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FPF1017

Onsemi

FPF1017 by Onsemi

FPF1017 by Onsemi is a square-shaped peripheral driver with 6 terminals, operating at -40 to 85 °C. It offers a max output current of 1A and supports power supplies of 0.8/1.8V. Ideal for industrial applications requiring buffer or inverter-based interface ICs with sink output current flow direction.

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,382 parts In-Stock

1+ parts

-

100+ parts

$0.370

1k+ parts

$0.307

10k+ parts

$0.274

21,382

-

$0.370

$0.307

$0.274

Verical

USA . 9,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.384

10k+ parts

$0.342

9,653

-

-

$0.384

$0.342

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.460

10k+ parts

-

6,000

-

-

$0.460

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,881 parts In-Stock

1+ parts

$0.288

100+ parts

-

1k+ parts

-

10k+ parts

-

1,881

$0.288

-

-

-

Vyrian

USA . 1,985 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

-

10k+ parts

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1,985

$0.303

-

-

-

Bristol Electronics

USA . 2,987 parts In-Stock

1+ parts

$1.140

100+ parts

$0.456

1k+ parts

$0.319

10k+ parts

$0.296

2,987

$1.140

$0.456

$0.319

$0.296

DigiKey Marketplace

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,000

-

-

-

-

Dan-Mar Components

USA . 2,987 parts In-Stock

1+ parts

-

100+ parts

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2,987

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 61 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

-

10k+ parts

$0.101

61

$0.105

-

-

$0.101

Northwest PG Solutions

USA . 1,819 parts In-Stock

1+ parts

$0.116

100+ parts

-

1k+ parts

-

10k+ parts

$0.102

1,819

$0.116

-

-

$0.102

Corphita

USA . 270 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

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270

$0.273

-

-

-

Corohmni

South Africa . 295 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

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10k+ parts

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295

$0.303

-

-

-

Component Stockers USA

USA . 17,137 parts In-Stock

1+ parts

$0.310

100+ parts

$0.290

1k+ parts

$0.260

10k+ parts

$0.260

17,137

$0.310

$0.290

$0.260

$0.260

QUARKTWIN TECHNOLOGY LTD

USA . 15,178 parts In-Stock

1+ parts

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100+ parts

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15,178

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Metaverse IC Inc.

Canada . 10,605 parts In-Stock

1+ parts

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10,605

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TANS Electronics

Latvia . 7,267 parts In-Stock

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7,267

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Microchip USA

USA . 5,835 parts In-Stock

1+ parts

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5,835

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,500

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-

-

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Problanco Electronics

Mexico . 4,165 parts In-Stock

1+ parts

-

100+ parts

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4,165

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-

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Kulean Microsystems

USA . 3,415 parts In-Stock

1+ parts

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3,415

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Supply Digital

USA . 2,346 parts In-Stock

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2,346

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SupplyDigital Components

Austria . 1,862 parts In-Stock

1+ parts

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100+ parts

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1,862

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Perfect Parts

USA . 1,098 parts In-Stock

1+ parts

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100+ parts

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1,098

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UHIMA Technologies

Türkiye . 278 parts In-Stock

1+ parts

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100+ parts

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278

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-

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Formix International (Excess)

India . 1 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1

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-

Overview

Enhance your electronic designs with the FPF1017 by Onsemi, a high-quality peripheral driver that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its surface mount capability and small outline package style, the FPF1017 is easy to integrate into your projects. Offering a maximum output current of 1A and dual terminal position, this product provides exceptional value and benefits to customers. Upgrade your electronics with the FPF1017 and experience the advantages of using top-notch components in your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product ideal for compact and efficient systems.

Power Supplies (V): 0.8/1.8

Support for multiple power supply voltages (0.8V and 1.8V) provides flexibility in system design and compatibility with a variety of devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances portability and integration into tight spaces, providing versatility in application usage.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability even under demanding conditions, suitable for industrial applications.

Maximum Output Current: 1 A

Capable of delivering a maximum output current of 1A, making it suitable for driving peripherals and components that require higher power.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring durability and performance in harsh environments.

Technical Specifications

Peripheral Drivers FPF1017 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

1 A

Package Body Material:

UNSPECIFIED

Package Code:

SON

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/1.8

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FPF1017 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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