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BTS442E2E3062AXT

Infineon Technologies

BTS442E2E3062AXT by Infineon Technologies

BTS442E2E3062AXT by Infineon Technologies is a peripheral driver with a max supply voltage of 42V. It offers built-in protections for transient, over current, over voltage, thermal, and under voltage conditions. This MOS technology-based device has a nominal output peak current limit of 70A and is commonly used as a buffer or inverter based peripheral driver.

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6

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1k+

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Avnet

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Chip Stock

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VNN

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 755 parts In-Stock

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$2.530

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$2.429

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$2.328

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Semicontronic

India . 365 parts In-Stock

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$6.500

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$6.338

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$6.305

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Aztec Data Supply Inc.

USA . 3,286 parts In-Stock

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$10.728

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Corohmni

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AZTECH Wire

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Continental Prestige Electronics

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Lucentia Tech

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Bastille Electronics

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Overview

Unlock the power of seamless connectivity with the BTS442E2E3062AXT by Infineon Technologies, a leading name in high-quality electronic solutions. As a peripheral driver, this compact and versatile device revolutionizes the way you control your systems. With built-in protections against transients, over current, over voltage, thermal issues, and under voltage, it ensures reliable and safe operation. Its small outline package and single terminal position enable easy integration into any design. Benefit from its impressive 70A nominal output peak current limit and lightning-fast turn-on and turn-off times, providing optimal performance and efficiency. Discover endless possibilities for your applications with the BTS442E2E3062AXT – the ultimate choice for today's technology-driven world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the peripheral driver, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, making it suitable for compact and space-constrained environments.

Maximum Supply Voltage: 42 V

With a high maximum supply voltage, this peripheral driver is capable of handling a wide range of power sources, providing versatility and compatibility in different scenarios.

No. of Functions: 1

The single function design simplifies usage and integration, making it convenient for users.

Package Shape: RECTANGULAR

The rectangular package shape enables easy mounting and placement onto PCBs, optimizing space utilization and facilitating efficient circuit board design.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The peripheral driver's built-in protections against various faults and abnormalities ensure safety and reliability, protecting both the driver itself and connected devices from potential damage.

No. of Terminals: 4

With four terminals, this peripheral driver offers easy connectivity and compatibility with other components in the system, enhancing ease of use and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the peripheral driver compact and space-saving, suitable for applications with limited available space.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows the peripheral driver to function efficiently even with lower power sources, providing flexibility in power supply options.

Terminal Position: SINGLE

The single terminal position simplifies wiring and installation, ensuring easy and hassle-free connectivity.

Maximum Seated Height: 4.5 mm

The low maximum seated height enables the peripheral driver to be used in applications with limited vertical space, increasing versatility in design options.

Width: 9.2 mm

With a narrow width, this peripheral driver can be easily accommodated in compact systems, optimizing space efficiency and allowing for streamlined device design.

Length: 9.9 mm

The compact length of the peripheral driver further enhances its suitability for applications with limited space, contributing to efficient PCB layout and design.

Technology: MOS

Utilizing MOS technology, this peripheral driver offers high performance, low power consumption, and fast switching speeds, making it an excellent choice for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable soldering connections during PCB assembly, enhancing the peripheral driver's durability and reliability.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12 V indicates the standard operating voltage for this peripheral driver, making it compatible with common power sources and systems.

Turn-on Time: 350 us

The fast turn-on time ensures quick and efficient response, minimizing delays and improving overall system performance.

Terminal Pitch: 1.7 mm

The tightly spaced terminal pitch allows for efficient placement on PCBs, maximizing connectivity options and enabling compact circuit designs.

Nominal Output Peak Current Limit: 70 A

With a high nominal output peak current limit, this peripheral driver can handle demanding loads, making it suitable for applications that require high current capabilities.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter interface IC type provides flexibility and compatibility with various system configurations, offering versatility in signal processing and control.

Turn-off Time: 130 us

The fast turn-off time ensures quick and efficient switching, reducing power loss and enhancing system efficiency.

Output Current Flow Direction: SOURCE

The output current flow direction as a source allows the peripheral driver to act as a current provider, offering compatibility with various types of electronic devices and circuits.

Technical Specifications

Peripheral Drivers BTS442E2E3062AXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G4

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

70 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

130 us

Turn-on Time:

350 us

Width:

9.2 mm

Trade Compliance

BTS442E2E3062AXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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