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FPF1208UCX

Onsemi

FPF1208UCX by Onsemi

FPF1208UCX by Onsemi is a peripheral driver with a max supply voltage of 4V and built-in transient protection. It features a very thin profile grid array package style with 4 terminals, suitable for industrial applications requiring source output current flow direction.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 132,223 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

132,223

-

$0.238

$0.197

$0.176

DigiKey

USA . 132,223 parts In-Stock

1+ parts

-

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$0.300

132,223

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$0.300

Verical

USA . 63,223 parts In-Stock

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$0.220

63,223

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$0.220

Distributors (In-Stock)

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Digiode

USA . 2,573 parts In-Stock

1+ parts

$0.185

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2,573

$0.185

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Vyrian

USA . 2,389 parts In-Stock

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$0.195

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2,389

$0.195

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Semi Source

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Corphita

USA . 2,679 parts In-Stock

1+ parts

$0.176

100+ parts

-

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2,679

$0.176

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Corohmni

South Africa . 127 parts In-Stock

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$0.195

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127

$0.195

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Component Stockers USA

USA . 166,754 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

166,754

$0.200

$0.190

$0.170

$0.170

Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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36,530

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QUARKTWIN TECHNOLOGY LTD

USA . 17,310 parts In-Stock

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Perfect Parts

USA . 6,413 parts In-Stock

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6,413

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Microchip USA

USA . 2,885 parts In-Stock

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2,885

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Supply Digital

USA . 2,206 parts In-Stock

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Native Components

USA . 793 parts In-Stock

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UHIMA Technologies

Türkiye . 777 parts In-Stock

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777

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Northwest PG Solutions

USA . 695 parts In-Stock

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695

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TANS Electronics

Latvia . 482 parts In-Stock

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482

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SupplyDigital Components

Austria . 402 parts In-Stock

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402

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Problanco Electronics

Mexico . 385 parts In-Stock

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385

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Kulean Microsystems

USA . 39 parts In-Stock

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39

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Overview

Enhance your electronic designs with the FPF1208UCX from Onsemi, a cutting-edge peripheral driver that delivers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this versatile component offers built-in transient protections and a wide operating temperature range, making it ideal for a variety of applications. With its compact package style and low power consumption, the FPF1208UCX provides exceptional value and performance for your projects. Trust Onsemi to bring innovation and excellence to your designs with the FPF1208UCX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the peripheral driver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 4 V

Supports a wide range of voltage inputs, making this peripheral driver versatile and compatible with various applications.

Built-in Protections: TRANSIENT

Enhances the safety and longevity of connected devices by offering protection against voltage spikes or transients.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold environments, making this peripheral driver suitable for a wide range of applications.

Output Current Flow Direction: SOURCE

Allows for efficient power distribution with a consistent flow direction, ensuring reliable operation of connected devices.

Technical Specifications

Peripheral Drivers FPF1208UCX attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

.76 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/4

Qualification:

Not Qualified

Maximum Seated Height:

.539 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

4 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.76 mm

Trade Compliance

FPF1208UCX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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