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FPF1009

Onsemi

FPF1009 by Onsemi

FPF1009 by Onsemi is a peripheral driver with 6 terminals, operating voltage range of 1.2V to 5.5V, and built-in transient protection. It comes in a small outline package with very thin profile, suitable for industrial applications requiring source current flow control. The device has fast turn-on time of 2000us and turn-off time of 40us, making it ideal for buffer or inverter based interface ICs.

Median Price

$0.436

Lifecycle Status

EOL

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 19 parts In-Stock

1+ parts

$0.477

100+ parts

$0.477

1k+ parts

$0.477

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-

19

$0.477

$0.477

$0.477

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Verical

USA . 21,000 parts In-Stock

1+ parts

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$0.394

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21,000

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$0.394

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Distributors (In-Stock)

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Digiode

USA . 2,396 parts In-Stock

1+ parts

$0.453

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2,396

$0.453

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.468

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50

$0.468

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Chip Stock

USA . 25,880 parts In-Stock

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25,880

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Vyrian

USA . 10,461 parts In-Stock

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10,461

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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ComSIT Distribution GmbH

Germany . 482 parts In-Stock

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482

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A2Z Electronics, Inc.

USA . 250 parts In-Stock

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250

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Sunrise Surplus Inc.

USA . 21 parts In-Stock

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21

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Prism Electronics

USA . 14 parts In-Stock

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14

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NexGen Digital

USA . 10 parts In-Stock

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10

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Speed Components Ltd

Israel . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,377 parts In-Stock

1+ parts

$0.335

100+ parts

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10,377

$0.335

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Semicontronic

India . 10,089 parts In-Stock

1+ parts

$0.335

100+ parts

$0.327

1k+ parts

$0.325

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10,089

$0.335

$0.327

$0.325

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Corohmni

South Africa . 259 parts In-Stock

1+ parts

$0.394

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259

$0.394

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Corphita

USA . 2,253 parts In-Stock

1+ parts

$0.429

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2,253

$0.429

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Continental Prestige Electronics

USA . 3,590 parts In-Stock

1+ parts

$0.468

100+ parts

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$0.459

3,590

$0.468

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-

$0.459

Argo Parts USA

USA . 74 parts In-Stock

1+ parts

$0.468

100+ parts

-

1k+ parts

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10k+ parts

$0.454

74

$0.468

-

-

$0.454

Advanced Electronics

New Zealand . 19 parts In-Stock

1+ parts

$0.477

100+ parts

$0.477

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$0.477

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19

$0.477

$0.477

$0.477

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Modulus Dynamics

Lithuania . 81 parts In-Stock

1+ parts

$0.519

100+ parts

$0.514

1k+ parts

$0.499

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81

$0.519

$0.514

$0.499

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Microchip USA

USA . 5,869 parts In-Stock

1+ parts

$2.839

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5,869

$2.839

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Aztec Data Supply Inc.

USA . 1,430 parts In-Stock

1+ parts

$8.000

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1,430

$8.000

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Perfect Parts

USA . 71,118 parts In-Stock

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Component Stockers USA

USA . 30,073 parts In-Stock

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$0.360

30,073

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$0.360

Futuretech Components

Singapore . 10,000 parts In-Stock

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Lixinc

USA . 7,588 parts In-Stock

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TANS Electronics

Latvia . 5,442 parts In-Stock

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5,442

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Problanco Electronics

Mexico . 5,176 parts In-Stock

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SupplyDigital Components

Austria . 4,426 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Supply Digital

USA . 1,875 parts In-Stock

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1,875

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Kulean Microsystems

USA . 1,692 parts In-Stock

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1,692

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UHIMA Technologies

Türkiye . 751 parts In-Stock

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751

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 109 parts In-Stock

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109

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Bastille Electronics

Australia . 32 parts In-Stock

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32

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Overview

Experience top-notch quality and reliability with the FPF1009 by Onsemi, a leading manufacturer in the industry. This peripheral driver offers unmatched performance and built-in transient protections, ensuring seamless operation in various applications. From industrial to automotive settings, this product provides exceptional value and benefits, with a wide supply voltage range and quick turn-on/off times. Trust Onsemi's expertise and elevate your projects with the FPF1009 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the peripheral driver, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in usage scenarios and compatibility with various systems.

Built-in Protections: TRANSIENT

The built-in transient protection enhances the reliability of the peripheral driver by safeguarding it against sudden voltage spikes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this peripheral driver can handle demanding industrial environments with ease.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the peripheral driver can withstand the soldering process during assembly without damage.

Technical Specifications

Peripheral Drivers FPF1009 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

40 us

Turn-on Time:

2000 us

Width:

2 mm

Trade Compliance

FPF1009 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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