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IRS2304SPBF

Infineon Technologies

IRS2304SPBF by Infineon Technologies

IRS2304SPBF by Infineon Technologies is a peripheral driver with a max supply voltage of 20V. It is a CMOS technology-based interface IC type, suitable for automotive applications. This small outline, shrink pitch package has built-in protections against transient and under voltage conditions.

Median Price

$0.940

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,692 parts In-Stock

1+ parts

$0.873

100+ parts

-

1k+ parts

-

10k+ parts

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3,692

$0.873

-

-

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Arrow

USA . 10,662 parts In-Stock

1+ parts

$0.916

100+ parts

-

1k+ parts

-

10k+ parts

-

10,662

$0.916

-

-

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Mouser Electronics

USA . 4,694 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

$0.937

4,694

$0.940

-

-

$0.937

Verical

USA . 39,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.275

10k+ parts

$1.138

39,173

-

-

$1.275

$1.138

Rochester

USA . 39,173 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

39,173

-

$1.230

$1.020

$0.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 316 parts In-Stock

1+ parts

$0.567

100+ parts

-

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316

$0.567

-

-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.912

100+ parts

-

1k+ parts

-

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200

$0.912

-

-

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TME

Poland . 85 parts In-Stock

1+ parts

$2.450

100+ parts

$1.290

1k+ parts

-

10k+ parts

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85

$2.450

$1.290

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Vyrian

USA . 6,945 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,945

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Rutronik

Germany . 3,800 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.129

10k+ parts

-

3,800

-

$1.390

$1.129

-

Schukat

Germany . 515 parts In-Stock

1+ parts

-

100+ parts

$0.710

1k+ parts

-

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515

-

$0.710

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

1+ parts

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100+ parts

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50

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ComSIT USA

USA . 50 parts In-Stock

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50

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Ashlea Components Ltd

UK . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 21,565 parts In-Stock

1+ parts

$0.500

100+ parts

$0.430

1k+ parts

$0.420

10k+ parts

$0.720

21,565

$0.500

$0.430

$0.420

$0.720

Corphita

USA . 409 parts In-Stock

1+ parts

$0.537

100+ parts

-

1k+ parts

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10k+ parts

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409

$0.537

-

-

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Ampacity Inc.

Singapore . 6,903 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

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6,903

$0.610

-

-

-

Advanced Electronics

New Zealand . 51 parts In-Stock

1+ parts

$0.735

100+ parts

$0.735

1k+ parts

$0.735

10k+ parts

-

51

$0.735

$0.735

$0.735

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Argo Parts USA

USA . 3,852 parts In-Stock

1+ parts

$0.912

100+ parts

-

1k+ parts

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10k+ parts

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3,852

$0.912

-

-

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Continental Prestige Electronics

USA . 1,673 parts In-Stock

1+ parts

$0.912

100+ parts

-

1k+ parts

-

10k+ parts

$0.893

1,673

$0.912

-

-

$0.893

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$0.912

100+ parts

$0.866

1k+ parts

$0.823

10k+ parts

$0.812

100

$0.912

$0.866

$0.823

$0.812

Semicontronic

India . 6,776 parts In-Stock

1+ parts

$1.340

100+ parts

$1.306

1k+ parts

$1.300

10k+ parts

-

6,776

$1.340

$1.306

$1.300

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Corohmni

South Africa . 143 parts In-Stock

1+ parts

$4.169

100+ parts

-

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143

$4.169

-

-

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Modulus Dynamics

Lithuania . 3,539 parts In-Stock

1+ parts

$11.718

100+ parts

$11.249

1k+ parts

$10.781

10k+ parts

-

3,539

$11.718

$11.249

$10.781

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Microchip USA

USA . 1,662 parts In-Stock

1+ parts

$12.870

100+ parts

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1,662

$12.870

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Aztec Data Supply Inc.

USA . 1,634 parts In-Stock

1+ parts

$13.077

100+ parts

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1,634

$13.077

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Perfect Parts

USA . 15,322 parts In-Stock

1+ parts

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15,322

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QUARKTWIN TECHNOLOGY LTD

USA . 12,092 parts In-Stock

1+ parts

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12,092

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Kepictronics

USA . 2,362 parts In-Stock

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2,362

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Metaverse IC Inc.

