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BTS723GWXT

Infineon Technologies

BTS723GWXT by Infineon Technologies

BTS723GWXT by Infineon Technologies is a MOS technology peripheral driver with 14 terminals and built-in protections against transient, over current, over voltage, thermal, and under voltage. It operates at supply voltages ranging from 7V to 58V and has a nominal output peak current limit of 9A. Ideal for applications requiring buffer or inverter based peripheral drivers with sink output current flow direction.

Median Price

$2.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 12,500 parts In-Stock

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Chip Stock

USA . 63,410 parts In-Stock

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Vyrian

USA . 12,182 parts In-Stock

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Digiode

USA . 864 parts In-Stock

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France . 853 parts In-Stock

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Nova Conductors

Japan . 24 parts In-Stock

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Cyclops Electronics Ltd

UK . 13 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,397 parts In-Stock

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$2.450

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Semicontronic

India . 12,207 parts In-Stock

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$2.450

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$2.389

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$2.376

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Aztec Data Supply Inc.

USA . 3,684 parts In-Stock

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$5.460

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Corohmni

South Africa . 289 parts In-Stock

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$9.569

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Modulus Dynamics

Lithuania . 1,066 parts In-Stock

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$9.821

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$9.428

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$9.035

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$12.946

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$12.299

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Component Stockers USA

USA . 3,079 parts In-Stock

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$44.690

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Andel Nordic

Denmark . 2,398 parts In-Stock

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$45.840

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$32.091

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$32.091

Lixinc

USA . 10,987 parts In-Stock

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Glotronic Ltd.

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Continental Prestige Electronics

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Argo Parts USA

USA . 1,656 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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Corphita

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RC Electronics

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Overview

Unlock the power of precision and reliability with the BTS723GWXT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality in every product they create. The BTS723GWXT is a game-changer in the category of Peripheral Drivers, offering built-in protections against transient, over current, over voltage, thermal, and under voltage situations. With a nominal output peak current limit of 9A and a maximum supply voltage of 58V, this product is perfect for a wide range of applications. Experience the value and benefits that this innovative solution brings to your projects, making your work easier and more efficient than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation and integration into circuit boards.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Ensures the safety of the peripheral driver and connected components, protecting them from potential damage.

Nominal Output Peak Current Limit: 9 A

Offers high current output capability, making it suitable for driving various peripheral devices.

Technology: MOS

Utilizes MOS technology for efficient and reliable performance in driving peripherals.

Technical Specifications

Peripheral Drivers BTS723GWXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.75 mm

No. of Functions:

1

No. of Terminals:

14

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

58 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

95 us

Turn-on Time:

55 us

Width:

4 mm

Trade Compliance

BTS723GWXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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