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BTM7752GXUMA1

Infineon Technologies

BTM7752GXUMA1 by Infineon Technologies

Infineon Technologies' BTM7752GXUMA1 is a 36-terminal peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at a nominal voltage of 13.5V and has a max output peak current limit of 12A. This half bridge-based driver is designed for applications requiring source and sink output current flow direction in compact spaces.

Median Price

$11.295

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.833

10k+ parts

$9.151

1,000

-

-

$10.833

$9.151

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.757

10k+ parts

$9.932

1,000

-

-

$11.757

$9.932

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.449

100+ parts

-

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150

$3.449

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-

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Chip Stock

USA . 6,780 parts In-Stock

1+ parts

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6,780

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Vyrian

USA . 5,680 parts In-Stock

1+ parts

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5,680

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VNN

France . 580 parts In-Stock

1+ parts

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580

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Digiode

USA . 232 parts In-Stock

1+ parts

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232

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Bristol Electronics

USA . 66 parts In-Stock

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66

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.380

100+ parts

-

1k+ parts

$3.245

10k+ parts

-

50

$3.380

-

$3.245

-

Continental Prestige Electronics

USA . 4,116 parts In-Stock

1+ parts

$3.449

100+ parts

-

1k+ parts

-

10k+ parts

$3.380

4,116

$3.449

-

-

$3.380

Argo Parts USA

USA . 3,366 parts In-Stock

1+ parts

$3.449

100+ parts

-

1k+ parts

-

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3,366

$3.449

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Aztec Data Supply Inc.

USA . 3,816 parts In-Stock

1+ parts

$6.101

100+ parts

-

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3,816

$6.101

-

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Ampacity Inc.

Singapore . 940 parts In-Stock

1+ parts

$9.210

100+ parts

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940

$9.210

-

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Semicontronic

India . 940 parts In-Stock

1+ parts

$9.210

100+ parts

$8.980

1k+ parts

$8.934

10k+ parts

-

940

$9.210

$8.980

$8.934

-

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$10.617

100+ parts

-

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244

$10.617

-

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Modulus Dynamics

Lithuania . 390 parts In-Stock

1+ parts

$12.960

100+ parts

$12.442

1k+ parts

$11.923

10k+ parts

-

390

$12.960

$12.442

$11.923

-

AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$19.760

100+ parts

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289

$19.760

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RC Electronics

USA . 8,013 parts In-Stock

1+ parts

-

100+ parts

$3.840

1k+ parts

$3.500

10k+ parts

$3.400

8,013

-

$3.840

$3.500

$3.400

Perfect Parts

USA . 5,016 parts In-Stock

1+ parts

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5,016

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A-Z Elektronik GmbH

Germany . 852 parts In-Stock

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852

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Corphita

USA . 467 parts In-Stock

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467

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Microchip USA

USA . 140 parts In-Stock

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140

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Overview

Experience the next level of performance with the BTM7752GXUMA1 by Infineon Technologies. As a leader in peripheral drivers, Infineon Technologies delivers top-quality products that provide superior protection, reliability, and efficiency. Ideal for a wide range of applications, this innovative device offers built-in protections against transient events, over current, over voltage, thermal issues, and more. With its compact design and high performance capabilities, the BTM7752GXUMA1 is the perfect solution for customers looking to enhance their systems with cutting-edge technology. Elevate your projects with the unmatched value and benefits of this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-term use.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into existing circuitry without the need for additional mounting hardware.

Maximum Supply Voltage: 18 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing versatility.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design that can easily fit into tight spaces within electronic devices.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The multiple built-in protections ensure the safety and longevity of the product and connected devices.

No. of Terminals: 36

The high number of terminals allows for multiple connections and complex circuit configurations, making it suitable for advanced applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design make the product space-efficient, perfect for compact electronic designs.

Minimum Supply Voltage: 8 V

The low minimum supply voltage ensures efficiency and reliability even when operating with lower power sources.

Terminal Finish: TIN

The use of tin terminal finish provides corrosion resistance and excellent conductivity for optimal performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in connection options, suitable for various circuit layouts.

Maximum Seated Height: 2.65 mm

The low seated height allows for a slim profile, enabling the product to be used in applications with space constraints.

Width: 7.6 mm

The compact width makes the product suitable for installations where space is limited, without compromising functionality.

Length: 12.8 mm

The moderate length offers a balance between compactness and ease of connection, making it versatile for different setups.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure connections and simplified installation, enhancing usability.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage provides a stable power source for consistent performance in various operating conditions.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, making the product suitable for applications requiring compact circuit layouts.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates a moderate level of moisture sensitivity, ensuring reliability in diverse environmental conditions.

Nominal Output Peak Current Limit: 12 A

The high nominal output peak current limit enables the product to handle heavy loads with robust performance.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge interface IC type offers efficient control and management of peripheral devices, enhancing overall system functionality.

Output Current Flow Direction: SOURCE AND SINK

The bidirectional output current flow direction provides flexibility in driving both source and sink devices, making the product versatile for various applications.

Technical Specifications

Peripheral Drivers BTM7752GXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

12 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

7.6 mm

Trade Compliance

BTM7752GXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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