essential for robust circuit performance.

Propagation Delay (tpd): 7 ns

A fast propagation delay of 7 ns indicates swift signal processing, suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

An operating temperature of up to 125 °C ensures reliability in high-temperature environments, adhering to stringent operational requirements.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C makes this product suitable for extreme conditions, ideal for military or aerospace applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and contributes to long-term reliability in electrical connections.

Terminal Position: DUAL

Dual terminal position enhances the mounting flexibility on PCBs, making it easier to integrate in various designs.

Maximum Seated Height: 1.1 mm

A low seated height allows for thinner circuit designs, essential for modern electronics that favor compactness.

Width: 1.25 mm

Its narrow width ensures a small footprint on the PCB, facilitating dense circuit layouts.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage of 1.65V increases versatility across different applications, accommodating lower power designs.

Length: 2 mm

The compact length contributes to the device’s suitability for space-constrained applications, without compromising on performance.

Temperature Grade: MILITARY

MILITARY-grade specifications ensure high reliability and performance under extreme conditions, making it apt for defense applications.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, enhancing efficiency and performance across various applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy PCB soldering and provide mechanical stability, ensuring device reliability in harsh conditions.

Packing Method: TR

Taped and reeled packing enhances ease of handling and integration in automated assembly processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a balance between compact designs and ease of assembly, making it practical for various electronic applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows compatibility with a broad range of digital circuits, enhancing overall utility.

Technical Specifications

Logic Gates 74LX1GU04CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1GU04CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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