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VNS1NV04

STMicroelectronics

VNS1NV04 by STMicroelectronics

VNS1NV04 by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It supports a max output current of 0.5 A and features fast turn-on (1 µs) and turn-off (5.5 µs) times. Ideal for buffer/inverter applications in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,473

-

-

-

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Vyrian

USA . 1,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,330

-

-

-

-

LIBRA Elektronik GmbH

Germany . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Anansix

USA . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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346

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,469 parts In-Stock

1+ parts

$3.718

100+ parts

-

1k+ parts

$3.346

10k+ parts

-

1,469

$3.718

-

$3.346

-

MKK Technologies

India . 1,027 parts In-Stock

1+ parts

$6.991

100+ parts

-

1k+ parts

-

10k+ parts

-

1,027

$6.991

-

-

-

DigiPath Technology Company

USA . 1,027 parts In-Stock

1+ parts

$6.991

100+ parts

-

1k+ parts

-

10k+ parts

-

1,027

$6.991

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$7.400

100+ parts

$6.734

1k+ parts

$6.068

10k+ parts

-

2,500

$7.400

$6.734

$6.068

-

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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13,000

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-

-

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A-Z Elektronik GmbH

Germany . 4,815 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,815

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-

-

-

Parana Technologies

USA . 1,877 parts In-Stock

1+ parts

-

100+ parts

$4.445

1k+ parts

-

10k+ parts

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1,877

-

$4.445

-

-

Perfect Parts

USA . 544 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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544

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Corphita

USA . 108 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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108

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Overview

Unlock the potential of your designs with the VNS1NV04 from STMicroelectronics, a leading name in semiconductor innovation. This robust peripheral driver delivers superior performance while ensuring reliability through built-in protections against transient spikes, overcurrent, and overheating. Perfect for automotive, industrial, or consumer applications, it combines quality craftsmanship with user-friendly features, making it an essential component for optimizing efficiency and safety in any project. Experience unrivaled value with the VNS1NV04 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and thermal resistance of the product, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easier assembly and efficient use of board space, making this product ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient PCB layout and improves fitting in tight spaces.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Built-in protections ensure reliable operation and enhance durability by safeguarding the driver against various electrical hazards.

No. of Terminals: 8

The 8 terminals offer ample connectivity options for various applications, making it versatile for different peripheral devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it ideal for applications where space is limited, without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent connectivity and corrosion resistance, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal positions allow for greater flexibility in design and easier integration into existing circuits.

Maximum Seated Height: 1.75 mm

The low seated height profile aids in maintaining a compact design, making it suitable for portable devices.

Width: 3.9 mm

This narrow width is suitable for small circuits, optimizing the device's footprint on the PCB.

Length: 4.9 mm

The compact length allows for easy fitting in tight spaces typical of modern electronic devices.

Maximum Output Current: 0.5 A

A maximum output current of 0.5 A makes it suitable for driving a variety of peripheral devices effectively.

Technology: MOS

MOS technology ensures fast switching and low power consumption, enhancing the efficiency of the peripheral driver.

Terminal Form: GULL WING

Gull wing terminals provide better physical support and are easier to solder, ensuring a reliable connection on the PCB.

Turn-on Time: 1 us

A fast turn-on time enables quick response in applications, improving the overall performance of the peripheral interface.

Terminal Pitch: 1.27 mm

This terminal pitch allows for compatibility with various circuit board layouts, facilitating easier integration.

Nominal Output Peak Current Limit: 1.7 A

The peak current limit of 1.7 A provides additional capability for driving higher load devices temporarily, adding flexibility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver enhances signal integrity and allows for effective communication with various peripherals.

Turn-off Time: 5.5 us

A reasonable turn-off time supports effective signal management, ensuring minimal latency in operational switch-off.

Output Current Flow Direction: SINK

The sink output current flow direction allows the driver to effectively control the current flow, enhancing circuit responsiveness.

Technical Specifications

Peripheral Drivers VNS1NV04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

3.9 mm

Trade Compliance

VNS1NV04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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