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BTS723GW

Infineon Technologies

BTS723GW by Infineon Technologies

BTS723GW by Infineon Technologies is a peripheral driver with a max supply voltage of 58V and built-in protections for transient, over current, over voltage, thermal, and under voltage. It is commonly used in automotive applications due to its small outline package style and MOS technology.

Median Price

$5.143

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,925 parts In-Stock

1+ parts

$5.350

100+ parts

$3.400

1k+ parts

$3.340

10k+ parts

$2.830

3,925

$5.350

$3.400

$3.340

$2.830

Verical

USA . 4,870 parts In-Stock

1+ parts

-

100+ parts

$5.143

1k+ parts

$4.732

10k+ parts

$4.628

4,870

-

$5.143

$4.732

$4.628

RS (Exports)

UK . 352 parts In-Stock

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-

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$4.992

352

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$4.992

Distributors (In-Stock)

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Maritex

Poland . 1,499 parts In-Stock

1+ parts

$5.060

100+ parts

$2.850

1k+ parts

$2.382

10k+ parts

-

1,499

$5.060

$2.850

$2.382

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TME

Poland . 234 parts In-Stock

1+ parts

$5.420

100+ parts

$4.120

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-

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234

$5.420

$4.120

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Digiode

USA . 334 parts In-Stock

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$6.222

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334

$6.222

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Astute Electronics Inc

. 57,500 parts In-Stock

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57,500

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Cyclops Electronics Ltd

UK . 9,723 parts In-Stock

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ComSIT Distribution GmbH

Germany . 8,723 parts In-Stock

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Rutronik

Germany . 5,000 parts In-Stock

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$2.170

5,000

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$2.170

ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Vyrian

USA . 2,467 parts In-Stock

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2,467

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VNN

France . 300 parts In-Stock

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300

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LIBRA Elektronik GmbH

Germany . 260 parts In-Stock

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260

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Nova Conductors

Japan . 57 parts In-Stock

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57

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LittleDiode

UK . 7 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,287 parts In-Stock

1+ parts

$3.568

100+ parts

$3.425

1k+ parts

$3.283

10k+ parts

-

3,287

$3.568

$3.425

$3.283

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Ampacity Inc.

Singapore . 2,696 parts In-Stock

1+ parts

$3.570

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2,696

$3.570

-

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Semicontronic

India . 2,539 parts In-Stock

1+ parts

$3.570

100+ parts

$3.481

1k+ parts

$3.463

10k+ parts

-

2,539

$3.570

$3.481

$3.463

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Corohmni

South Africa . 183 parts In-Stock

1+ parts

$4.477

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183

$4.477

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Corphita

USA . 539 parts In-Stock

1+ parts

$5.895

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539

$5.895

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CoreStaff

Japan . 4,870 parts In-Stock

1+ parts

$8.217

100+ parts

$3.138

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4,870

$8.217

$3.138

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$11.558

100+ parts

$10.980

1k+ parts

$10.980

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200

$11.558

$10.980

$10.980

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Perfect Parts

USA . 147,155 parts In-Stock

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A-Z Elektronik GmbH

Germany . 77,815 parts In-Stock

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S.R.D Solutions

India . 16,300 parts In-Stock

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Futuretech Components

Singapore . 15,000 parts In-Stock

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Lixinc

USA . 14,983 parts In-Stock

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Glotronic Ltd.

UK . 9,000 parts In-Stock

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GreenTree Electronics

Israel . 5,200 parts In-Stock

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Argo Parts USA

USA . 3,278 parts In-Stock

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3,278

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Continental Prestige Electronics

USA . 3,273 parts In-Stock

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3,273

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Alle Elektronik GmbH

Germany . 1,714 parts In-Stock

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1,714

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Assy Fe

Spain . 1,187 parts In-Stock

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1,187

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 200 parts In-Stock

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200

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Giza Technologies, Inc.

USA . 5 parts In-Stock

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5

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Overview

Infineon PROFET™ Smart High-Side Switches are placed between the supply and load to control the application. These highly integrated high-side switches incorporate a broad range of smart features like diagnosis and protection. PROFET switches consist of a DMOS power transistor and CMOS logic circuitry for complete built-in protection against overload, short-circuit, excessive temperature, ground loss, power supply loss, and electrostatic discharge (ESD).

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of a plastic/epoxy package body material provides durability and resistance to various environmental conditions, making this peripheral driver suitable for a wide range of applications.

