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BSP452XT

Infineon Technologies

BSP452XT by Infineon Technologies

BSP452XT by Infineon Technologies is a MOS technology peripheral driver with built-in protections for over current, over voltage, and under voltage. It operates at a nominal voltage of 13.5 V and has a max supply voltage of 34 V. With a turn-on time of 100 us and turn-off time of 150 us, it is ideal for applications requiring sink output current flow direction in compact designs.

Median Price

$0.985

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 12,000 parts In-Stock

1+ parts

-

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$0.985

12,000

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$0.985

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,977 parts In-Stock

1+ parts

-

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11,977

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VNN

France . 514 parts In-Stock

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514

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Digiode

USA . 499 parts In-Stock

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-

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499

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Nova Conductors

Japan . 30 parts In-Stock

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30

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Distributors (Availability)

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Semicontronic

India . 11,937 parts In-Stock

1+ parts

$0.840

100+ parts

$0.819

1k+ parts

$0.815

10k+ parts

-

11,937

$0.840

$0.819

$0.815

-

Ampacity Inc.

Singapore . 11,544 parts In-Stock

1+ parts

$0.840

100+ parts

-

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-

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11,544

$0.840

-

-

-

Modulus Dynamics

Lithuania . 2,798 parts In-Stock

1+ parts

$3.270

100+ parts

$3.139

1k+ parts

$3.008

10k+ parts

-

2,798

$3.270

$3.139

$3.008

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Aztec Data Supply Inc.

USA . 1,853 parts In-Stock

1+ parts

$6.874

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1,853

$6.874

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$9.954

100+ parts

$9.456

1k+ parts

$9.456

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20

$9.954

$9.456

$9.456

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Corohmni

South Africa . 1,233 parts In-Stock

1+ parts

$11.376

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1,233

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Continental Prestige Electronics

USA . 5,278 parts In-Stock

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5,278

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Argo Parts USA

USA . 2,633 parts In-Stock

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Corphita

USA . 288 parts In-Stock

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288

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Robosynatics

Brazil . 100 parts In-Stock

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100+ parts

$10.290

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$10.290

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$10.290

100

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$10.290

$10.290

$10.290

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$10.290

1k+ parts

$10.290

10k+ parts

$10.290

100

-

$10.290

$10.290

$10.290

Overview

Experience the superior quality and reliability of Infineon Technologies with the BSP452XT Peripheral Driver. This versatile component offers built-in protections against over current, over voltage, under voltage, and transient events, making it ideal for a wide range of applications. With a compact design and high-performance MOS technology, this product provides quick turn-on and turn-off times to enhance efficiency. Trust in the value and benefits that Infineon brings to your projects with the BSP452XT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing overall system size.

Maximum Supply Voltage: 34 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing versatility.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE; TRANSIENT

The built-in protections ensure the safety and reliability of connected devices by preventing damage from various electrical faults or fluctuations.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting to other components and peripherals in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting, making it suitable for compact designs.

Minimum Supply Voltage: 5 V

The low minimum supply voltage enables operation with a wide range of power sources, increasing compatibility.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connection to the circuit board, ensuring stable operation.

Maximum Seated Height: 1.8 mm

The low seated height facilitates a compact overall design, especially important in applications with limited space constraints.

Width: 3.5 mm

The narrow width helps in saving space on the circuit board, enabling efficient layout and reducing overall system footprint.

Length: 6.5 mm

The compact length of the product allows for flexibility in placement on the circuit board, accommodating various design requirements.

Technology: MOS

The MOS technology offers high efficiency and fast switching speeds, ideal for driving peripherals with precision and reliability.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connection, ensuring stability and reliability in operation.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5 V ensures compatibility with common power sources, improving ease of integration.

Turn-on Time: 100 us

The fast turn-on time of 100 us ensures quick response and performance, beneficial for time-sensitive applications.

Terminal Pitch: 2.3 mm

The small terminal pitch of 2.3 mm allows for close placement of terminals, promoting efficient and compact circuit design.

Nominal Output Peak Current Limit: 0.7 A

The nominal output peak current limit of 0.7 A ensures safe operation and protection against overloading, extending the lifespan of the product.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type provides versatile compatibility with different peripheral devices, offering flexibility in application usage.

Turn-off Time: 150 us

The short turn-off time of 150 us ensures rapid response and efficient operation, improving overall system performance.

Output Current Flow Direction: SINK

The sink output current flow direction allows for efficient control and management of connected devices, enhancing system functionality.

Technical Specifications

Peripheral Drivers BSP452XT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE; TRANSIENT

JESD-30 Code:

R-PDSO-G4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.8 mm

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

150 us

Turn-on Time:

100 us

Width:

3.5 mm

Trade Compliance

BSP452XT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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