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FPF1207UCX

Onsemi

FPF1207UCX by Onsemi

FPF1207UCX by Onsemi is a peripheral driver with a max supply voltage of 4V and built-in transient protection. It features a package style of grid array, very thin profile, and fine pitch, making it suitable for industrial applications requiring a nominal voltage of 3.3V. The device operates in temperatures ranging from -40 to 85 °C and has a terminal pitch of 0.4mm.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 185,202 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

185,202

-

$0.238

$0.197

$0.176

DigiKey

USA . 182,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.300

182,202

-

-

-

$0.300

Verical

USA . 121,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

121,300

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,012 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

1,012

$0.185

-

-

-

Vyrian

USA . 2,534 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

-

2,534

$0.195

-

-

-

DigiKey Marketplace

USA . 182,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

182,202

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,824 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

2,824

$0.176

-

-

-

Corohmni

South Africa . 337 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$0.195

-

-

-

Native Components

USA . 625 parts In-Stock

1+ parts

$0.250

100+ parts

-

1k+ parts

-

10k+ parts

$0.240

625

$0.250

-

-

$0.240

Northwest PG Solutions

USA . 1,710 parts In-Stock

1+ parts

$0.274

100+ parts

-

1k+ parts

-

10k+ parts

$0.242

1,710

$0.274

-

-

$0.242

Ampacity Inc.

Singapore . 162,534 parts In-Stock

1+ parts

$0.361

100+ parts

-

1k+ parts

-

10k+ parts

-

162,534

$0.361

-

-

-

Perfect Parts

USA . 16,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,755

-

-

-

-

Kulean Microsystems

USA . 8,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,090

-

-

-

-

Problanco Electronics

Mexico . 6,866 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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6,866

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-

-

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SupplyDigital Components

Austria . 5,911 parts In-Stock

1+ parts

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100+ parts

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5,911

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-

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TANS Electronics

Latvia . 5,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,651

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

-

Microchip USA

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,520

-

-

-

-

Supply Digital

USA . 601 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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601

-

-

-

-

UHIMA Technologies

Türkiye . 308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

308

-

-

-

-

Overview

Experience the ultimate in performance and reliability with the FPF1207UCX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality peripheral drivers that are perfect for a wide range of applications. With built-in transient protections and a wide operating temperature range, this product offers exceptional value and benefits to customers. Whether you're looking to enhance your industrial equipment or streamline your automotive systems, the FPF1207UCX is the ideal choice for all your needs. Trust Onsemi to provide you with the best in cutting-edge technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the peripheral driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation and integration into various electronic devices or systems.

Maximum Supply Voltage: 4 V

Can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

Compact square shape allows for efficient use of space on a circuit board.

Built-in Protections: TRANSIENT

Protects the peripheral driver from sudden voltage spikes or fluctuations, ensuring the safety of connected devices.

Power Supplies (V): 1.2/4

Offers flexibility in power supply options, allowing for compatibility with different voltage requirements.

No. of Terminals: 4

Provides multiple connection points for easy integration into a circuit.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Allows for high component density and precise placement on a circuit board, optimizing space and performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for a variety of environments.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance for reliable performance over time.

Maximum Seated Height: 0.539 mm

Low profile design allows for compact installations in space-constrained devices or systems.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring durability and reliability in harsh conditions.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable precise connectivity and efficient signal transmission.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers versatile interface options for different types of peripherals, providing compatibility with a variety of devices.

Technical Specifications

Peripheral Drivers FPF1207UCX attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

.76 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/4

Qualification:

Not Qualified

Maximum Seated Height:

.539 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

4 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.76 mm

Trade Compliance

FPF1207UCX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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