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BTS432E2E3043

Infineon Technologies

BTS432E2E3043 by Infineon Technologies

BTS432E2E3043 by Infineon is a MOS technology peripheral driver with 5 terminals and built-in protections. It operates at supply voltages ranging from 4.5V to 42V, offering a nominal output peak current limit of 44A. This rectangular package is ideal for applications requiring source output current flow direction and fast turn-on/off times.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Cyclops Electronics Ltd

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Modulus Dynamics

Lithuania . 515 parts In-Stock

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$4.227

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$4.058

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$3.889

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Corohmni

South Africa . 15 parts In-Stock

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$6.444

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$11.700

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Aztec Data Supply Inc.

USA . 2,950 parts In-Stock

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$12.740

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AZTECH Wire

Italy . 502 parts In-Stock

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Semicontronic

India . 1,443 parts In-Stock

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Ampacity Inc.

Singapore . 1,167 parts In-Stock

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Overview

Experience superior performance and reliability with the BTS432E2E3043 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers high-quality peripheral drivers that provide essential protections such as transient, over current, over voltage, thermal, and under voltage safeguards. This versatile product is ideal for a wide range of applications, offering customers peace of mind with its robust built-in features. Elevate your projects with the BTS432E2E3043 and enjoy seamless operation and enhanced efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the peripheral driver.

Maximum Supply Voltage: 42 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of voltage inputs, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The multiple built-in protections enhance the safety and longevity of the connected devices.

Power Supplies (V): 4.5/42

The wide range of power supplies supported accommodates different voltage requirements of peripherals.

No. of Terminals: 5

The 5 terminals provide sufficient connectivity options for a variety of devices.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting in different applications.

Minimum Supply Voltage: 4.5 V

Even with a low minimum supply voltage, this peripheral driver maintains stable operations.

Terminal Position: SINGLE

The single terminal position simplifies installation and setup of the peripheral driver.

Technology: MOS

The MOS technology ensures high performance and efficiency in driving peripherals.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers robust connections for reliable performance.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V suits many standard electronic devices, making this peripheral driver compatible with a wide range of applications.

Turn-on Time: 300 us

The quick turn-on time enables fast activation of connected peripherals.

Terminal Pitch: 1.7 mm

The compact terminal pitch allows for close spacing of terminals in limited space applications.

Nominal Output Peak Current Limit: 44 A

The high output peak current limit ensures the peripheral driver can handle high-power peripherals effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type provides flexibility in connecting various devices to the peripheral driver.

Turn-off Time: 80 us

The fast turn-off time allows for efficient disconnection of peripherals when needed.

Output Current Flow Direction: SOURCE

The output current flow direction being source ensures proper current delivery to connected peripherals.

Technical Specifications

Peripheral Drivers BTS432E2E3043 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSFM-T5

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

44 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP5,.1,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

4.5/42

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

80 us

Turn-on Time:

300 us

Trade Compliance

BTS432E2E3043 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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