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NCP458RFCCT2G

Onsemi

NCP458RFCCT2G by Onsemi

NCP458RFCCT2G by Onsemi is an 8-terminal peripheral driver with a max output current of 4.5A, operating temperature range of -40 to 85 °C. It features a plastic/epoxy package body material in rectangular shape, suitable for industrial applications requiring buffer or inverter-based interface ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 11,589 parts In-Stock

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Digiode

USA . 1,756 parts In-Stock

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AZTECH Wire

Italy . 1,051 parts In-Stock

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TANS Electronics

Latvia . 6,822 parts In-Stock

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Kulean Microsystems

USA . 5,740 parts In-Stock

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SupplyDigital Components

Austria . 3,116 parts In-Stock

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Problanco Electronics

Mexico . 3,028 parts In-Stock

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Corphita

USA . 1,362 parts In-Stock

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Vigor

Singapore . 558 parts In-Stock

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UHIMA Technologies

Türkiye . 493 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corohmni

South Africa . 362 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the NCP458RFCCT2G by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in their products, making this peripheral driver a smart choice for various applications. With a wide operating voltage range and high output current capability, this product delivers exceptional value to customers seeking efficient and stable operation. Say goodbye to compatibility issues and hello to seamless integration with the NCP458RFCCT2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Power Supplies (V): 0.75/5.5

Can accept a wide range of voltage inputs, making it versatile for different applications.

No. of Terminals: 8

Provides sufficient connections for various peripherals to be controlled.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without issues.

Maximum Output Current: 4.5 A

Capable of delivering high current for driving peripherals.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for a compact design, saving space on the circuit board.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers flexible options for interfacing with different types of peripherals.

Technical Specifications

Peripheral Drivers NCP458RFCCT2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PBGA-B8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

0.75/5.5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

NCP458RFCCT2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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