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BSP452E6327T

Infineon Technologies

BSP452E6327T by Infineon Technologies

BSP452E6327T by Infineon Technologies is a Peripheral Driver with 4 terminals, offering built-in protections against various faults. It operates at supply voltages ranging from 5V to 34V and has a nominal output peak current limit of 1.7A. This small outline package driver is ideal for applications requiring buffer or inverter-based interface ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 1,000 parts In-Stock

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Digiode

USA . 456 parts In-Stock

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456

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Vyrian

USA . 277 parts In-Stock

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277

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Nova Conductors

Japan . 56 parts In-Stock

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Semicontronic

India . 1,547 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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1,547

$6.500

$6.338

$6.305

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Corohmni

South Africa . 265 parts In-Stock

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$6.796

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Advanced Electronics

New Zealand . 91 parts In-Stock

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$6.958

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$6.610

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$6.610

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91

$6.958

$6.610

$6.610

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AZTECH Wire

Italy . 277 parts In-Stock

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$7.506

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277

$7.506

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Aztec Data Supply Inc.

USA . 2,641 parts In-Stock

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$8.861

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Modulus Dynamics

Lithuania . 1,884 parts In-Stock

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$14.477

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$13.898

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$13.319

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$13.898

$13.319

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Ampacity Inc.

Singapore . 1,081 parts In-Stock

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$42.500

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Robosynatics

Brazil . 3,000 parts In-Stock

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$21.797

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$21.797

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$21.797

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$21.797

$21.797

$21.797

Lucentia Tech

USA . 3,000 parts In-Stock

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$21.797

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$21.797

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$21.797

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$21.797

$21.797

Continental Prestige Electronics

USA . 1,187 parts In-Stock

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Argo Parts USA

USA . 907 parts In-Stock

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Corphita

USA . 361 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Elevate your electronics with the BSP452E6327T by Infineon Technologies, a high-quality peripheral driver that offers exceptional performance and reliability. Designed with built-in protections for transient, over current, over voltage, thermal, and under voltage, this compact device ensures optimal functionality and safety. From controlling motors to driving LED displays, this versatile component is ideal for a wide range of applications. Experience the value and benefits of choosing a trusted manufacturer like Infineon Technologies with the BSP452E6327T, providing peace of mind and superior performance for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable makes installation easy and reduces overall footprint on the PCB.

Maximum Supply Voltage: 34 V

Supports a high maximum supply voltage, allowing for versatile applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient space utilization on the PCB.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and longevity of the connected devices.

No. of Terminals: 4

Having 4 terminals provides flexibility in connectivity options.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for denser PCB designs.

Minimum Supply Voltage: 5 V

Supports a low minimum supply voltage, suitable for a range of applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and reliability in connections.

Maximum Seated Height: 1.8 mm

Low seated height allows for compact and slim device designs.

Width: 3.5 mm

Narrow width saves space on the PCB.

Length: 6.5 mm

Optimal length for a balanced design on the PCB.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections.

Nominal Supply Voltage: 13.5 V

Nominal supply voltage that is commonly used in various applications.

Turn-on Time: 100 us

Fast turn-on time for quick response in activating connected devices.

Terminal Pitch: 2.3 mm

Optimal terminal pitch for efficient PCB layout and assembly.

Nominal Output Peak Current Limit: 1.7 A

Nominal output peak current limit to protect connected devices from overloading.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter-based peripheral driver for efficient signal transmission and processing.

Turn-off Time: 150 us

Fast turn-off time for quick response in deactivating connected devices.

Output Current Flow Direction: SINK

Sink output current flow direction suitable for driving various loads.

Technical Specifications

Peripheral Drivers BSP452E6327T attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.8 mm

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Turn-off Time:

150 us

Turn-on Time:

100 us

Width:

3.5 mm

Trade Compliance

BSP452E6327T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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