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BTM7751GXUMA1

Infineon Technologies

BTM7751GXUMA1 by Infineon Technologies

BTM7751GXUMA1 by Infineon is a 28-terminal peripheral driver with built-in protections for transient, over current, thermal, and under voltage. It operates at supply voltages ranging from 8V to 18V and has a nominal output peak current limit of 22A. This small outline package IC is ideal for applications requiring source and sink output current flow direction.

Median Price

$2.381

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

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$2.381

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39

$2.381

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VNN

France . 9,605 parts In-Stock

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9,605

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Chip Stock

USA . 6,300 parts In-Stock

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6,300

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Vyrian

USA . 2,931 parts In-Stock

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2,931

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Digiode

USA . 117 parts In-Stock

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117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$2.381

100+ parts

$2.262

1k+ parts

$2.149

10k+ parts

$2.119

200

$2.381

$2.262

$2.149

$2.119

Argo Parts USA

USA . 4,350 parts In-Stock

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$2.381

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4,350

$2.381

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Continental Prestige Electronics

USA . 2,188 parts In-Stock

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$2.381

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$2.333

2,188

$2.381

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$2.333

Ampacity Inc.

Singapore . 1,513 parts In-Stock

1+ parts

$2.500

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1,513

$2.500

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Modulus Dynamics

Lithuania . 356 parts In-Stock

1+ parts

$2.950

100+ parts

$2.832

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$2.714

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356

$2.950

$2.832

$2.714

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Corohmni

South Africa . 270 parts In-Stock

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$2.950

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270

$2.950

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Aztec Data Supply Inc.

USA . 5,916 parts In-Stock

1+ parts

$6.530

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$6.530

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AZTECH Wire

Italy . 626 parts In-Stock

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$11.980

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626

$11.980

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Semicontronic

India . 642 parts In-Stock

1+ parts

$38.500

100+ parts

$37.538

1k+ parts

$37.345

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642

$38.500

$37.538

$37.345

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RC Electronics

USA . 9,447 parts In-Stock

1+ parts

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100+ parts

$3.010

1k+ parts

$2.750

10k+ parts

$2.660

9,447

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$3.010

$2.750

$2.660

Microchip USA

USA . 6,579 parts In-Stock

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6,579

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QUARKTWIN TECHNOLOGY LTD

USA . 2,121 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 675 parts In-Stock

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675

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Overview

Enhance your electronic designs with the BTM7751GXUMA1 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality products. This peripheral driver offers built-in protections against transient events, over current, thermal issues, and under voltage situations, ensuring reliable performance. With a wide range of applications and a nominal output peak current limit of 22 A, this product provides exceptional value and benefits to customers seeking dependable solutions for their projects. Experience the advantages of Infineon's expertise in electronics with the BTM7751GXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the peripheral driver suitable for various applications.

Maximum Supply Voltage: 18 V

Higher maximum supply voltage allows for flexibility in power input, accommodating a wide range of operating conditions.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Built-in protections ensure the safety and reliability of the peripheral driver by guarding against potential hazards such as overcurrent and thermal issues.

Nominal Output Peak Current Limit: 22 A

High nominal output peak current limit enables the peripheral driver to handle high-power loads effectively, making it suitable for demanding applications.

Turn-on Time: 180 us

Fast turn-on time ensures quick response and activation of the peripheral driver, enhancing overall system performance.

Technical Specifications

Peripheral Drivers BTM7751GXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

22 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

180 us

Turn-on Time:

180 us

Width:

7.6 mm

Trade Compliance

BTM7751GXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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