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BTS442E2E3062A

Infineon Technologies

BTS442E2E3062A by Infineon Technologies

BTS442E2E3062A by Infineon is a MOS technology peripheral driver with 4.5-42V supply, 70A output current limit, and built-in protections. It has a small outline package style for surface mount applications. Ideal for controlling high-power loads in automotive and industrial systems.

Median Price

$5.545

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 830 parts In-Stock

1+ parts

$5.450

100+ parts

$3.630

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830

$5.450

$3.630

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Forefront Electronics and Design

USA . 25 parts In-Stock

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$5.640

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25

$5.640

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VNN

France . 15,128 parts In-Stock

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Vyrian

USA . 8,286 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,915 parts In-Stock

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ComSIT USA

USA . 3,890 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Digiode

USA . 378 parts In-Stock

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378

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Bristol Electronics

USA . 128 parts In-Stock

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128

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Pegasus Components GmbH

Germany . 83 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 219 parts In-Stock

1+ parts

$6.282

100+ parts

-

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219

$6.282

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Aztec Data Supply Inc.

USA . 4,786 parts In-Stock

1+ parts

$8.215

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$8.215

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AZTECH Wire

Italy . 312 parts In-Stock

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$11.046

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312

$11.046

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Modulus Dynamics

Lithuania . 1,225 parts In-Stock

1+ parts

$12.598

100+ parts

$12.094

1k+ parts

$11.590

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1,225

$12.598

$12.094

$11.590

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Semicontronic

India . 2,141 parts In-Stock

1+ parts

$43.500

100+ parts

$42.412

1k+ parts

$42.195

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$43.500

$42.412

$42.195

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Ampacity Inc.

Singapore . 929 parts In-Stock

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$49.500

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A-Z Elektronik GmbH

Germany . 16,012 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,073 parts In-Stock

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Robosynatics

Brazil . 5,000 parts In-Stock

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$22.385

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$22.385

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$22.385

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$22.385

$22.385

$22.385

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Lixinc

USA . 2,094 parts In-Stock

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Argo Parts USA

USA . 2,037 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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S.R.D Solutions

India . 200 parts In-Stock

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Continental Prestige Electronics

USA . 197 parts In-Stock

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Corphita

USA . 20 parts In-Stock

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Overview

Unleash the power of Infineon Technologies with the BTS442E2E3062A peripheral driver. Designed for maximum performance and reliability, this product offers built-in protections against transient events, over current, over voltage, thermal issues, and under voltage. With a wide range of applications, this small outline device provides a nominal output peak current limit of 70 A and a turn-on time of just 350 us. Trust in the quality and expertise of Infineon Technologies to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for long-term use.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of connected devices by preventing damage from various electrical faults, enhancing the overall reliability of the product.

Nominal Output Peak Current Limit: 70 A

The high peak current limit allows for powering of devices with higher power requirements, making this peripheral driver suitable for a wide range of applications.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V makes it compatible with a variety of electronic devices and systems, offering flexibility in integration.

Output Current Flow Direction: SOURCE

The source configuration allows for efficient control and distribution of current to connected devices, ensuring optimal performance and reliability.

Technical Specifications

Peripheral Drivers BTS442E2E3062A attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

70 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

4.5/42

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

130 us

Turn-on Time:

350 us

Width:

9.2 mm

Trade Compliance

BTS442E2E3062A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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