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FDC6330L

Onsemi

FDC6330L by Onsemi

FDC6330L by Onsemi is a CMOS technology peripheral driver with 6 terminals and built-in transient protection. It operates b/w -55 to 150 °C, with a max output current of 2.3 A. Ideal for military-grade applications requiring a small outline, low profile package style.

Median Price

$0.421

Lifecycle Status

Suppliers In-Stock

37

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1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 209,129 parts In-Stock

1+ parts

$0.436

100+ parts

$0.220

1k+ parts

$0.169

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209,129

$0.436

$0.220

$0.169

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Mouser Electronics

USA . 50,437 parts In-Stock

1+ parts

$0.470

100+ parts

$0.256

1k+ parts

$0.226

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50,437

$0.470

$0.256

$0.226

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DigiKey

USA . 36,669 parts In-Stock

1+ parts

$0.470

100+ parts

$0.256

1k+ parts

$0.216

10k+ parts

$0.194

36,669

$0.470

$0.256

$0.216

$0.194

Arrow

USA . 2,997 parts In-Stock

1+ parts

$0.493

100+ parts

$0.268

1k+ parts

$0.227

10k+ parts

$0.211

2,997

$0.493

$0.268

$0.227

$0.211

Element14

Singapore . 113,634 parts In-Stock

1+ parts

$0.861

100+ parts

$0.435

1k+ parts

$0.336

10k+ parts

$0.266

113,634

$0.861

$0.435

$0.336

$0.266

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$15.298

100+ parts

$13.921

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$12.544

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5,000

$15.298

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$12.544

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Future Electronics

Canada . 579,000 parts In-Stock

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$0.255

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Newark

USA . 291,000 parts In-Stock

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Verical

USA . 39,000 parts In-Stock

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$0.185

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Flip Electronics (Authorized)

USA . 17,017 parts In-Stock

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Master Electronics

USA . 11,300 parts In-Stock

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$0.406

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$0.356

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$0.349

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Avnet

USA . 3,000 parts In-Stock

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Chip1Stop

Japan . 2,829 parts In-Stock

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$0.246

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RS (Exports)

UK . 1,760 parts In-Stock

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$0.278

1,760

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Distributors (In-Stock)

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Maritex

Poland . 11,999 parts In-Stock

1+ parts

$0.405

100+ parts

$0.216

1k+ parts

$0.204

10k+ parts

$0.184

11,999

$0.405

$0.216

$0.204

$0.184

TME

Poland . 5,554 parts In-Stock

1+ parts

$0.440

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$0.322

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$0.440

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Nova Conductors

Japan . 89 parts In-Stock

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$0.456

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Digiode

USA . 959 parts In-Stock

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$0.636

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Ozdisan Elektronik

Türkiye . 30,691 parts In-Stock

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$57.130

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IBS Electronics

USA . 165,000 parts In-Stock

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$0.437

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$0.293

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$0.258

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NAC Semi

USA . 48,000 parts In-Stock

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Vyrian

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Dark Horse Electronics

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Cyclops Electronics Ltd

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Chip Stock

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Martec Srl

Italy . 3,154 parts In-Stock

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Speed Components Ltd

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Ack Elektronik San.Tic.Ltd.Sti

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Classic Components Corporation

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Semtec, LLC

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Ampacity Inc.

Singapore . 36,918 parts In-Stock

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Semicontronic

India . 35,187 parts In-Stock

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$0.136

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$0.132

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Argo Parts USA

USA . 1,224 parts In-Stock

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$0.299

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$0.290

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Netroflash

USA . 100 parts In-Stock

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Corphita

USA . 2,760 parts In-Stock

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Component Stockers USA

USA . 418,543 parts In-Stock

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$0.670

100+ parts

$0.390

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$0.260

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$0.220

418,543

$0.670

$0.390

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$0.220

Aztec Data Supply Inc.