Surface Mount: YES

With the surface mount capability, this peripheral driver can be easily mounted on circuit boards, providing convenience in the manufacturing process and saving valuable space.

Maximum Supply Voltage: 58 V

The high maximum supply voltage allows this peripheral driver to handle higher voltage levels, making it suitable for applications that require robust power supply capability.

No. of Functions: 2

With the availability of two functions in a single peripheral driver, it offers versatility in implementing various control and drive functionalities, expanding the possibilities for system integration.

Package Shape: RECTANGULAR

The rectangular package shape provides compatibility with standard board designs and facilitates easy integration into electronic systems.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The presence of multiple built-in protections ensures the safety and reliability of connected devices by preventing damage due to transient events, overloading, excessive voltage, overheating, and undervoltage conditions.

Power Supplies (V): 24

Operating with a nominal power supply of 24 volts, this peripheral driver aligns with standard voltage levels in many applications, enabling easy compatibility and integration.

No. of Terminals: 14

The availability of 14 terminals allows for flexible connectivity options, facilitating easy interfacing with other devices or components within the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style not only saves valuable board space but also enhances thermal performance, contributing to efficient heat dissipation and improved overall system reliability.

Minimum Supply Voltage: 7 V

With a low minimum supply voltage requirement, this peripheral driver enables operation in a wide range of voltage levels, providing flexibility in various applications.

Maximum Operating Temperature: 150 °C

The ability to withstand high operating temperatures up to 150°C ensures reliable and stable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The peripheral driver's capability to operate under extremely low temperatures down to -40°C makes it suitable for use in cold or frozen environments without sacrificing functionality or reliability.

Terminal Finish: TIN

The use of tin terminal finish provides corrosion resistance, ensuring long-term reliability and maintaining consistent electrical performance.

Terminal Position: DUAL

The dual terminal position allows for various mounting options and provides flexibility in system design and assembly.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, this peripheral driver fits into compact spaces, making it well-suited for applications with limited vertical clearance.

Width: 4 mm

The narrow width of this peripheral driver allows for efficient space utilization on circuit boards, enabling higher component density and more compact system designs.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand the peak reflow temperature for up to 40 seconds ensures proper soldering during the manufacturing process, contributing to robust and reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder reflow, guaranteeing strong and reliable connections to the circuit board.

Length: 8.75 mm

With a compact length, this peripheral driver allows for efficient utilization of board space, contributing to miniaturized and space-saving system designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this peripheral driver meets the stringent temperature and performance requirements of the automotive industry, ensuring reliability and longevity even in harsh operating conditions.

Technology: MOS

Utilizing MOS (Metal-Oxide-Semiconductor) technology, this peripheral driver offers high speed, low power consumption, and excellent noise immunity, making it suitable for various digital and analog applications.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process during assembly, providing a reliable electrical connection and contributing to efficient manufacturing.

Maximum Supply Current: 3 mA

With a low maximum supply current, this peripheral driver minimizes power consumption, making it ideal for energy-efficient system designs.

Nominal Supply Voltage: 24 V

Operating at a nominal supply voltage of 24 volts, this peripheral driver aligns with standard voltage levels in many applications, facilitating easy integration and compatibility.

Turn-on Time: 55 us

The fast turn-on time of 55 microseconds allows for quick and responsive control or drive functions, improving system performance and efficiency.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 millimeters enables higher packing density on circuit boards, enabling more compact system designs and reducing PCB size.

Driver No. of Bits: 2

With two driver bits, this peripheral driver can handle multiple data or control signals simultaneously, offering increased functionality and flexibility in various applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures that the peripheral driver can withstand appropriate moisture exposure during production and storage, preventing any potential degradation or damage.

Nominal Output Peak Current Limit: 4.2 A

The high nominal output peak current limit of 4.2 amps allows the peripheral driver to drive devices or components with high power demand, making it suitable for applications requiring robust current handling capability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

With a buffer or inverter-based interface IC type, this peripheral driver provides versatile signal conditioning or amplification capability, making it suitable for various communication protocols and signal processing applications.

Turn-off Time: 95 us

The fast turn-off time of 95 microseconds ensures quick response and accurate control or drive functions, enhancing system performance and reliability.

Output Current Flow Direction: SINK

The output current flow direction being sink ensures the peripheral driver can sink current from connected devices or components, making it suitable for a wide range of applications requiring current sinking capability.

Technical Specifications

Peripheral Drivers BTS723GW attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

58 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

95 us

Turn-on Time:

55 us

Width:

4 mm

Trade Compliance

BTS723GW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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