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74LX1G32STR

STMicroelectronics

74LX1G32STR by STMicroelectronics

74LX1G32STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 5.2 ns, operating b/w 1.65V and 5.5V. It features dual inputs and a compact low-profile package, ideal for high-speed applications in military electronics. With a max temp of 125 °C, it ensures reliability in extreme conditions.

Median Price

$0.356

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Tomark Electronics Ltd

UK . 7,370 parts In-Stock

1+ parts

$0.190

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-

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7,370

$0.190

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Voyager Components

USA . 857 parts In-Stock

1+ parts

$0.356

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$0.356

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$0.356

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$0.356

857

$0.356

$0.356

$0.356

$0.356

Component Electronics Inc.

Canada . 400 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

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400

$1.150

$0.870

$0.750

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ACDS - Activité Composants Distribution Service

France . 18,000 parts In-Stock

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Vyrian

USA . 6,280 parts In-Stock

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6,280

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Digiode

USA . 2,977 parts In-Stock

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2,977

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Connector Distribution Corp

USA . 2,541 parts In-Stock

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2,541

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Right Parts Inc.

USA . 2,541 parts In-Stock

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2,541

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Halfin

Belgium . 2,100 parts In-Stock

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2,100

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Anansix

USA . 1,962 parts In-Stock

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1,962

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Microfarads

USA . 409 parts In-Stock

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409

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Prism Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

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Microchip USA

USA . 208 parts In-Stock

1+ parts

$2.329

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208

$2.329

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AZTECH Wire

Italy . 93 parts In-Stock

1+ parts

$11.560

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93

$11.560

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IDEA Electronic Components Group

UK . 530 parts In-Stock

1+ parts

$11.759

100+ parts

-

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$10.583

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530

$11.759

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$10.583

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MKK Technologies

India . 1,540 parts In-Stock

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$22.113

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1,540

$22.113

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DigiPath Technology Company

USA . 1,540 parts In-Stock

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$22.113

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1,540

$22.113

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Component Stockers USA

USA . 551 parts In-Stock

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$99.990

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551

$99.990

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Perfect Parts

USA . 98,068 parts In-Stock

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98,068

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Cyclops Electronics Ltd (Excess)

UK . 18,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,186 parts In-Stock

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6,186

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Kepictronics

USA . 3,150 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 2,094 parts In-Stock

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$14.060

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Northwest PG Solutions

USA . 1,869 parts In-Stock

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Native Components

USA . 429 parts In-Stock

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Corphita

USA . 165 parts In-Stock

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165

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Overview

Unlock the potential of your designs with the 74LX1G32STR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality logic gate delivers exceptional performance with minimal power consumption, making it ideal for a wide array of applications—from automotive systems to consumer electronics. With a compact footprint and robust temperature range, it ensures reliability and efficiency, empowering you to create cutting-edge technology that stands out in today's competitive market. Choose STMicroelectronics for quality and innovation that elevate your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 5.2 ns

With a low propagation delay of 5.2 ns, this logic gate ensures high-speed performance, making it ideal for fast switching applications.

Surface Mount: YES

Being surface mount compatible allows for compact PCB design and integration, facilitating space-saving and cost-effective solutions.

No. of Inputs: 2

Having two inputs allows for versatile logic operations, enabling more complex circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape enhances PCB layout efficiency, ensuring optimal space utilization.

Nominal Supply Voltage / Vsup (V): 1.8

A nominal supply voltage of 1.8V optimizes power consumption, making it suitable for battery-powered devices.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates compatibility with a wide range of applications, providing stability in operation.

Power Supplies (V): 3.3

The compatibility with a 3.3V power supply enables integration into modern digital circuits, ensuring reliability.

No. of Terminals: 5

With five terminals, this logic gate allows for easier connections in diversified circuit configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design aids in efficient space management in compact electronic systems.

Maximum I (ol): 24 Amp

Capable of handling up to 24 Amps, this logic gate is designed for high current applications, enhancing its usability.

Propagation Delay (tpd): 13 ns

A propagation delay of 13 ns ensures that this logic gate meets the demands of high-speed digital circuitry.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this component is reliable in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures functionality in extreme cold environments, offering versatility in applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and ensures high reliability in electrical connections.

Terminal Position: DUAL

The dual terminal position allows for flexible integration into circuit boards, simplifying the design process.

Maximum Seated Height: 1.45 mm

A low maximum seated height of 1.45 mm allows for compact placements in layered circuits, facilitating miniaturization.

Width: 1.625 mm

The narrow width of 1.625 mm enables efficient use of space on PCB layouts and promotes high circuit density.

Minimum Supply Voltage (Vsup): 1.65 V

Supporting a minimum supply voltage of 1.65V allows flexibility in power sources, making it adaptable to various systems.

Length: 2.9 mm

With a length of 2.9 mm, this component is designed to fit in compact configurations, showcasing its suitability for small form factors.

Temperature Grade: MILITARY

Rated for military temperature grades, this logic gate guarantees reliability and performance in demanding environments.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making it a preferred choice for modern electronic circuits.

Terminal Form: GULL WING

The gull wing terminal form ensures easier soldering and better mechanical stability, facilitating reliable connections.

Packing Method: TR

Packaged using tape and reel (TR) method, allowing for automated assembly in high-volume production environments.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm enables greater packing density, allowing for more compact configurations in circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with various voltage levels in different applications.

Technical Specifications

Logic Gates 74LX1G32STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74LX1G32STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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