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BTS711L1XT

Infineon Technologies

BTS711L1XT by Infineon Technologies

BTS711L1XT by Infineon Technologies is a peripheral driver with a max supply voltage of 34V. It has built-in protections for transient, over current, over voltage, thermal, and under voltage conditions. This MOS technology-based device is suitable for applications requiring buffer or inverter based peripheral drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,187 parts In-Stock

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VNN

France . 1,029 parts In-Stock

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1,029

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Digiode

USA . 894 parts In-Stock

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894

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,156 parts In-Stock

1+ parts

$9.887

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3,156

$9.887

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AZTECH Wire

Italy . 890 parts In-Stock

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$10.466

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890

$10.466

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Modulus Dynamics

Lithuania . 416 parts In-Stock

1+ parts

$10.835

100+ parts

$10.402

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$9.968

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416

$10.835

$10.402

$9.968

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Corohmni

South Africa . 117 parts In-Stock

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$14.268

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117

$14.268

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$14.402

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$13.682

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$13.682

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200

$14.402

$13.682

$13.682

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Ampacity Inc.

Singapore . 1,531 parts In-Stock

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$20.500

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$20.500

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Semicontronic

India . 547 parts In-Stock

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$34.500

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$33.638

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$33.465

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547

$34.500

$33.638

$33.465

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Argo Parts USA

USA . 4,753 parts In-Stock

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Continental Prestige Electronics

USA . 421 parts In-Stock

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Corphita

USA . 319 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$7.047

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$7.047

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$7.047

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$7.047

$7.047

$7.047

Lucentia Tech

USA . 100 parts In-Stock

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$7.047

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$7.047

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$7.047

100

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$7.047

$7.047

$7.047

Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the next level of performance with the BTS711L1XT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees superior quality and reliability in every product. The BTS711L1XT falls under the category of Peripheral Drivers, offering a wide range of applications. With its built-in protections against transient, over current, over voltage, thermal, and under voltage, this product ensures maximum safety and efficiency. Its compact design and small outline package make it easy to integrate into any system. Unlock the full potential of your devices with the BTS711L1XT and enjoy unrivaled performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the peripheral driver, making it a reliable choice.

Surface Mount: YES

Being surface mountable allows for easy installation and integration onto circuit boards, making it convenient and efficient to use.

Maximum Supply Voltage: 34 V

With a maximum supply voltage of 34V, this peripheral driver is capable of handling high voltage requirements, making it suitable for a wide range of applications.

No. of Functions: 4

The incorporation of four functions into a single peripheral driver eliminates the need for multiple components, saving space and simplifying circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape enables easy mounting and positioning within electronic systems, enhancing compatibility and fitting requirements.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure that the peripheral driver is safeguarded against transient events, excessive current, voltage fluctuations, overheating, and low voltage conditions, increasing its reliability and protecting the connected devices.

No. of Terminals: 20

With 20 terminals available, this peripheral driver provides ample connectivity options, allowing for versatile configuration possibilities in various systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency and enables integration into compact devices or densely populated circuit boards.

Minimum Supply Voltage: 5 V

With a minimum supply voltage of 5V, this peripheral driver can operate efficiently in low voltage environments, providing flexibility and compatibility with a wide range of systems.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and ensures reliable electrical connections, contributing to the overall longevity of the peripheral driver.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connecting and controlling peripheral devices, enhancing versatility and ease of use.

Maximum Seated Height: 2.65 mm

With a maximum seated height of 2.65mm, this peripheral driver is compact and slim, enabling it to be easily integrated into space-constrained designs.

Width: 7.6 mm

The 7.6mm width of this peripheral driver contributes to its compact size, allowing for efficient usage of board space in electronic systems.

Length: 12.8 mm

With a length of 12.8mm, this peripheral driver maintains a compact form factor, enabling it to fit into tight spaces or designs with limited available area.

Technology: MOS

Utilizing MOS (Metal-Oxide-Semiconductor) technology ensures high performance, reliability, and efficient operation of the peripheral driver, making it a dependable choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure soldering and robust electrical connections, ensuring stable and dependable performance in demanding environments.

Nominal Supply Voltage: 12 V

With a nominal supply voltage of 12V, this peripheral driver is compatible with standard voltage requirements, providing seamless integration into numerous systems.

Turn-on Time: 400 us

The fast turn-on time of 400µs ensures quick response and enables efficient control and operation of connected devices, contributing to overall system performance.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm offers ease of connectivity and compatibility with standard PCB layouts, simplifying the integration process of the peripheral driver.

Nominal Output Peak Current Limit: 4.4 A

The high nominal output peak current limit of 4.4A enables the peripheral driver to drive power-hungry devices or components, making it suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver serves as a buffer or inverter, providing signal amplification, isolation, or inversion capabilities, enhancing versatility and adapting to different circuit requirements.

Turn-off Time: 400 us

The quick turn-off time of 400µs ensures rapid shutdown or switching capabilities, contributing to efficient and responsive operation of connected devices.

Output Current Flow Direction: SOURCE AND SINK

With the ability to both source and sink current, this peripheral driver allows for bidirectional control and compatibility with various devices, expanding its application possibilities.

Technical Specifications

Peripheral Drivers BTS711L1XT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

4.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

400 us

Turn-on Time:

400 us

Width:

7.6 mm

Trade Compliance

BTS711L1XT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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