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IR25600SPBF

Infineon Technologies

IR25600SPBF by Infineon Technologies

IR25600SPBF by Infineon is a CMOS half bridge peripheral driver with 8 terminals, operating at -40 to 125 °C. It has a supply voltage of 15V and is designed for automotive applications due to its moisture sensitivity level of 2.

Median Price

$1.465

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.465

100+ parts

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10

$1.465

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Digiode

USA . 805 parts In-Stock

1+ parts

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805

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Vyrian

USA . 380 parts In-Stock

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380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.436

100+ parts

-

1k+ parts

$1.378

10k+ parts

-

500

$1.436

-

$1.378

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Continental Prestige Electronics

USA . 6,195 parts In-Stock

1+ parts

$1.465

100+ parts

-

1k+ parts

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10k+ parts

$1.436

6,195

$1.465

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$1.436

Argo Parts USA

USA . 2,440 parts In-Stock

1+ parts

$1.465

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2,440

$1.465

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Aztec Data Supply Inc.

USA . 2,774 parts In-Stock

1+ parts

$6.050

100+ parts

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2,774

$6.050

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$7.092

100+ parts

$6.737

1k+ parts

$6.737

10k+ parts

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59

$7.092

$6.737

$6.737

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Corohmni

South Africa . 67 parts In-Stock

1+ parts

$9.692

100+ parts

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67

$9.692

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$9.860

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398

$9.860

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Modulus Dynamics

Lithuania . 4,524 parts In-Stock

1+ parts

$11.674

100+ parts

$11.207

1k+ parts

$10.740

10k+ parts

-

4,524

$11.674

$11.207

$10.740

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Ampacity Inc.

Singapore . 434 parts In-Stock

1+ parts

$12.500

100+ parts

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434

$12.500

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Semicontronic

India . 612 parts In-Stock

1+ parts

$14.500

100+ parts

$14.138

1k+ parts

$14.065

10k+ parts

-

612

$14.500

$14.138

$14.065

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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Corphita

USA . 787 parts In-Stock

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787

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Microchip USA

USA . 127 parts In-Stock

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127

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Overview

Power up your automotive applications with the IR25600SPBF by Infineon Technologies. Designed with the highest quality materials and cutting-edge technology, this half bridge based peripheral driver offers unparalleled reliability and performance. Its compact design and wide operating temperature range make it ideal for a variety of automotive systems. Say goodbye to downtime and hello to seamless operation with the IR25600SPBF - the perfect choice for all your driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring long-term reliability and portability for the product.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving time and effort during assembly.

Power Supplies (V): 15

Suitable power supply voltage for the peripheral driver, ensuring optimal performance and compatibility with other components.

Temperature Grade: AUTOMOTIVE

Designed to withstand a wide range of operating temperatures, making it ideal for automotive applications where temperature fluctuation is common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the peripheral driver.

Technical Specifications

Peripheral Drivers IR25600SPBF attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

15

Qualification:

Not Qualified

Sub-Category:

MOSFET Drivers

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

IR25600SPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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