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VNS1NV04D

STMicroelectronics

VNS1NV04D by STMicroelectronics

VNS1NV04D by STMicroelectronics is a Peripheral Driver with 2 functions, offering built-in protections for transient, over current, and over voltage. This small outline package has 8 terminals and provides a nominal output peak current limit of 1.7A. It is commonly used as a buffer or inverter based peripheral driver in various electronic applications.

Median Price

$1.065

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.065

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-

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870

$1.065

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QIE Inc.

USA . 10,000 parts In-Stock

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Chip Stock

USA . 3,228 parts In-Stock

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3,228

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Anansix

USA . 1,628 parts In-Stock

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1,628

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Digiode

USA . 1,495 parts In-Stock

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1,495

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Vyrian

USA . 1,166 parts In-Stock

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1,166

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ACDS - Activité Composants Distribution Service

France . 931 parts In-Stock

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931

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J2 Sourcing AB

Sweden . 745 parts In-Stock

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745

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A&K Electronics

USA . 641 parts In-Stock

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641

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Rotakorn

Sweden . 641 parts In-Stock

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641

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Bristol Electronics

USA . 641 parts In-Stock

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641

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ComSIT Distribution GmbH

Germany . 432 parts In-Stock

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432

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Cyclops Electronics Ltd

UK . 328 parts In-Stock

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328

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ABC Electronics Ltd.

UK . 75 parts In-Stock

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75

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LWI Electronics Inc

India . 28 parts In-Stock

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28

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Martec Srl

Italy . 12 parts In-Stock

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12

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Prism Electronics

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,908 parts In-Stock

1+ parts

$1.065

100+ parts

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4,908

$1.065

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Continental Prestige Electronics

USA . 1,486 parts In-Stock

1+ parts

$1.065

100+ parts

-

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$1.044

1,486

$1.065

-

-

$1.044

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.065

100+ parts

$1.044

1k+ parts

-

10k+ parts

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100

$1.065

$1.044

-

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AZTECH Wire

Italy . 354 parts In-Stock

1+ parts

$5.717

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354

$5.717

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Corohmni

South Africa . 161 parts In-Stock

1+ parts

$7.301

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161

$7.301

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IDEA Electronic Components Group

UK . 1,429 parts In-Stock

1+ parts

$13.578

100+ parts

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$12.220

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1,429

$13.578

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$12.220

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Aztec Data Supply Inc.

USA . 4,238 parts In-Stock

1+ parts

$13.840

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4,238

$13.840

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MKK Technologies

India . 1,581 parts In-Stock

1+ parts

$25.533

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1,581

$25.533

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DigiPath Technology Company

USA . 1,581 parts In-Stock

1+ parts

$25.533

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1,581

$25.533

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Semicontronic

India . 1,032 parts In-Stock

1+ parts

$30.500

100+ parts

$29.738

1k+ parts

$29.585

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1,032

$30.500

$29.738

$29.585

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Ampacity Inc.

Singapore . 1,049 parts In-Stock

1+ parts

$32.500

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1,049

$32.500

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,357 parts In-Stock

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6,357

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Lixinc

USA . 3,477 parts In-Stock

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3,477

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Corphita

USA . 2,643 parts In-Stock

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2,643

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Perfect Parts

USA . 2,085 parts In-Stock

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2,085

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RC Electronics

USA . 1,950 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 931 parts In-Stock

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931

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Parana Technologies

USA . 810 parts In-Stock

1+ parts

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$16.235

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810

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$16.235

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Glotronic Ltd.

UK . 745 parts In-Stock

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745

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Kepictronics

USA . 117 parts In-Stock

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117

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Overview

Discover the VNS1NV04D by STMicroelectronics, a high-quality peripheral driver designed to enhance your electronic projects. With built-in protections against transient events, over current, over voltage, and thermal issues, this versatile component offers peace of mind and reliability. Whether you're working on automotive, industrial, or consumer applications, this small outline package with 8 terminals provides fast turn-on times and a peak current limit of 1.7A for optimal performance. Trust STMicroelectronics for cutting-edge technology that delivers value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the internal components of the peripheral driver, making it suitable for a variety of environments.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one device provides versatility and efficiency in controlling peripheral devices in a system.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and reliability of the connected peripheral devices by preventing damage from transient events, overcurrent, overvoltage, and thermal issues.

No. of Terminals: 8

With 8 terminals, this peripheral driver offers flexibility in connectivity options, allowing for easy integration with various systems.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good conductivity and solderability, leading to reliable connections in electronic circuits.

Turn-on Time: 1 us

The fast turn-on time of 1 us allows for quick response and operation of the peripheral driver, enhancing overall system performance.

Nominal Output Peak Current Limit: 1.7 A

The high peak current limit of 1.7 A enables the peripheral driver to handle demanding loads with ease, making it suitable for a wide range of applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type offers flexibility in signal processing and control, making the peripheral driver compatible with different types of devices.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to effectively control and regulate the flow of current to connected devices, ensuring their proper operation.

Technical Specifications

Peripheral Drivers VNS1NV04D attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

3.9 mm

Trade Compliance

VNS1NV04D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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