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PTPS22919DCKR

Texas Instruments

PTPS22919DCKR by Texas Instruments

PTPS22919DCKR by Texas Instruments is a 6-terminal peripheral driver with built-in transient, over current, and thermal protections. It operates in industrial temperature range (-40 to 105°C) and has a nominal output peak current limit of 3A. Ideal for applications requiring sink output current flow direction in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,486 parts In-Stock

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Digiode

USA . 1,652 parts In-Stock

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1,652

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,037 parts In-Stock

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$2.500

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-

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1,037

$2.500

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Parana Technologies

USA . 1,510 parts In-Stock

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$4.655

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$5.134

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$4.655

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ChromeModa Solutions

Germany . 3,647 parts In-Stock

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$5.230

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$4.289

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$5.230

$4.289

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IDEA Electronic Components Group

UK . 510 parts In-Stock

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$5.230

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$4.707

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510

$5.230

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$4.707

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Corohmni

South Africa . 980 parts In-Stock

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$9.068

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980

$9.068

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$9.362

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$8.894

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$8.894

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$9.362

$8.894

$8.894

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One Stop Electronics

USA . 656 parts In-Stock

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$9.500

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$9.500

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AZTECH Wire

Italy . 274 parts In-Stock

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$15.746

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Semicontronic

India . 917 parts In-Stock

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$29.500

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$28.762

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$28.615

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917

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$28.615

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Continental Prestige Electronics

USA . 5,269 parts In-Stock

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Argo Parts USA

USA . 2,587 parts In-Stock

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Corphita

USA . 2,367 parts In-Stock

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DigiPath Technology Company

USA . 1,588 parts In-Stock

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$4.715

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$4.715

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Modulus Dynamics

Lithuania . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 100 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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Lucentia Tech

USA . 30 parts In-Stock

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$0.692

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$0.692

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$0.692

30

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$0.692

$0.692

$0.692

Overview

Enhance your electronic designs with the high-quality PTPS22919DCKR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees reliability and precision in every product. The PTPS22919DCKR falls under the Peripheral Drivers category, offering built-in protections against transient, overcurrent, and thermal issues. With its small outline and dual terminal position design, this product is perfect for a wide range of applications. Experience the value and benefits this peripheral driver brings to your projects, providing a seamless and efficient operation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and good mechanical properties, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections ensure the safety of the device and connected components by guarding against transient events, overcurrent situations, and thermal issues.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this peripheral driver can operate in harsh environmental conditions, making it suitable for industrial applications.

Nominal Output Peak Current Limit: 3 A

The 3 A peak current limit allows for handling high current loads, providing flexibility in driving peripheral devices.

Output Current Flow Direction: SINK

The sink output current flow direction is suitable for driving components that require sinking current, enhancing compatibility with various peripherals.

Technical Specifications

Peripheral Drivers PTPS22919DCKR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

PTPS22919DCKR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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