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BTS452RXT

Infineon Technologies

BTS452RXT by Infineon Technologies

BTS452RXT by Infineon Technologies is a peripheral driver with a max supply voltage of 52V. It offers built-in protections for transient, over current, over voltage, thermal, and under voltage conditions. This small outline package is suitable for applications requiring buffer or inverter based interface ICs with source and sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semtec, LLC

USA . 11,890 parts In-Stock

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11,890

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Vyrian

USA . 5,365 parts In-Stock

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5,365

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VNN

France . 2,418 parts In-Stock

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2,418

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Digiode

USA . 866 parts In-Stock

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866

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Nova Conductors

Japan . 71 parts In-Stock

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71

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Distributors (Availability)

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Corohmni

South Africa . 31 parts In-Stock

1+ parts

$2.027

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31

$2.027

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Modulus Dynamics

Lithuania . 2,201 parts In-Stock

1+ parts

$5.183

100+ parts

$4.976

1k+ parts

$4.768

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2,201

$5.183

$4.976

$4.768

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Aztec Data Supply Inc.

USA . 3,851 parts In-Stock

1+ parts

$9.470

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3,851

$9.470

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Advanced Electronics

New Zealand . 136 parts In-Stock

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$11.969

100+ parts

$11.370

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$11.370

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136

$11.969

$11.370

$11.370

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AZTECH Wire

Italy . 496 parts In-Stock

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$14.287

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496

$14.287

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Ampacity Inc.

Singapore . 810 parts In-Stock

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$37.500

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810

$37.500

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Semicontronic

India . 1,290 parts In-Stock

1+ parts

$47.500

100+ parts

$46.312

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$46.075

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1,290

$47.500

$46.312

$46.075

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Argo Parts USA

USA . 3,500 parts In-Stock

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3,500

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Continental Prestige Electronics

USA . 866 parts In-Stock

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866

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Bastille Electronics

Australia . 700 parts In-Stock

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700

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Corphita

USA . 601 parts In-Stock

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601

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$1.642

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$1.642

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$1.642

500

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$1.642

$1.642

$1.642

Microchip USA

USA . 450 parts In-Stock

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450

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Overview

Experience seamless control and unparalleled reliability with the BTS452RXT by Infineon Technologies. As a leader in peripheral drivers, Infineon Technologies brings you a product that combines high-quality materials and advanced technology for superior performance. This versatile driver offers built-in protections against transient, over current, over voltage, thermal, and under voltage conditions, ensuring the safety of your system. With a wide supply voltage range, this compact driver is perfect for various applications. Discover the value and benefits of the BTS452RXT and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the peripheral driver, making it a reliable choice for long-term use.

Surface Mount:

YES - Being surface mountable allows for easy and efficient installation, making this peripheral driver a convenient option for various applications.

Maximum Supply Voltage:

52 V - With a high maximum supply voltage, this peripheral driver can handle a wide range of power input, making it versatile for different requirements.

No. of Functions:

1 - This peripheral driver is designed to perform a single specific function, ensuring simplicity and efficiency in its operation.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for easy integration and mounting, making it suitable for space-constrained environments.

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE - With multiple built-in protections, this peripheral driver ensures the safety and reliability of connected devices, making it a secure choice for various applications.

No. of Terminals:

4 - The limited number of terminals simplifies the connectivity process, making it easier to set up and use this peripheral driver.

Package Style (Meter):

SMALL OUTLINE - The small outline package style makes this peripheral driver compact and space-saving, ideal for applications with limited space.

Minimum Supply Voltage:

6 V - With a low minimum supply voltage, this peripheral driver can operate efficiently even with lower power sources, making it adaptable to different power conditions.

Terminal Position:

SINGLE - The single terminal position ensures straightforward and uncomplicated connections, making this peripheral driver easy to install and use.

Maximum Seated Height:

2.5 mm - With a low maximum seated height, this peripheral driver can fit into compact devices and installations, making it suitable for space-constrained setups.

Width:

6.22 mm - The narrow width of this peripheral driver allows for easy integration into various systems, providing flexibility in design and installation.

Length:

6.5 mm - The short length of this peripheral driver enables it to fit into tight spaces, making it a practical choice for compact setups.

Terminal Form:

GULL WING - The gull wing terminal form allows for secure and reliable connections, ensuring stable performance of the peripheral driver.

Nominal Supply Voltage:

12 V - With a standard nominal supply voltage, this peripheral driver is compatible with a wide range of devices and power sources, making it a versatile choice.

Turn-on Time:

180 us - The fast turn-on time of this peripheral driver enhances its responsiveness and efficiency, making it suitable for time-sensitive applications.

Terminal Pitch:

1.14 mm - The small terminal pitch enables compact and efficient connectivity, making this peripheral driver suitable for miniaturized designs.

Interface IC Type:

BUFFER OR INVERTER BASED PERIPHERAL DRIVER - This interface IC type provides flexibility and compatibility with different systems, making this peripheral driver a versatile option.

Turn-off Time:

200 us - The quick turn-off time improves the performance and efficiency of this peripheral driver, making it suitable for dynamic applications.

Output Current Flow Direction:

SOURCE AND SINK - This bidirectional output current flow allows for flexible usage, making this peripheral driver compatible with various devices and configurations.

Technical Specifications

Peripheral Drivers BTS452RXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

52 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.14 mm

Terminal Position:

SINGLE

Turn-off Time:

200 us

Turn-on Time:

180 us

Width:

6.22 mm

Trade Compliance

BTS452RXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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