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ULN2004ANSRG4

Texas Instruments

ULN2004ANSRG4 by Texas Instruments

ULN2004ANSRG4 by Texas Instruments is a 7-bit buffer/inverter-based peripheral driver with open-collector output. It operates b/w -20°C to 70°C, has a max supply voltage of 8V, and built-in transient protection. Ideal for applications requiring sink current flow direction in compact designs due to its small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,684 parts In-Stock

1+ parts

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7,684

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Digiode

USA . 3,076 parts In-Stock

1+ parts

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3,076

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Nova Conductors

Japan . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,694 parts In-Stock

1+ parts

$1.746

100+ parts

-

1k+ parts

$2.322

10k+ parts

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1,694

$1.746

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$2.322

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DigiPath Technology Company

USA . 1,586 parts In-Stock

1+ parts

$1.923

100+ parts

$1.769

1k+ parts

-

10k+ parts

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1,586

$1.923

$1.769

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ChromeModa Solutions

Germany . 3,795 parts In-Stock

1+ parts

$1.962

100+ parts

$1.609

1k+ parts

-

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3,795

$1.962

$1.609

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IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$1.962

100+ parts

-

1k+ parts

$1.766

10k+ parts

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1,669

$1.962

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$1.766

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AZTECH Wire

Italy . 334 parts In-Stock

1+ parts

$12.152

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334

$12.152

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Corohmni

South Africa . 764 parts In-Stock

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$12.626

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764

$12.626

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One Stop Electronics

USA . 726 parts In-Stock

1+ parts

$18.500

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726

$18.500

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Ampacity Inc.

Singapore . 848 parts In-Stock

1+ parts

$23.500

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848

$23.500

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Semicontronic

India . 706 parts In-Stock

1+ parts

$33.500

100+ parts

$32.662

1k+ parts

$32.495

10k+ parts

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706

$33.500

$32.662

$32.495

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Continental Prestige Electronics

USA . 2,564 parts In-Stock

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2,564

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Argo Parts USA

USA . 2,548 parts In-Stock

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2,548

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Corphita

USA . 790 parts In-Stock

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790

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Advanced Electronics

New Zealand . 550 parts In-Stock

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550

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Enhance the power and precision of your electronic projects with the ULN2004ANSRG4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments brings unparalleled quality and reliability to the table. This peripheral driver is essential for controlling a wide range of devices, providing superior protection against transients while ensuring seamless operation. With its compact size and advanced features, this product offers unmatched value and benefits to customers looking to elevate their designs to the next level. Trust Texas Instruments to deliver cutting-edge technology that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 8 V

The ability to handle a maximum supply voltage of 8V makes this peripheral driver versatile and suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board.

Built-in Protections: TRANSIENT

The built-in transient protection ensures that the peripheral driver is safeguarded against electrical spikes, enhancing reliability and longevity.

No. of Terminals: 16

Having 16 terminals allows for easy and efficient connectivity with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this peripheral driver can withstand high temperature environments without sacrificing performance.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for flexibility in connecting to other components, enhancing compatibility and versatility.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20°C enables this peripheral driver to function effectively even in cold environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and enhances reliability in the connection with other components.

Maximum Seated Height: 2 mm

With a maximum seated height of 2 mm, this peripheral driver is compact and suitable for slim electronic devices.

Width: 5.3 mm

The narrow width of 5.3 mm allows for efficient use of space on the circuit board.

Length: 10.2 mm

The length of 10.2 mm is suitable for compact electronic devices where space is limited.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connection to the circuit board.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides precise spacing for terminals, ensuring reliable connectivity.

Driver No. of Bits: 7

With 7 bits, this peripheral driver can control multiple components or signals with high accuracy and flexibility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type allows for versatile and customizable operation based on the specific requirements of the application.

Output Current Flow Direction: SINK

The sink output current flow direction is suitable for driving external loads such as LEDs or relays, making it highly versatile in various applications.

Technical Specifications

Peripheral Drivers ULN2004ANSRG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

7

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

ULN2004ANSRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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