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VNS1NV04P-E

STMicroelectronics

VNS1NV04P-E by STMicroelectronics

VNS1NV04P-E by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features an output peak current limit of 1.7 A and operates at a nominal voltage of 5 V. Ideal for buffer or inverter applications, it ensures reliable performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,833

-

-

-

-

Digiode

USA . 3,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,631

-

-

-

-

Anansix

USA . 653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

653

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$12.423

100+ parts

-

1k+ parts

$11.180

10k+ parts

-

2,267

$12.423

-

$11.180

-

AZTECH Wire

Italy . 133 parts In-Stock

1+ parts

$19.400

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$19.400

-

-

-

MKK Technologies

India . 1,011 parts In-Stock

1+ parts

$23.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,011

$23.360

-

-

-

DigiPath Technology Company

USA . 1,011 parts In-Stock

1+ parts

$23.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,011

$23.360

-

-

-

Microchip USA

USA . 375 parts In-Stock

1+ parts

$25.012

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$25.012

-

-

-

RC Electronics

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Perfect Parts

USA . 6,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,485

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,676

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Corphita

USA . 1,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,975

-

-

-

-

Parana Technologies

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

$14.853

1k+ parts

-

10k+ parts

-

1,760

-

$14.853

-

-

Overview

Elevate your designs with the VNS1NV04P-E from STMicroelectronics, a leader in innovation and quality. This robust peripheral driver offers unparalleled reliability with built-in protections against transient spikes, overcurrent, and thermal issues. Its compact design fits seamlessly into various applications, ensuring efficiency without compromise. Experience the peace of mind that comes with superior performance and longevity, tailored to meet your critical needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity of the product.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

Rectangular shape optimizes space utilization on PCBs, enhancing layout flexibility.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Comprehensive built-in protections safeguard against common electrical faults and improve device lifespan.

No. of Terminals: 8

Sufficient terminals facilitate connectivity for various applications without sacrificing performance.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables high-density mounting, saving valuable PCB space.

Terminal Finish: Matte Tin (Sn)

Matte tin finish improves solderability and enhances the reliability of electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, accommodating various design requirements.

Maximum Seated Height: 1.75 mm

Low seated height contributes to a slim overall profile, making it suitable for compact devices.

Width: 3.9 mm

Narrow width allows for high-density layouts, enhancing design versatility in constrained spaces.

Maximum Time At Peak Reflow Temperature (s): 40

Longer reflow time ensures proper soldering without damaging components, ensuring reliability.

Peak Reflow Temperature °C: 245

High peak reflow temperature is compatible with a wide range of solder materials, ensuring solid connections.

Length: 4.9 mm

Compact length supports space-efficient designs while maintaining performance integrity.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and facilitate easier soldering.

Nominal Supply Voltage: 5 V

Standard operating voltage ensures compatibility with a wide range of applications and devices.

Turn-on Time: 1 us

Rapid turn-on time enables high-speed data transmission, ideal for performance-critical applications.

Terminal Pitch: 1.27 mm

Optimized terminal pitch ensures compatibility with standard PCB designs and minimizes layout complexity.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity allows for manageable handling and storage conditions during manufacturing.

Nominal Output Peak Current Limit: 1.7 A

Adequate current handling capabilities make this driver suitable for driving various peripherals effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile IC type supports a wide range of peripheral applications, enhancing design flexibility.

Turn-off Time: 5.5 us

Quick turn-off time ensures efficient operation and minimizes power dissipation in applications.

Output Current Flow Direction: SINK

Sink current capability allows for easy integration with various device configurations and power management.

Technical Specifications

Peripheral Drivers VNS1NV04P-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

5.5 us

Turn-on Time:

1 us

Width:

3.9 mm

Trade Compliance

VNS1NV04P-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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