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BTT62004EMAXUMA1

Infineon Technologies

BTT62004EMAXUMA1 by Infineon Technologies

BTT62004EMAXUMA1 by Infineon Technologies is a peripheral driver with built-in protections for transient, over current, and over voltage. It operates at a nominal voltage of 28V and has a max supply voltage of 36V. This rectangular package style device is ideal for applications requiring sink output current flow direction in automotive electronics.

Median Price

$2.193

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,494 parts In-Stock

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Nova Conductors

Japan . 25 parts In-Stock

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$3.086

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Chip Stock

USA . 6,737 parts In-Stock

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Vyrian

USA . 4,932 parts In-Stock

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VNN

France . 1,635 parts In-Stock

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Digiode

USA . 378 parts In-Stock

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Bristol Electronics

USA . 56 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 483 parts In-Stock

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$2.678

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483

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Continental Prestige Electronics

USA . 5,354 parts In-Stock

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$3.086

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$3.024

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Argo Parts USA

USA . 3,216 parts In-Stock

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$3.086

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$3.086

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Bastille Electronics

Australia . 15 parts In-Stock

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$3.086

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$2.932

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$2.785

10k+ parts

$2.747

15

$3.086

$2.932

$2.785

$2.747

AZTECH Wire

Italy . 224 parts In-Stock

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$10.072

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Advanced Electronics

New Zealand . 23 parts In-Stock

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$10.266

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$9.753

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$9.753

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23

$10.266

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$9.753

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Modulus Dynamics

Lithuania . 3,660 parts In-Stock

1+ parts

$10.935

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$10.498

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$10.060

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$10.935

$10.498

$10.060

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Aztec Data Supply Inc.

USA . 1,801 parts In-Stock

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$12.200

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Semicontronic

India . 715 parts In-Stock

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$45.500

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$44.362

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$44.135

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715

$45.500

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Ampacity Inc.

Singapore . 456 parts In-Stock

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$46.500

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Component Stockers USA

USA . 455 parts In-Stock

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$99.990

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Perfect Parts

USA . 11,200 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 733 parts In-Stock

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Futuretech Components

Singapore . 342 parts In-Stock

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Microchip USA

USA . 325 parts In-Stock

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Overview

Upgrade your driving experience with the BTT62004EMAXUMA1 by Infineon Technologies. Designed with superior quality and built-in protections for transient, over current, over voltage, thermal, and under voltage, this peripheral driver ensures optimal performance and reliability. Ideal for a wide range of applications, this product offers a maximum supply voltage of 36V and a nominal output peak current limit of 1A. Trust in Infineon Technologies to deliver cutting-edge solutions that enhance your projects with efficiency and precision. Elevate your creations with the BTT62004EMAXUMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to impact, making this peripheral driver suitable for rugged environments.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and making the product more efficient.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power requirements, making it versatile for various applications.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the peripheral driver meets automotive industry standards for reliability and quality.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and longevity of the peripheral driver, protecting it from damage due to various electrical faults.

No. of Terminals: 24

Having 24 terminals allows for connectivity with multiple components, enhancing the functionality of the peripheral driver.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The compact package style with heat sink/slug design and low profile makes the peripheral driver space-efficient and easy to integrate into electronic systems.

Minimum Supply Voltage: 8 V

The low minimum supply voltage requirement allows for flexibility in operating conditions, ensuring compatibility with a wide range of power sources.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable connections for efficient performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in wiring configurations, allowing for versatile connectivity options in different circuit setups.

Maximum Seated Height: 1.7 mm

The low maximum seated height enables a compact and streamlined design, making the peripheral driver suitable for space-constrained applications.

Width: 3.9 mm

The narrow width of the peripheral driver contributes to its compact form factor and easy integration into electronic systems with limited space.

Length: 8.65 mm

The moderate length of the peripheral driver provides a balanced size for installation on circuit boards, ensuring compatibility with diverse system layouts.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and reliability, ensuring stable connections for seamless operation of the peripheral driver.

Nominal Supply Voltage: 28 V

The nominal supply voltage of 28 V offers a standard operating level that is commonly used in electronic systems, ensuring compatibility with existing setups.

Turn-on Time: 150 us

Fast turn-on time of 150 us enables quick response and activation of the peripheral driver, contributing to efficient and reliable performance.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense packing of terminals on the peripheral driver, maximizing connectivity in a limited space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, making the peripheral driver suitable for indoor or controlled-environment applications.

Nominal Output Peak Current Limit: 1 A

The 1 A peak current limit ensures safe operation within the specified output range, protecting the peripheral driver from potential damage due to excessive current flow.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver offers versatility in signal processing and control, making it adaptable to different input/output requirements.

Turn-off Time: 150 us

Fast turn-off time of 150 us ensures quick deactivation of the peripheral driver, enhancing control and responsiveness in dynamic applications.

Output Current Flow Direction: SINK

Sink output current flow direction allows the peripheral driver to control and regulate current flow from external devices, ensuring safe and efficient operation.

Technical Specifications

Peripheral Drivers BTT62004EMAXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

28 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

150 us

Turn-on Time:

150 us

Width:

3.9 mm

Trade Compliance

BTT62004EMAXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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