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NCV8401BDTRKG

Onsemi

NCV8401BDTRKG by Onsemi

NCV8401BDTRKG by Onsemi is a peripheral driver with built-in protections for transient, over current, over voltage, and thermal conditions. It has a small outline package style with a max seated height of 2.51 mm and dimensions of 6.095 mm (W) x 6.54 mm (L). This IC type is commonly used as a buffer or inverter based peripheral driver for applications requiring sink output current flow direction.

Median Price

$1.098

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 16,516 parts In-Stock

1+ parts

$1.480

100+ parts

$0.871

1k+ parts

$0.777

10k+ parts

-

16,516

$1.480

$0.871

$0.777

-

Mouser Electronics

USA . 1,396 parts In-Stock

1+ parts

$1.480

100+ parts

$0.871

1k+ parts

$0.735

10k+ parts

-

1,396

$1.480

$0.871

$0.735

-

Avnet

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65,000

-

-

-

-

Future Electronics

Canada . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.635

12,500

-

-

-

$0.635

Master Electronics

USA . 5,625 parts In-Stock

1+ parts

-

100+ parts

$0.933

1k+ parts

$0.640

10k+ parts

$0.616

5,625

-

$0.933

$0.640

$0.616

Verical

USA . 5,625 parts In-Stock

1+ parts

-

100+ parts

$1.098

1k+ parts

$0.753

10k+ parts

$0.746

5,625

-

$1.098

$0.753

$0.746

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.764

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.764

-

-

-

Digiode

USA . 1,446 parts In-Stock

1+ parts

$1.653

100+ parts

-

1k+ parts

-

10k+ parts

-

1,446

$1.653

-

-

-

Vyrian

USA . 33,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,371

-

-

-

-

Bristol Electronics

USA . 17,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,500

-

-

-

-

NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.180

10,000

-

-

-

$1.180

Chip Stock

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

IBS Electronics

USA . 5,625 parts In-Stock

1+ parts

-

100+ parts

$1.401

1k+ parts

$0.972

10k+ parts

$0.923

5,625

-

$1.401

$0.972

$0.923

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$0.530

-

-

-

Argo Parts USA

USA . 2,497 parts In-Stock

1+ parts

$0.764

100+ parts

-

1k+ parts

-

10k+ parts

-

2,497

$0.764

-

-

-

Continental Prestige Electronics

USA . 2,133 parts In-Stock

1+ parts

$0.764

100+ parts

-

1k+ parts

-

10k+ parts

$0.749

2,133

$0.764

-

-

$0.749

Vigor

Singapore . 946 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$1.400

-

-

-

Ampacity Inc.

Singapore . 33,703 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

33,703

$1.480

-

-

-

Semicontronic

India . 8,390 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

10k+ parts

-

8,390

$1.480

$1.443

$1.436

-

Corphita

USA . 1,504 parts In-Stock

1+ parts

$1.566

100+ parts

-

1k+ parts

-

10k+ parts

-

1,504

$1.566

-

-

-

Microchip USA

USA . 5,344 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

-

10k+ parts

-

5,344

$4.630

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$8.492

100+ parts

$8.068

1k+ parts

$8.068

10k+ parts

-

1,000

$8.492

$8.068

$8.068

-

Aztec Data Supply Inc.

USA . 1,822 parts In-Stock

1+ parts

$11.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,822

$11.850

-

-

-

RC Electronics

USA . 82,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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82,899

-

-

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Perfect Parts

USA . 46,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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46,641

-

-

-

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Infinite Electronics LLP (Excess)

. 17,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,670

-

-

-

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Lixinc

USA . 15,802 parts In-Stock

1+ parts

-

100+ parts

-

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15,802

-

-

-

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Problanco Electronics

Mexico . 7,253 parts In-Stock

1+ parts

-

100+ parts

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7,253

-

-

-

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Kulean Microsystems

USA . 6,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,855

-

-

-

-

TANS Electronics

Latvia . 3,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,726

-

-

-

-

Kepictronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,500

-

-

-

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Formix International (Excess)

India . 1,206 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,206

-

-

-

-

Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

UHIMA Technologies

Türkiye . 466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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466

-

-

-

-

SupplyDigital Components

Austria . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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185

-

-

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Overview

Discover the NCV8401BDTRKG by Onsemi, a high-quality peripheral driver that offers unmatched performance and reliability. As a leading manufacturer in the industry, Onsemi ensures top-notch craftsmanship and cutting-edge technology for all their products. The NCV8401BDTRKG is perfect for applications requiring precise control and protection against transient events, over current, over voltage, and thermal conditions. With its compact design and advanced features, this product delivers exceptional value, benefits, and advantages to customers. Experience the difference with Onsemi and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and resistance to damage, making it a reliable choice for long-term use.

Surface Mount: YES

With surface mount capability, this peripheral driver can be easily mounted on circuit boards, enhancing ease of installation and integration.

No. of Functions: 1

Featuring a single function, this peripheral driver simplifies circuit design and reduces complexity, providing efficient performance and ease of use.

Screening Level: AEC-Q101

With an AEC-Q101 screening level, this product adheres to automotive industry standards, ensuring high-quality and reliable performance in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape of this peripheral driver allows for efficient placement and utilization of space on a circuit board, optimizing overall system layout.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Equipped with built-in protections against transient voltage, over current, over voltage, and thermal issues, this peripheral driver offers enhanced safety and protection for connected devices.

No. of Terminals: 2

With just two terminals, this peripheral driver simplifies installation and reduces the likelihood of wiring errors, ensuring a straightforward and reliable connection.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug design enables efficient heat dissipation, preventing overheating and ensuring optimal performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin annealed terminal finish on this peripheral driver ensures excellent conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: SINGLE

Featuring a single terminal position, this peripheral driver simplifies the connection process, reducing complexity and enhancing overall usability.

Maximum Seated Height: 2.51 mm

With a maximum seated height of 2.51 mm, this peripheral driver offers a compact form factor, making it suitable for applications with limited space constraints.

Width: 6.095 mm

The compact width of 6.095 mm allows for efficient utilization of space in circuit designs, facilitating compact and streamlined system layouts.

Maximum Time At Peak Reflow Temperature (s): 30

This product can endure a maximum time of 30 seconds at the peak reflow temperature, ensuring stable operation during soldering processes for smooth assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this peripheral driver can withstand high-temperature soldering processes, ensuring robust and reliable solder joints.

Length: 6.54 mm

The length of 6.54 mm offers a compact size for this peripheral driver, facilitating easy integration into various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides reliable electrical connections and simplifies soldering processes, ensuring secure and stable connections.

Terminal Pitch: 2.29 mm

With a terminal pitch of 2.29 mm, this peripheral driver facilitates easy and precise component placement on circuit boards, enhancing overall manufacturing efficiency.

Moisture Sensitivity Level (MSL): 1

With an MSL rating of 1, this peripheral driver has minimal moisture sensitivity, ensuring its reliable performance and long-term durability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver belongs to the interface IC type, specifically buffer or inverter based, providing versatile compatibility and adapting to various application requirements.

Output Current Flow Direction: SINK

The output current flow direction of sink ensures efficient power transmission and compatibility with devices that require a sink configuration, making it an ideal choice in specific circuit designs.

Technical Specifications

Peripheral Drivers NCV8401BDTRKG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q101

Maximum Seated Height:

2.51 mm

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.095 mm

Trade Compliance

NCV8401BDTRKG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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