Loading...

VNS1NV04DP-E

STMicroelectronics

VNS1NV04DP-E by STMicroelectronics

VNS1NV04DP-E by STMicroelectronics is an 8-terminal peripheral driver with a small outline package and gull wing terminals. It operates as a sink type buffer or inverter, handling a max output current of 30s at 240°C peak reflow temperature. Ideal for applications requiring surface mountable drivers in plastic/epoxy packages.

Median Price

$1.008

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.008

-

-

-

Chip Stock

USA . 24,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,990

-

-

-

-

Vyrian

USA . 8,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,181

-

-

-

-

Digiode

USA . 4,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,235

-

-

-

-

Anansix

USA . 841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,176 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

$0.988

6,176

$1.008

-

-

$0.988

Argo Parts USA

USA . 2,742 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

2,742

$1.008

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$1.008

-

-

-

Microchip USA

USA . 271 parts In-Stock

1+ parts

$5.122

100+ parts

-

1k+ parts

-

10k+ parts

-

271

$5.122

-

-

-

Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$5.409

100+ parts

$5.138

1k+ parts

$5.138

10k+ parts

-

59

$5.409

$5.138

$5.138

-

Aztec Data Supply Inc.

USA . 3,991 parts In-Stock

1+ parts

$7.080

100+ parts

-

1k+ parts

-

10k+ parts

-

3,991

$7.080

-

-

-

Ampacity Inc.

Singapore . 1,328 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,328

$8.500

-

-

-

AZTECH Wire

Italy . 697 parts In-Stock

1+ parts

$9.565

100+ parts

-

1k+ parts

-

10k+ parts

-

697

$9.565

-

-

-

IDEA Electronic Components Group

UK . 1,649 parts In-Stock

1+ parts

$10.737

100+ parts

-

1k+ parts

$9.664

10k+ parts

-

1,649

$10.737

-

$9.664

-

Corohmni

South Africa . 54 parts In-Stock

1+ parts

$13.201

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$13.201

-

-

-

MKK Technologies

India . 158 parts In-Stock

1+ parts

$20.191

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$20.191

-

-

-

DigiPath Technology Company

USA . 158 parts In-Stock

1+ parts

$20.191

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$20.191

-

-

-

Semicontronic

India . 1,583 parts In-Stock

1+ parts

$25.500

100+ parts

$24.862

1k+ parts

$24.735

10k+ parts

-

1,583

$25.500

$24.862

$24.735

-

Perfect Parts

USA . 123,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

123,543

-

-

-

-

Formix International (Excess)

India . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Corphita

USA . 1,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,855

-

-

-

-

Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

-

100+ parts

$12.838

1k+ parts

-

10k+ parts

-

1,264

-

$12.838

-

-

Lixinc

USA . 1,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,167

-

-

-

-

Overview

Elevate your electronic designs with the VNS1NV04DP-E from STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. The VNS1NV04DP-E is a versatile peripheral driver suitable for a variety of applications. With its small outline package and dual terminal position, this product offers convenience and flexibility for your projects. Experience the benefits of its sink output current flow direction and Gull Wing terminal form. Trust STMicroelectronics to provide you with the tools you need for success in your next electronics project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a sturdy and durable construction for the peripheral driver, ensuring long-term reliability.

Surface Mount: YES

Enables easy installation and secure attachment to circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Allows for efficient use of space on the circuit board, especially in compact electronic devices.

No. of Terminals: 8

Offers ample connectivity options for interfacing with various components in the system.

Package Style (Meter): SMALL OUTLINE

Contributes to a compact form factor, ideal for applications where space is limited.

Terminal Finish: Tin (Sn)

Ensures good electrical conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Facilitates easy connection and integration into the circuit layout.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and efficient reflow soldering during assembly without damaging the peripheral driver.

Peak Reflow Temperature °C: 240

Withstands high temperatures during manufacturing processes, ensuring the integrity of the peripheral driver.

Terminal Form: GULL WING

Enhances solder joint strength and reliability, crucial for the performance of the peripheral driver.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of moisture sensitivity, suitable for a wide range of operating environments.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers flexibility in interfacing with different types of electronic components and circuits, enhancing compatibility.

Output Current Flow Direction: SINK

Designed to sink current, making it suitable for driving components that require a current sink configuration.

Technical Specifications

Peripheral Drivers VNS1NV04DP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VNS1NV04DP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 13