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BSP452E6327

Infineon Technologies

BSP452E6327 by Infineon Technologies

BSP452E6327 by Infineon Technologies is a Peripheral Driver with 4 terminals, offering built-in protections against transient, over current, and over voltage. It operates at a supply voltage range of 5-34V and has a turn-on time of 100µs. Ideal for applications requiring buffer or inverter based peripheral drivers in compact spaces.

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Chip Stock

USA . 128,310 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Bristol Electronics

USA . 1,037 parts In-Stock

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Sunrise Surplus Inc.

USA . 726 parts In-Stock

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726

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VNN

France . 649 parts In-Stock

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649

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 421 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

Germany . 165 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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Holdelec - ElecDif-Pro

France . 5 parts In-Stock

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Sinequanon

UK . 3 parts In-Stock

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Ampacity Inc.

Singapore . 1,517 parts In-Stock

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$1.500

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Corohmni

South Africa . 132 parts In-Stock

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$4.830

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AZTECH Wire

Italy . 421 parts In-Stock

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$5.755

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Aztec Data Supply Inc.

USA . 4,475 parts In-Stock

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$7.632

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Modulus Dynamics

Lithuania . 1,408 parts In-Stock

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$13.360

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$12.826

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$12.291

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Semicontronic

India . 821 parts In-Stock

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$23.500

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$22.912

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$22.795

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Lixinc

USA . 11,427 parts In-Stock

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A-Z Elektronik GmbH

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Argo Parts USA

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Authorized Procurement Solutions

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Glotronic Ltd.

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Alle Elektronik GmbH

Germany . 3,650 parts In-Stock

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Continental Prestige Electronics

USA . 3,545 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Microchip USA

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Robosynatics

Brazil . 146 parts In-Stock

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Computer Components Inc. - USA

USA . 114 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the potential of your applications with the BSP452E6327 from Infineon Technologies, a trusted manufacturer known for delivering top-quality peripheral drivers. This small outline device offers built-in protections against transient events, over current, over voltage, thermal issues, and more. With a nominal output peak current limit of 1.7A and a turn-on time of just 100us, this product ensures reliable performance and efficient operation. Upgrade your systems with the BSP452E6327 and experience enhanced functionality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Easy to install and saves space on the circuit board.

Maximum Supply Voltage: 34 V

Suitable for applications requiring higher voltage levels.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Provides comprehensive protection for the connected devices.

No. of Terminals: 4

Simplified connection setup.

Package Style (Meter): SMALL OUTLINE

Compact design for efficient use of space.

Minimum Supply Voltage: 5 V

Supports low voltage applications as well.

Terminal Finish: MATTE TIN

Provides good electrical conductivity and corrosion resistance.

Turn-on Time: 100 us

Quick response time for immediate activation.

Nominal Output Peak Current Limit: 1.7 A

Can handle moderate current loads effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface for different types of peripheral devices.

Output Current Flow Direction: SINK

Suitable for applications where current needs to be drawn from the device.

Technical Specifications

Peripheral Drivers BSP452E6327 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.8 mm

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

150 us

Turn-on Time:

100 us

Width:

3.5 mm

Trade Compliance

BSP452E6327 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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