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BSP762TXT

Infineon Technologies

BSP762TXT by Infineon Technologies

BSP762TXT by Infineon Technologies is a peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at a nominal voltage of 13.5 V and has a max output peak current limit of 2.4 A. This small outline package driver is ideal for applications requiring sink output current flow direction in MOS technology environments.

Median Price

$7.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 20 parts In-Stock

1+ parts

$13.656

100+ parts

$12.973

1k+ parts

$12.973

10k+ parts

-

20

$13.656

$12.973

$12.973

-

Avnet

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.025

15,000

-

-

-

$1.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 171 parts In-Stock

1+ parts

$12.973

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$12.973

-

-

-

Vyrian

USA . 8,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,378

-

-

-

-

VNN

France . 1,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,587

-

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

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-

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,630 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

10k+ parts

-

8,630

$0.900

-

-

-

Semicontronic

India . 7,436 parts In-Stock

1+ parts

$0.900

100+ parts

$0.878

1k+ parts

$0.873

10k+ parts

-

7,436

$0.900

$0.878

$0.873

-

Modulus Dynamics

Lithuania . 3,941 parts In-Stock

1+ parts

$7.345

100+ parts

$7.051

1k+ parts

$6.757

10k+ parts

-

3,941

$7.345

$7.051

$6.757

-

Corphita

USA . 649 parts In-Stock

1+ parts

$12.290

100+ parts

-

1k+ parts

-

10k+ parts

-

649

$12.290

-

-

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$13.656

100+ parts

$12.973

1k+ parts

$12.973

10k+ parts

-

20

$13.656

$12.973

$12.973

-

Corohmni

South Africa . 1,178 parts In-Stock

1+ parts

$14.175

100+ parts

-

1k+ parts

-

10k+ parts

-

1,178

$14.175

-

-

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Aztec Data Supply Inc.

USA . 1,749 parts In-Stock

1+ parts

$14.244

100+ parts

-

1k+ parts

-

10k+ parts

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1,749

$14.244

-

-

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Argo Parts USA

USA . 4,598 parts In-Stock

1+ parts

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100+ parts

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4,598

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Continental Prestige Electronics

USA . 4,198 parts In-Stock

1+ parts

-

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4,198

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-

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

-

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1,000

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-

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Robosynatics

Brazil . 950 parts In-Stock

1+ parts

-

100+ parts

$31.496

1k+ parts

$31.496

10k+ parts

$31.496

950

-

$31.496

$31.496

$31.496

Lucentia Tech

USA . 950 parts In-Stock

1+ parts

-

100+ parts

$31.496

1k+ parts

$31.496

10k+ parts

$31.496

950

-

$31.496

$31.496

$31.496

Overview

Unlock new possibilities with the BSP762TXT from Infineon Technologies, a cutting-edge Peripheral Driver that delivers unrivaled quality and reliability. Designed with built-in protections for transient, over current, over voltage, thermal, and under voltage situations, this product ensures maximum performance and safety in various applications. Whether you are looking to enhance your automotive systems, industrial equipment, or consumer electronics, the BSP762TXT offers exceptional value, benefits, and advantages that will elevate your projects to the next level. Choose excellence with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 34 V

High maximum supply voltage of 34V enables compatibility with a wide range of applications and power sources.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and protection of both the peripheral driver and connected devices, minimizing the risk of damage or malfunction.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and allows for multiple input and output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and offers a compact design for efficient and space-saving integration.

Nominal Supply Voltage: 13.5 V

Optimal nominal supply voltage of 13.5V ensures consistent and efficient performance of the peripheral driver with reduced power consumption.

Turn-on Time: 170 us

Fast turn-on time of 170 microseconds ensures quick response and activation of the peripheral driver, enhancing overall system efficiency.

Nominal Output Peak Current Limit: 2.4 A

High nominal output peak current limit of 2.4A allows for driving of various loads with ease, making it suitable for a wide range of applications.

Output Current Flow Direction: SINK

Sink output current flow direction offers flexibility in controlling and driving external devices, ensuring compatibility with different load types.

Technical Specifications

Peripheral Drivers BSP762TXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

2.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

230 us

Turn-on Time:

170 us

Width:

4 mm

Trade Compliance

BSP762TXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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