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BTM7710GXUMA1

Infineon Technologies

BTM7710GXUMA1 by Infineon Technologies

Infineon's BTM7710GXUMA1 is a 28-terminal peripheral driver with a peak current limit of 15A. It features Gull Wing terminals, source and sink output current flow, and is designed for buffer or inverter-based interface IC applications. The small outline rectangular package is made of plastic/epoxy and supports surface mount technology.

Median Price

$3.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 470 parts In-Stock

1+ parts

$3.090

100+ parts

$2.900

1k+ parts

$2.630

10k+ parts

$2.630

470

$3.090

$2.900

$2.630

$2.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 83 parts In-Stock

1+ parts

$2.936

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$2.936

-

-

-

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$2.976

-

-

-

Chip Stock

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

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5,500

-

-

-

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Vyrian

USA . 4,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,882

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-

-

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VNN

France . 4,720 parts In-Stock

1+ parts

-

100+ parts

-

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4,720

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 353 parts In-Stock

1+ parts

$2.630

100+ parts

$2.564

1k+ parts

$2.551

10k+ parts

-

353

$2.630

$2.564

$2.551

-

Corphita

USA . 876 parts In-Stock

1+ parts

$2.781

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$2.781

-

-

-

Argo Parts USA

USA . 336 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$2.976

-

-

-

Continental Prestige Electronics

USA . 145 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

$2.916

145

$2.976

-

-

$2.916

Modulus Dynamics

Lithuania . 4,397 parts In-Stock

1+ parts

$3.355

100+ parts

$3.221

1k+ parts

$3.087

10k+ parts

-

4,397

$3.355

$3.221

$3.087

-

Corohmni

South Africa . 122 parts In-Stock

1+ parts

$3.355

100+ parts

-

1k+ parts

-

10k+ parts

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122

$3.355

-

-

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$3.456

100+ parts

$3.283

1k+ parts

$3.283

10k+ parts

-

150

$3.456

$3.283

$3.283

-

Ampacity Inc.

Singapore . 409 parts In-Stock

1+ parts

$5.720

100+ parts

-

1k+ parts

-

10k+ parts

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409

$5.720

-

-

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Aztec Data Supply Inc.

USA . 3,443 parts In-Stock

1+ parts

$10.130

100+ parts

-

1k+ parts

-

10k+ parts

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3,443

$10.130

-

-

-

AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$17.882

100+ parts

-

1k+ parts

-

10k+ parts

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702

$17.882

-

-

-

Perfect Parts

USA . 16,616 parts In-Stock

1+ parts

-

100+ parts

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16,616

-

-

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RC Electronics

USA . 6,714 parts In-Stock

1+ parts

-

100+ parts

$3.420

1k+ parts

$3.120

10k+ parts

$3.030

6,714

-

$3.420

$3.120

$3.030

QUARKTWIN TECHNOLOGY LTD

USA . 5,752 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,752

-

-

-

-

Lixinc

USA . 5,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,204

-

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.916

1k+ parts

$2.827

10k+ parts

$2.767

2,000

-

$2.916

$2.827

$2.767

Microchip USA

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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296

-

-

-

-

Overview

Unlock the potential of your electronic devices with the BTM7710GXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability. This peripheral driver offers unmatched performance and versatility, making it ideal for a wide range of applications. Whether you're looking to enhance the efficiency of your power management system or streamline your control electronics, the BTM7710GXUMA1 delivers exceptional value and benefits. Trust in Infineon's expertise and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protects the internal components of the peripheral driver.

Surface Mount:

YES - Allows for easy and secure installation on circuit boards, making it convenient for assembly.

Package Shape:

RECTANGULAR - This shape contributes to space-saving design and efficient utilization of PCB real estate.

No. of Terminals:

28 - Provides flexibility for connecting multiple peripheral devices and components.

Package Style (Meter):

SMALL OUTLINE - Ensures a compact and lightweight design for streamlined integration into electronic systems.

Terminal Finish:

TIN - Offers good electrical conductivity for reliable signal transmission and low resistance.

Terminal Position:

DUAL - Enables connection from both sides, enhancing versatility in circuit board layout.

Terminal Form:

GULL WING - Facilitates easy soldering and secure attachment to the PCB for stable connections.

Moisture Sensitivity Level (MSL):

3 - Indicates a moderate level of moisture sensitivity, suitable for various operating environments.

Nominal Output Peak Current Limit:

15 A - Provides high current capacity to meet the demands of power-hungry peripherals.

Interface IC Type:

BUFFER OR INVERTER BASED PERIPHERAL DRIVER - Versatile design for accommodating different types of peripheral devices.

Output Current Flow Direction:

SOURCE AND SINK - Supports bidirectional current flow, allowing for efficient operation of peripherals.

Technical Specifications

Peripheral Drivers BTM7710GXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

BTM7710GXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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