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FPF1103

Onsemi

FPF1103 by Onsemi

Onsemi's FPF1103 is a peripheral driver with 4 terminals, operating at -40 to 85 °C. It features a power supply of 1.2/4V and peak reflow temperature of 260°C. Ideal for industrial applications requiring buffer or inverter-based interface ICs with sink output current flow direction.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,077 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

9,077

-

$0.304

$0.252

$0.225

DigiKey

USA . 9,077 parts In-Stock

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$0.380

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9,077

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$0.380

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Verical

USA . 4,471 parts In-Stock

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$0.281

4,471

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$0.281

Distributors (In-Stock)

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Digiode

USA . 1,498 parts In-Stock

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$0.237

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1,498

$0.237

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Vyrian

USA . 556 parts In-Stock

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$0.249

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556

$0.249

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Bristol Electronics

USA . 799 parts In-Stock

1+ parts

$0.960

100+ parts

$0.384

1k+ parts

$0.269

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799

$0.960

$0.384

$0.269

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DigiKey Marketplace

USA . 9,077 parts In-Stock

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9,077

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ACDS - Activité Composants Distribution Service

France . 799 parts In-Stock

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799

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Dan-Mar Components

USA . 799 parts In-Stock

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799

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Distributors (Availability)

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Native Components

USA . 181 parts In-Stock

1+ parts

$0.056

100+ parts

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$0.054

181

$0.056

-

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$0.054

Corphita

USA . 661 parts In-Stock

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$0.224

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661

$0.224

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Corohmni

South Africa . 355 parts In-Stock

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$0.249

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355

$0.249

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Component Stockers USA

USA . 12,767 parts In-Stock

1+ parts

$0.260

100+ parts

$0.240

1k+ parts

$0.220

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12,767

$0.260

$0.240

$0.220

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QUARKTWIN TECHNOLOGY LTD

USA . 6,911 parts In-Stock

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Perfect Parts

USA . 4,990 parts In-Stock

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4,990

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 4,471 parts In-Stock

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Kulean Microsystems

USA . 3,378 parts In-Stock

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SupplyDigital Components

Austria . 2,842 parts In-Stock

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Microchip USA

USA . 2,300 parts In-Stock

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Kepictronics

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Assy Fe

Spain . 1,530 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

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Northwest PG Solutions

USA . 842 parts In-Stock

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842

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Glotronic Ltd.

UK . 800 parts In-Stock

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Problanco Electronics

Mexico . 664 parts In-Stock

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TANS Electronics

Latvia . 565 parts In-Stock

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Supply Digital

USA . 132 parts In-Stock

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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Overview

Enhance your electronic designs with the FPF1103 by Onsemi. This high-quality peripheral driver offers exceptional reliability and performance, thanks to its top-tier manufacturer. Ideal for a wide range of applications, this product provides value and benefits that are unmatched in its category. Experience the advantages of seamless integration, efficient power supplies, and precise terminal positioning. Trust Onsemi for cutting-edge technology that meets your every need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and longevity.

Surface Mount: YES

Allows for easy installation on circuit boards.

Package Shape: SQUARE

Uniform shape for neat and organized circuit design.

Power Supplies (V): 1.2/4

Can work with a range of power supplies for versatility.

No. of Terminals: 4

Simplified design with a manageable number of terminals.

Package Style (Meter): GRID ARRAY

Efficient arrangement of terminals for improved connectivity.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable performance.

Minimum Operating Temperature: -40 °C

Suitable for use in cold environments without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Quality finish for optimal conductivity and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy connection to other components in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures the product remains stable during reflow soldering.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature fluctuations are common.

Terminal Form: BALL

Enhances the durability and reliability of the terminal connections.

Terminal Pitch: 0.5 mm

Fine pitch for compact design and efficient use of space on the circuit board.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface options for compatibility with different circuit configurations.

Output Current Flow Direction: SINK

Allows for efficient current sinking and control in the circuit.

Technical Specifications

Peripheral Drivers FPF1103 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/4

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FPF1103 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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