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TND30SS

Onsemi

TND30SS by Onsemi

TND30SS by Onsemi is a CMOS technology peripheral driver with 8 terminals, operating b/w -40 to 125 °C. It has a max supply voltage of 25 V and a nominal output peak current limit of 1 A. Ideal for automotive applications, this surface-mount device features a turn-on/off time of 0.045 us and low supply current of 4.5 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,361 parts In-Stock

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Vyrian

USA . 828 parts In-Stock

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828

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TANS Electronics

Latvia . 6,356 parts In-Stock

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SupplyDigital Components

Austria . 6,282 parts In-Stock

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Corphita

USA . 2,201 parts In-Stock

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Kulean Microsystems

USA . 1,339 parts In-Stock

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Problanco Electronics

Mexico . 603 parts In-Stock

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UHIMA Technologies

Türkiye . 515 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Elevate your projects with the TND30SS by Onsemi, a cutting-edge peripheral driver that combines high-quality materials and advanced CMOS technology. With a small outline package and dual terminal position, this versatile component is ideal for a wide range of applications in automotive systems. Experience seamless performance and reliable operation with a nominal output peak current limit of 1A and fast turn-on/off times. Trust in Onsemi's reputation for excellence and innovation, and take your projects to the next level with the TND30SS. Elevate your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs during manufacturing.

Maximum Supply Voltage: 25 V

Support for a maximum supply voltage of 25V ensures compatibility with a wide range of power sources and applications.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to integrate the peripheral driver into existing circuit designs and layouts.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components, allowing for versatile use in various electronic systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 °C ensures the peripheral driver can function reliably in harsh environmental conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the peripheral driver can withstand high temperature environments without performance degradation.

Width: 4.4 mm

Compact width of 4.4mm saves precious space on the PCB, making the product ideal for applications with limited board real estate.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring that the peripheral driver meets the stringent requirements for reliability and performance in vehicles.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the peripheral driver energy-efficient and reliable in noisy environments.

Technical Specifications

Peripheral Drivers TND30SS attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.8 mm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

25 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.045 us

Turn-on Time:

.045 us

Width:

4.4 mm

Trade Compliance

TND30SS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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