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BTS432E2E3062A

Infineon Technologies

BTS432E2E3062A by Infineon Technologies

BTS432E2E3062A by Infineon Technologies is a peripheral driver with a max supply voltage of 42V. It offers built-in protections for transient, over current, over voltage, thermal, and under voltage conditions. This MOS technology-based driver has a nominal output peak current limit of 44A and is commonly used as a buffer or inverter based peripheral driver.

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ComSIT Distribution GmbH

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Bristol Electronics

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Atlantic Semiconductor

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Cyclops Electronics Ltd

UK . 1,154 parts In-Stock

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Martec Srl

Italy . 809 parts In-Stock

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Rebound Electronics

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Digiode

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Vyrian

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LIBRA Elektronik GmbH

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Nova Conductors

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Sunrise Surplus Inc.

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Pegasus Components GmbH

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Velocity Electronics

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Huijzer Components

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ACDS - Activité Composants Distribution Service

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Cogito LLC

Ukraine . 4 parts In-Stock

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Corohmni

South Africa . 786 parts In-Stock

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$0.797

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Modulus Dynamics

Lithuania . 4,061 parts In-Stock

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$6.745

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$6.475

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$6.205

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Aztec Data Supply Inc.

USA . 3,350 parts In-Stock

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$10.670

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Ampacity Inc.

Singapore . 368 parts In-Stock

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$17.500

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AZTECH Wire

Italy . 680 parts In-Stock

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Andel Nordic

Denmark . 4,965 parts In-Stock

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Semicontronic

India . 1,387 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Futuretech Components

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Lucentia Tech

USA . 1,800 parts In-Stock

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$67.390

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Kepictronics

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Perfect Parts

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Robosynatics

Brazil . 450 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Overview

Discover the power of the BTS432E2E3062A by Infineon Technologies, a high-quality peripheral driver that delivers exceptional performance and reliability. With its advanced technology and built-in protections against transient, over current, over voltage, thermal, and under voltage conditions, this product ensures the safety and efficiency of your applications. Whether you're in automotive, industrial, or consumer electronics, the BTS432E2E3062A offers unparalleled value with its compact design, wide supply voltage range, and fast response time. Experience seamless operation and maximize the potential of your systems with this innovative solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection, making this peripheral driver resistant to impact and temperature changes.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of this peripheral driver onto printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 42 V

With a high maximum supply voltage of 42 V, this peripheral driver is suitable for a wide range of applications, providing flexibility and compatibility with various power sources.

No. of Functions: 1

The presence of a single function in this peripheral driver simplifies its operation, ensuring user-friendly functionality and ease of use.

Screening Level: AEC-Q100

Being compliant with the AEC-Q100 screening level, this peripheral driver meets the automotive industry's stringent requirements, making it a reliable choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space, making this peripheral driver suitable for compact electronic designs.

Built-in Protections: TRANSIENT, OVER CURRENT, OVER VOLTAGE, THERMAL, UNDER VOLTAGE

The built-in protections in this peripheral driver provide comprehensive safeguarding against transient events, over/under voltage conditions, over current situations, and thermal issues, ensuring the safety and longevity of the connected devices.

Power Supplies (V): 4.5/42

The wide range of power supplies (4.5 V to 42 V) supported by this peripheral driver enables flexibility and compatibility with different power sources, making it versatile in various applications.

No. of Terminals: 5

With a compact design featuring only five terminals, this peripheral driver offers a simplified connection interface and contributes to space-saving circuit layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient use of board space, making this peripheral driver suitable for applications with limited board real estate.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement of 4.5 V ensures compatibility with a wide range of power sources, making this peripheral driver suitable for diverse applications with varying power supply capabilities.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent surface conductivity, ensuring reliable electrical connections and reducing the risk of corrosion or oxidation, enhancing the product's overall lifespan.

Terminal Position: SINGLE

The single terminal position simplifies the installation and reduces complexity, allowing for easier integration with other components.

Maximum Seated Height: 4.5 mm

With a maximum seated height of 4.5 mm, this peripheral driver is compact and can be easily mounted in space-constrained environments, offering flexibility in design.

Width: 9.2 mm

The compact width of 9.2 mm allows for efficient utilization of board space, enabling this peripheral driver to be used in tight design layouts.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures that the peripheral driver can withstand high-temperature soldering processes reliably, facilitating seamless integration in manufacturing.

Length: 9.9 mm

The overall length of 9.9 mm provides a compact form factor for this peripheral driver, making it suitable for applications where space is limited.

Technology: MOS

Utilizing Metal-Oxide-Semiconductor (MOS) technology, this peripheral driver offers superior performance in terms of speed, power efficiency, and noise immunity, making it a reliable choice for demanding applications.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure and reliable soldering connections, enhancing the overall durability and reliability of this peripheral driver.

Nominal Supply Voltage: 12 V

With a nominal supply voltage of 12 V, this peripheral driver is compatible with standard voltage levels, making it widely applicable in various electronic systems and devices.

Turn-on Time: 300 us

The fast turn-on time of 300 microseconds ensures quick response and reliable performance, making this peripheral driver suitable for time-sensitive applications.

Terminal Pitch: 1.7 mm

The narrow terminal pitch of 1.7 mm simplifies circuit board design, allowing for close proximity connections and compact layouts.

Driver No. of Bits: 1

This peripheral driver supports a single-bit driver configuration, offering simplicity and efficiency in digital signal processing applications.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this peripheral driver can withstand moderate moisture exposure during storage and assembly without impacting its performance or reliability.

Nominal Output Peak Current Limit: 44 A

The high nominal output peak current limit of 44 A ensures the capability to drive power-hungry components or systems reliably, making it ideal for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver is designed based on buffer or inverter interface ICs, providing versatility and compatibility with various signal inputs and outputs, making it suitable for a wide range of applications.

Turn-off Time: 80 us

The fast turn-off time of 80 microseconds enables quick response and efficient switching, contributing to the overall performance and reliability of this peripheral driver.

Output Current Flow Direction: SOURCE

With the output current flow direction set as "SOURCE," this peripheral driver is capable of driving current into its output, providing the required power for connected devices and components.

Technical Specifications

Peripheral Drivers BTS432E2E3062A attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

44 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

4.5/42

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

80 us

Turn-on Time:

300 us

Width:

9.2 mm

Trade Compliance

BTS432E2E3062A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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