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NCP45770IMN24TWG

Onsemi

NCP45770IMN24TWG by Onsemi

NCP45770IMN24TWG by Onsemi is a 12-terminal peripheral driver with built-in protections for over current, thermal, and under voltage. It operates b/w -40 to 85°C, with a supply voltage range of 3-5.5V. Ideal for industrial applications requiring a compact square package with sink output current flow direction.

Median Price

$2.450

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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DigiKey

USA . 5,645 parts In-Stock

1+ parts

$2.450

100+ parts

$1.484

1k+ parts

$1.364

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5,645

$2.450

$1.484

$1.364

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Mouser Electronics

USA . 1,454 parts In-Stock

1+ parts

$2.450

100+ parts

$1.490

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$1.410

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1,454

$2.450

$1.490

$1.410

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.798

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500

$1.798

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Digiode

USA . 1,010 parts In-Stock

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$2.508

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1,010

$2.508

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Chip Stock

USA . 15,369 parts In-Stock

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Vyrian

USA . 6,216 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,534 parts In-Stock

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$1.000

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6,534

$1.000

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.762

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1k+ parts

$1.691

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1,000

$1.762

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$1.691

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Continental Prestige Electronics

USA . 4,281 parts In-Stock

1+ parts

$1.798

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$1.762

4,281

$1.798

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$1.762

Argo Parts USA

USA . 1,219 parts In-Stock

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$1.798

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1,219

$1.798

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Semicontronic

India . 8,382 parts In-Stock

1+ parts

$2.240

100+ parts

$2.184

1k+ parts

$2.173

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8,382

$2.240

$2.184

$2.173

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Corphita

USA . 2,228 parts In-Stock

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$2.376

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2,228

$2.376

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Corohmni

South Africa . 66 parts In-Stock

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$2.640

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66

$2.640

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Aztec Data Supply Inc.

USA . 2,002 parts In-Stock

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$13.900

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$13.900

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Vigor

Singapore . 110 parts In-Stock

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$15.000

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iodParts Technologies Inc.

India . 67,997 parts In-Stock

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Kepictronics

USA . 24,000 parts In-Stock

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Lixinc

USA . 18,551 parts In-Stock

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SupplyDigital Components

Austria . 7,015 parts In-Stock

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TANS Electronics

Latvia . 6,616 parts In-Stock

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Kulean Microsystems

USA . 6,032 parts In-Stock

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Problanco Electronics

Mexico . 5,784 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,875 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 482 parts In-Stock

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482

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Overview

Elevate your projects with the NCP45770IMN24TWG by Onsemi, a top-tier manufacturer known for delivering premium quality peripheral drivers. This cutting-edge device boasts built-in protections for over current, thermal, and under voltage, ensuring reliable performance in industrial-grade applications. With a compact square package shape and a nominal output peak current limit of 20A, this interface IC offers unmatched value and efficiency. Trust Onsemi to provide you with the innovative solutions you need to take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5V makes this peripheral driver compatible with a wide range of circuits and systems.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during installation.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

Built-in protections ensure the safety and reliability of the connected system by preventing damage from over current, thermal issues, and under voltage conditions.

No. of Terminals: 12

Having 12 terminals provides flexibility in connecting various components and peripherals to the driver.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline with a heat sink or slug and thin profile design allows for efficient heat dissipation and space-saving on the PCB.

Minimum Supply Voltage: 3 V

Ability to operate at a minimum supply voltage of 3V ensures compatibility with low-power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures stability and performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this peripheral driver can withstand cold environments without sacrificing performance.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals provides a reliable electrical connection and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for better connectivity options and flexibility in circuit design.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm helps in maintaining a low-profile design and saves space on the PCB.

Width: 3 mm

Compact width of 3mm enables efficient placement and utilization of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

This peripheral driver can withstand reflow soldering processes for up to 30 seconds, ensuring proper soldering and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures the driver can withstand soldering processes without damage.

Length: 3 mm

Compact length of 3mm helps in saving space on the PCB and allows for efficient circuit layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Terminal Form: NO LEAD

No-lead terminal form improves the reliability of the electrical connection and is environmentally friendly.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides a stable operating voltage for the peripheral driver.

Turn-on Time: 700 us

Fast turn-on time of 700 microseconds ensures quick response and efficient operation of the driver.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for compact design and efficient use of space on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the driver can withstand exposure to moderate humidity levels during storage and operation.

Nominal Output Peak Current Limit: 20 A

Nominal output peak current limit of 20A allows the peripheral driver to handle high current demands while ensuring safe operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Interface integrated circuit type of buffer or inverter-based peripheral driver provides signal buffering and inversion capabilities for interfacing with other components.

Output Current Flow Direction: SINK

Output current flow direction being sink indicates the ability of the driver to sink current from connected devices, providing a reliable and stable output signal.

Technical Specifications

Peripheral Drivers NCP45770IMN24TWG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

S-XDSO-N12

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

20 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC12,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-on Time:

700 us

Width:

3 mm

Trade Compliance

NCP45770IMN24TWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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