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FDC6325L

Onsemi

FDC6325L by Onsemi

FDC6325L by Onsemi is a MOS technology peripheral driver with a max output current of 1.8A. It is a small outline package with 6 terminals and can be used as a buffer or inverter based peripheral driver for various applications.

Median Price

$0.382

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 177,900 parts In-Stock

1+ parts

-

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$0.374

1k+ parts

$0.311

10k+ parts

$0.277

177,900

-

$0.374

$0.311

$0.277

Verical

USA . 177,900 parts In-Stock

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$0.389

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$0.346

177,900

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-

$0.389

$0.346

Distributors (In-Stock)

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Nova Conductors

Japan . 74 parts In-Stock

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$0.186

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74

$0.186

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Digiode

USA . 1,496 parts In-Stock

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$0.306

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1,496

$0.306

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$0.770

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$0.580

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$0.500

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5

$0.770

$0.580

$0.500

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TEDSS.com

USA . 218 parts In-Stock

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$1.000

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Flip Electronics

USA . 189,000 parts In-Stock

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Vyrian

USA . 185,051 parts In-Stock

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Chip Stock

USA . 174,300 parts In-Stock

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Velocity Electronics

USA . 5,392 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2,414 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,724 parts In-Stock

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Component Sense

UK . 1,575 parts In-Stock

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1,575

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Corel Iberica Componentes, S.L.

Spain . 590 parts In-Stock

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590

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Prism Electronics

USA . 435 parts In-Stock

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435

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ComSIT Distribution GmbH

Germany . 430 parts In-Stock

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430

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Bristol Electronics

USA . 228 parts In-Stock

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228

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Atlantic Semiconductor

USA . 128 parts In-Stock

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128

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Sensible Micro Corp

USA . 71 parts In-Stock

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$0.312

1k+ parts

$0.288

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71

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$0.312

$0.288

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 1,538 parts In-Stock

1+ parts

$0.186

100+ parts

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10k+ parts

$0.180

1,538

$0.186

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$0.180

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.186

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$0.182

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500

$0.186

$0.182

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Continental Prestige Electronics

USA . 125 parts In-Stock

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$0.186

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$0.182

125

$0.186

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$0.182

Ampacity Inc.

Singapore . 182,142 parts In-Stock

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$0.274

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182,142

$0.274

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Semicontronic

India . 181,757 parts In-Stock

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$0.274

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$0.267

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$0.266

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181,757

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$0.266

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Corphita

USA . 1,729 parts In-Stock

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$0.290

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Corohmni

South Africa . 417 parts In-Stock

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$0.312

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Aztec Data Supply Inc.

USA . 2,238 parts In-Stock

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$14.110

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GreenTree Electronics

Israel . 42,000 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Perfect Parts

USA . 24,300 parts In-Stock

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Kulean Microsystems

USA . 4,489 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,810 parts In-Stock

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Assy Fe

Spain . 2,800 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,534 parts In-Stock

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SupplyDigital Components

Austria . 2,142 parts In-Stock

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Supply Digital

USA . 1,756 parts In-Stock

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TANS Electronics

Latvia . 1,724 parts In-Stock

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Glotronic Ltd.

UK . 648 parts In-Stock

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648

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UHIMA Technologies

Türkiye . 297 parts In-Stock

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Overview

Enhance your electronic designs with the FDC6325L by Onsemi, a high-quality peripheral driver that offers exceptional performance and reliability. As a leading manufacturer in the industry, Onsemi is known for its commitment to innovation and cutting-edge technology. The FDC6325L is perfect for a wide range of applications, providing seamless integration with other components. With its compact size and surface mount capability, this product offers convenience and flexibility in design. Its advanced MOS technology ensures efficient power management, delivering a maximum output current of 1.8 A. Trust the FDC6325L to enhance your projects with its superior functionality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring the product has a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5/8

Offers flexibility in power supply options, accommodating different voltage requirements for various applications.

No. of Terminals: 6

Provides multiple connection points for interfacing with other components, enhancing versatility and functionality.

Maximum Output Current: 1.8 A

Capable of handling high output currents, making it suitable for driving peripherals that demand greater power.

Technology: MOS

Utilizes MOS technology for efficient and reliable operation, ensuring optimal performance in driving peripheral devices.

Nominal Output Peak Current Limit: 1 A

Has a safety feature limiting the peak output current, protecting the device and peripherals from damage due to excessive current.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers multiple interface options for connecting and controlling peripheral devices, enhancing compatibility and usability.

Output Current Flow Direction: SOURCE

Provides a source current flow direction, allowing for efficient and effective power output to connected peripherals.

Technical Specifications

Peripheral Drivers FDC6325L attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Output Current Flow Direction:

SOURCE

Maximum Output Current:

1.8 A

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/8

Qualification:

Not Qualified

Maximum Seated Height:

1.22 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

FDC6325L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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