USA . 4,208 parts In-Stock

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$11.841

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Corohmni

South Africa . 311 parts In-Stock

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Modulus Dynamics

Lithuania . 3,108 parts In-Stock

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$14.710

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$14.710

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$15.298

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$13.921

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Perfect Parts

USA . 221,648 parts In-Stock

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Continental Prestige Electronics

USA . 123,193 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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RC Electronics

USA . 79,548 parts In-Stock

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$0.340

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Eastek

USA . 39,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,866 parts In-Stock

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Futuretech Components

Singapore . 21,000 parts In-Stock

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GreenTree Electronics

Israel . 14,990 parts In-Stock

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Kulean Microsystems

USA . 7,743 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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SupplyDigital Components

Austria . 7,497 parts In-Stock

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iodParts Technologies Inc.

India . 4,086 parts In-Stock

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Robosynatics

Brazil . 3,059 parts In-Stock

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$8.077

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$7.912

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$7.912

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$8.077

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$7.912

Lucentia Tech

USA . 3,059 parts In-Stock

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$8.077

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$7.912

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$7.912

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$7.912

S.R.D Solutions

India . 3,000 parts In-Stock

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Spain . 2,702 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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XScomponents

USA . 2,382 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,202 parts In-Stock

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Latvia . 1,931 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Problanco Electronics

Mexico . 1,133 parts In-Stock

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Computer Components Inc. - USA

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Lixinc

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Overview

Enhance your electronic projects with the FDC6330L by Onsemi, a top-tier manufacturer known for its high-quality products. As a versatile peripheral driver, this component offers built-in transient protections and a wide range of power supply options (5-20V) for various applications. With a small outline and low profile package style, this product is ideal for space-constrained designs. Experience the reliability and efficiency that Onsemi is renowned for, and take your projects to the next level with the FDC6330L.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this peripheral driver lightweight and durable.

Surface Mount: YES

With the surface mount feature, this driver can be easily installed on a variety of PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration and placement within electronic systems.

Built-in Protections: TRANSIENT

The built-in transient protection ensures the peripheral driver is safeguarded against sudden voltage spikes or drops, increasing its reliability.

Power Supplies (V): 5/20

This driver is versatile and can effectively operate with power supplies ranging from 5V to 20V, making it compatible with a wide range of applications.

No. of Terminals: 6

The six terminals provide ample connectivity options, allowing for seamless integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style enhances the overall compactness and efficiency of the peripheral driver.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this driver can withstand tough environmental conditions, ensuring consistent performance.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristic allows for efficient communication between the peripheral driver and other components in the circuit.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enables this driver to function reliably even in extremely cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position offers increased flexibility in circuit design and layout, accommodating various configurations.

Maximum Seated Height: 1.22 mm

The low maximum seated height of the driver allows for compact PCB design and efficient use of space.

Width: 1.6 mm

The slim width of the peripheral driver facilitates easy integration into densely populated PCBs, optimizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of thermal damage during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliable connection during the manufacturing process.

Length: 2.92 mm

The compact length of the driver enables it to fit seamlessly into tight spaces, ideal for miniaturized electronics.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the peripheral driver can operate in harsh environments with extreme temperature fluctuations.

Maximum Output Current: 2.3 A

With a high maximum output current, this driver can handle a variety of loads, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this driver ensures efficient power consumption and reliable performance, making it an energy-efficient choice.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and enhances the mechanical strength of the connections.

Terminal Pitch: 0.95 mm

The small terminal pitch allows for high-density mounting, maximizing the potential for complex circuit designs in limited space.

Nominal Output Peak Current Limit: 1.6 A

The nominal output peak current limit protects the driver from overload conditions, ensuring long-term stability and reliability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides versatile communication options, allowing for seamless integration with various devices.

Output Current Flow Direction: SOURCE

The sourcing output current flow direction simplifies connectivity and ensures efficient data transmission in the circuit.

Technical Specifications

Peripheral Drivers FDC6330L attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2.3 A

Nominal Output Peak Current Limit:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/20

Qualification:

Not Qualified

Maximum Seated Height:

1.22 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

FDC6330L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-615-2374, 5962016152374

NIIN

016152374

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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