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BSP752TXT

Infineon Technologies

BSP752TXT by Infineon Technologies

BSP752TXT by Infineon Technologies is a peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at a nominal voltage of 13.5 V and has a max supply voltage of 52 V. With a turn-on time of 180 us and turn-off time of 200 us, it is ideal for applications requiring sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 1,888 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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800

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Vyrian

USA . 785 parts In-Stock

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785

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Digiode

USA . 129 parts In-Stock

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Corohmni

South Africa . 313 parts In-Stock

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$4.895

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313

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$7.028

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$6.676

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$6.676

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$7.028

$6.676

$6.676

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AZTECH Wire

Italy . 785 parts In-Stock

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$9.740

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$9.740

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Modulus Dynamics

Lithuania . 2,442 parts In-Stock

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$11.924

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$11.447

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$10.970

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Aztec Data Supply Inc.

USA . 2,926 parts In-Stock

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$14.353

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Ampacity Inc.

Singapore . 797 parts In-Stock

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$20.500

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$20.500

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Semicontronic

India . 1,242 parts In-Stock

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$21.500

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$20.962

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$20.855

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Continental Prestige Electronics

USA . 6,599 parts In-Stock

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Argo Parts USA

USA . 1,831 parts In-Stock

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Corphita

USA . 848 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Enhance your electronic projects with the BSP752TXT from Infineon Technologies. As a reputable manufacturer in the industry, Infineon offers top-quality Peripheral Drivers that provide reliable performance and durability. This versatile product is ideal for a wide range of applications, offering built-in protections such as transient, over current, and over voltage. With a compact design and advanced technology, the BSP752TXT ensures smooth operation and precise control. Upgrade your projects today with this high-value solution that brings efficiency and convenience to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount feature allows for easy and efficient assembly on PCBs.

Maximum Supply Voltage: 52 V

High maximum supply voltage capability provides flexibility in various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and reliability of the product during operation.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and compatibility with different systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for applications with limited space.

Nominal Output Peak Current Limit: 1.7 A

High peak current limit ensures the driver can handle sudden load demands effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type provides flexibility in driving peripheral devices.

Technical Specifications

Peripheral Drivers BSP752TXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

52 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

200 us

Turn-on Time:

180 us

Width:

4 mm

Trade Compliance

BSP752TXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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