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TND315S-TL-2H

Onsemi

TND315S-TL-2H by Onsemi

TND315S-TL-2H by Onsemi is a CMOS peripheral driver with 2 functions, suitable for automotive applications. It operates b/w -40 to 125 °C and supports a max supply voltage of 25 V. With a nominal output peak current limit of 1 A, it features a small outline package style and gull wing terminal form.

Median Price

$0.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

1+ parts

$0.461

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-

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11

$0.461

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Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$9.241

100+ parts

$9.148

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-

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3,000

$9.241

$9.148

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-

Rochester

USA . 55,558 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

55,558

-

$0.647

$0.537

$0.479

Verical

USA . 31,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.672

10k+ parts

$0.599

31,938

-

-

$0.672

$0.599

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,276 parts In-Stock

1+ parts

$0.438

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2,276

$0.438

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Vyrian

USA . 1,834 parts In-Stock

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$0.461

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1,834

$0.461

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Distributors (Availability)

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Corphita

USA . 438 parts In-Stock

1+ parts

$0.415

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438

$0.415

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$0.461

100+ parts

-

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208

$0.461

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$9.240

100+ parts

$9.148

1k+ parts

$8.778

10k+ parts

-

3,000

$9.240

$9.148

$8.778

-

Continental Prestige Electronics

USA . 58,464 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.536

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58,464

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-

$0.536

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SupplyDigital Components

Austria . 7,288 parts In-Stock

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7,288

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Problanco Electronics

Mexico . 7,186 parts In-Stock

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7,186

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A-Z Elektronik GmbH

Germany . 5,321 parts In-Stock

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5,321

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TANS Electronics

Latvia . 3,408 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,378 parts In-Stock

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3,378

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Kulean Microsystems

USA . 2,148 parts In-Stock

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2,148

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Perfect Parts

USA . 669 parts In-Stock

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669

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Microchip USA

USA . 477 parts In-Stock

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477

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UHIMA Technologies

Türkiye . 194 parts In-Stock

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194

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Overview

Elevate your automotive electronics with the TND315S-TL-2H by Onsemi. As a leading manufacturer in the industry, Onsemi delivers premium quality peripheral drivers that offer exceptional value to customers. Ideal for various applications, this peripheral driver boasts a compact design and efficient performance, making it a top choice for automotive systems. Trust Onsemi to provide reliable solutions that enhance the functionality of your electronics. Choose the TND315S-TL-2H for superior performance and unparalleled reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 25 V

With a high maximum supply voltage of 25 V, this peripheral driver can accommodate a wide range of power requirements in various electronic systems.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures reliable performance even in harsh environments or extreme cold conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and increased speed, making this peripheral driver efficient and reliable for various applications.

Output Current Flow Direction: SOURCE AND SINK

The ability to both source and sink current allows this peripheral driver to control a wide range of loads, providing flexibility and versatility in circuit design.

Technical Specifications

Peripheral Drivers TND315S-TL-2H attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

18 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TND315S-TL-2H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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