Canada . 2,362 parts In-Stock

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2,362

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Assy Fe

Spain . 40 parts In-Stock

1+ parts

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40

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Overview

Experience seamless and reliable performance with the IRS2304SPBF by Infineon Technologies. As a leading manufacturer of peripheral drivers, Infineon Technologies brings you a product that guarantees high quality and unmatched advantages. This small outline, shrink pitch device offers a wide range of applications, making it a versatile choice for various industries. With built-in protections against transients and under voltage, this product ensures the safety and longevity of your system. Its compact design, matte tin terminal finish, and gull wing form provide easy installation and secure connections. Trust in Infineon Technologies to deliver exceptional value, benefits, and advantages with the IRS2304SPBF - your ultimate solution for all your driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to physical damage, making this product a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this peripheral driver can be easily integrated into circuit boards, offering convenience and flexibility during product assembly.

Maximum Supply Voltage: 20V

The high maximum supply voltage of 20V allows this peripheral driver to handle a wide range of power sources, providing versatility and compatibility in different operating environments.

No. of Functions: 1

This peripheral driver offers a single function, allowing for simplified circuit design and minimizing complexity in system integration.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact form factor, making it easier to fit into confined spaces and enhancing overall product design.

Built-in Protections: TRANSIENT; UNDER VOLTAGE

The built-in protections against transient voltage and under voltage ensure the safety and reliability of connected devices, offering added protection and increasing the lifespan of the product.

Power Supplies (V): 15

With a power supply voltage of 15V, this peripheral driver can efficiently handle common voltage requirements, making it suitable for a wide range of applications.

No. of Terminals: 8

The peripheral driver features 8 terminals, providing sufficient connectivity options for various input and output configurations in electronic systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style allows for higher component density, enabling more efficient use of board space and enhancing overall system performance.

Minimum Supply Voltage: 10V

The low minimum supply voltage requirement of 10V ensures compatibility with a wide range of power sources, providing flexibility in different application scenarios.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this peripheral driver can withstand high-temperature environments, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The peripheral driver's minimum operating temperature of -40°C ensures reliable performance in extreme cold conditions, expanding its usability in various environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability, enhancing the ease of assembly and ensuring reliable electrical connections, thereby increasing the overall product quality.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connection options, making it easier to configure the peripheral driver in different circuit layouts.

Maximum Seated Height: 1.75mm

With a low maximum seated height of 1.75mm, this peripheral driver is compact and can be utilized in space-constrained designs without sacrificing functionality.

Width: 3.9mm

The narrow width of 3.9mm contributes to the peripheral driver's small form factor, allowing for efficient use of board space and enabling compact system designs.

Maximum Time At Peak Reflow Temperature (s): 30

The peripheral driver can withstand peak reflow temperatures for up to 30 seconds, facilitating efficient assembly processes and reducing production time.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this peripheral driver can withstand high-temperature soldering processes, ensuring reliable solder joints and enhancing overall product durability.

Length: 4.9mm

The length of 4.9mm further contributes to the compact size of this peripheral driver, allowing for space-efficient integration into various electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature requirements, this peripheral driver is suitable for automotive applications and can operate effectively in harsh temperature conditions.

Technology: CMOS

Utilizing CMOS technology, this peripheral driver offers low power consumption, high noise immunity, and compatibility with a wide range of interfaces, enhancing its versatility and efficiency.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable operation in electronic assemblies.

Nominal Supply Voltage: 15V

The nominal supply voltage of 15V indicates the optimal operating voltage level for this peripheral driver, ensuring consistent performance and compatibility with standard power sources.

Turn-on Time: 0.21us

With a quick turn-on time of 0.21 microseconds, this peripheral driver enables rapid response and efficient control in various applications.

Terminal Pitch: 0.635mm

The small terminal pitch of 0.635mm allows for increased connectivity density, enabling more complex electronic circuits and improving overall system functionality.

Moisture Sensitivity Level (MSL): 2

Having an MSL of 2 signifies that this peripheral driver can withstand moderate moisture exposure, ensuring product reliability and longevity.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge based interface IC type enables efficient driving and control of peripheral devices, making this product suitable for applications that require precise voltage modulation.

Turn-off Time: 0.21us

With a turn-off time of 0.21 microseconds, this peripheral driver offers quick response and efficient switching, enhancing overall system performance.

Output Current Flow Direction: SOURCE AND SINK

The capability to source and sink output current allows this peripheral driver to control both positive and negative electrical loads, providing versatile and reliable operation in various applications.

Technical Specifications

Peripheral Drivers IRS2304SPBF attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.21 us

Turn-on Time:

.21 us

Width:

3.9 mm

Trade Compliance

IRS2304SPBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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