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NCV8408BDTRKG

Onsemi

NCV8408BDTRKG by Onsemi

NCV8408BDTRKG by Onsemi is a small outline peripheral driver with built-in protections against transient, over current, and over voltage. It has a nominal output peak current limit of 13A and turn-on time of 20us. Ideal for applications requiring buffer or inverter based interface ICs in automotive electronics.

Median Price

$1.115

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 23,919 parts In-Stock

1+ parts

$0.990

100+ parts

$0.568

1k+ parts

$0.491

10k+ parts

$0.459

23,919

$0.990

$0.568

$0.491

$0.459

DigiKey

USA . 16,180 parts In-Stock

1+ parts

$0.990

100+ parts

$0.568

1k+ parts

$0.491

10k+ parts

$0.454

16,180

$0.990

$0.568

$0.491

$0.454

Newark

USA . 7,721 parts In-Stock

1+ parts

$1.020

100+ parts

$0.624

1k+ parts

-

10k+ parts

-

7,721

$1.020

$0.624

-

-

Farnell

UK . 8,630 parts In-Stock

1+ parts

$1.210

100+ parts

$0.526

1k+ parts

$0.475

10k+ parts

-

8,630

$1.210

$0.526

$0.475

-

Element14

Singapore . 7,773 parts In-Stock

1+ parts

$1.440

100+ parts

$0.769

1k+ parts

$0.684

10k+ parts

$0.647

7,773

$1.440

$0.769

$0.684

$0.647

Chip1Stop

Japan . 33 parts In-Stock

1+ parts

$4.280

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$4.280

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$0.508

-

-

-

Digiode

USA . 1,210 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

-

1,210

$1.083

-

-

-

Flip Electronics

USA . 362,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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362,500

-

-

-

-

Chip Stock

USA . 28,500 parts In-Stock

1+ parts

-

100+ parts

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28,500

-

-

-

-

IBS Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.481

15,000

-

-

-

$0.481

NAC Semi

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.633

12,500

-

-

-

$0.633

Vyrian

USA . 6,205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,205

-

-

-

-

TME

Poland . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.563

5,000

-

-

-

$0.563

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,648 parts In-Stock

1+ parts

$0.366

100+ parts

$0.357

1k+ parts

$0.355

10k+ parts

-

6,648

$0.366

$0.357

$0.355

-

Ampacity Inc.

Singapore . 6,264 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

-

10k+ parts

-

6,264

$0.366

-

-

-

Corohmni

South Africa . 293 parts In-Stock

1+ parts

$0.431

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$0.431

-

-

-

Continental Prestige Electronics

USA . 1,007 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

$0.498

1,007

$0.508

-

-

$0.498

Argo Parts USA

USA . 510 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

$0.493

510

$0.508

-

-

$0.493

Corphita

USA . 441 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

441

$1.026

-

-

-

Vigor

Singapore . 175 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

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175

$1.120

-

-

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Microchip USA

USA . 4,013 parts In-Stock

1+ parts

$3.079

100+ parts

-

1k+ parts

-

10k+ parts

-

4,013

$3.079

-

-

-

Aztec Data Supply Inc.

USA . 3,913 parts In-Stock

1+ parts

$3.350

100+ parts

-

1k+ parts

-

10k+ parts

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3,913

$3.350

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-

RC Electronics

USA . 73,434 parts In-Stock

1+ parts

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73,434

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Infinite Electronics LLP (Excess)

. 30,005 parts In-Stock

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30,005

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Lixinc

USA . 11,888 parts In-Stock

1+ parts

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11,888

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SupplyDigital Components

Austria . 7,770 parts In-Stock

1+ parts

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7,770

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Kulean Microsystems

USA . 7,377 parts In-Stock

1+ parts

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100+ parts

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7,377

-

-

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Problanco Electronics

Mexico . 2,389 parts In-Stock

1+ parts

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100+ parts

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2,389

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-

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TANS Electronics

Latvia . 1,416 parts In-Stock

1+ parts

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1,416

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UHIMA Technologies

Türkiye . 682 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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682

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.498

1k+ parts

$0.483

10k+ parts

$0.473

100

-

$0.498

$0.483

$0.473

Overview

Enhance the performance and reliability of your electronic systems with the NCV8408BDTRKG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality peripheral drivers that offer built-in protections against transient events, over current, over voltage, and thermal issues. Ideal for a wide range of applications, this product provides customers with peace of mind knowing their devices are safeguarded. With its compact design and advanced features, the NCV8408BDTRKG offers exceptional value, efficiency, and functionality, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures long-lasting performance and reliability.

Surface Mount: YES

The surface mount design allows for easy integration into PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and efficient design for easy installation.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections offer comprehensive safety features, protecting both the device and the connected components.

No. of Terminals: 2

The minimal number of terminals simplifies installation and reduces the risk of wiring errors.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with heat sink/slug design allows for efficient heat dissipation, ensuring optimal performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a reliable and durable connection, ensuring consistent performance over time.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces complexity in circuit design.

Maximum Seated Height: 2.38 mm

The low maximum seated height allows for compact and space-saving installation in tight spaces.

Width: 6.095 mm

The compact width makes it suitable for applications with limited space availability.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable performance in harsh operating conditions.

Length: 6.54 mm

The moderate length provides a balance between space-saving installation and ease of handling.

Terminal Form: GULL WING

The gull wing terminal form offers a reliable and secure connection, reducing the risk of signal loss or disconnection.

Turn-on Time: 20 us

The quick turn-on time ensures rapid response and efficient operation in dynamic applications.

Terminal Pitch: 2.29 mm

The suitable terminal pitch allows for easy integration into standard PCB layouts, simplifying assembly.

Nominal Output Peak Current Limit: 13 A

The high nominal output peak current limit provides ample power handling capacity for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The versatile interface IC type offers flexibility in usage across a variety of applications, making it a versatile choice.

Turn-off Time: 60 us

The moderate turn-off time ensures smooth operation and reliable performance in dynamic switching applications.

Output Current Flow Direction: SINK

The output current flow direction is optimized for sink applications, providing efficient power distribution and control.

Technical Specifications

Peripheral Drivers NCV8408BDTRKG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

13 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.38 mm

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

60 us

Turn-on Time:

20 us

Width:

6.095 mm

Trade Compliance

NCV8408BDTRKG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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