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ULN2003AIPWRE4

Texas Instruments

ULN2003AIPWRE4 by Texas Instruments

ULN2003AIPWRE4 by Texas Instruments is a 7-bit buffer/inverter peripheral driver with open-collector output. It features transient protection, sink current flow direction, and bipolar technology. Ideal for applications requiring inverted output polarity in a small outline package with 16 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,430 parts In-Stock

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Digiode

USA . 1,472 parts In-Stock

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1,472

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Nova Conductors

Japan . 10 parts In-Stock

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10

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AZTECH Wire

Italy . 350 parts In-Stock

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$9.120

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350

$9.120

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Parana Technologies

USA . 234 parts In-Stock

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$9.773

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$10.346

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234

$9.773

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$10.346

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DigiPath Technology Company

USA . 653 parts In-Stock

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$10.761

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653

$10.761

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IDEA Electronic Components Group

UK . 722 parts In-Stock

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$10.981

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$10.432

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$9.883

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722

$10.981

$10.432

$9.883

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ChromeModa Solutions

Germany . 461 parts In-Stock

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$10.981

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$9.004

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461

$10.981

$9.004

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$12.960

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$12.312

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$12.312

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$12.960

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$12.312

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Corohmni

South Africa . 667 parts In-Stock

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$14.601

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Semicontronic

India . 433 parts In-Stock

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$38.500

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$37.538

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$37.345

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433

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One Stop Electronics

USA . 641 parts In-Stock

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$46.500

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$46.500

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Ampacity Inc.

Singapore . 1,317 parts In-Stock

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$49.500

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Corphita

USA . 4,896 parts In-Stock

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Continental Prestige Electronics

USA . 3,476 parts In-Stock

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Argo Parts USA

USA . 2,222 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$65.775

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$65.775

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$65.775

100

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock new possibilities with the ULN2003AIPWRE4 by Texas Instruments. Designed with quality and precision, this peripheral driver offers reliable performance in a compact package. Perfect for a wide range of applications, this product provides inverted output polarity and built-in transient protections. Say goodbye to worries about compatibility and reliability with Texas Instruments. Upgrade your projects today and experience seamless integration, enhanced functionality, and unmatched efficiency with the ULN2003AIPWRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Surface mount capability allows for easy and quick installation of the peripheral driver onto a circuit board, saving time and effort.

Built-in Protections: TRANSIENT

The built-in transient protection ensures that the peripheral driver is shielded from sudden voltage spikes or fluctuations, increasing its reliability and longevity.

No. of Terminals: 16

With 16 terminals, this peripheral driver can support multiple connections and devices, making it versatile and suitable for complex electronic setups.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy integration with other components or devices, providing flexibility in design and functionality.

Technology: BIPOLAR

The bipolar technology offers high-speed performance and precise control, making this peripheral driver ideal for applications requiring fast and accurate signal processing.

Driver No. of Bits: 7

With 7 bits of driver capability, this peripheral driver can handle a wide range of data processing tasks, making it suitable for various digital applications.

Technical Specifications

Peripheral Drivers ULN2003AIPWRE4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

7

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ULN2003AIPWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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