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NCP459FCT2G

Onsemi

NCP459FCT2G by Onsemi

NCP459FCT2G by Onsemi is a Peripheral Driver with 8 terminals, operating at -40 to 85 °C. It has a max output current of 4.5A and supports power supplies from 0.75V to 5.5V. Ideal for industrial applications requiring buffer or inverter based interface ICs in a fine pitch grid array package style.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,862 parts In-Stock

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Chip Stock

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Digiode

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Sensible Micro Corp

USA . 6 parts In-Stock

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Microchip USA

USA . 268 parts In-Stock

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$1.979

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AZTECH Wire

Italy . 1,092 parts In-Stock

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$19.580

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Perfect Parts

USA . 124,320 parts In-Stock

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Problanco Electronics

Mexico . 7,353 parts In-Stock

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Kulean Microsystems

USA . 6,718 parts In-Stock

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TANS Electronics

Latvia . 3,883 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

India . 2,904 parts In-Stock

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Corphita

USA . 2,013 parts In-Stock

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SupplyDigital Components

Austria . 1,578 parts In-Stock

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UHIMA Technologies

Türkiye . 909 parts In-Stock

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Futuretech Components

Singapore . 579 parts In-Stock

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Corohmni

South Africa . 421 parts In-Stock

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RC Electronics

USA . 200 parts In-Stock

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Vigor

Singapore . 150 parts In-Stock

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Overview

Enhance your electronic designs with the NCP459FCT2G by Onsemi, a top-of-the-line peripheral driver that combines quality and reliability. Onsemi's reputation for excellence ensures that this product meets the highest standards in the industry. With a wide range of applications, such as interface ICs and inverters, this versatile component offers customers unmatched value and benefits. Trust Onsemi to deliver exceptional performance and innovation in every product they create. Elevate your projects with the NCP459FCT2G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can withstand high temperatures, making the product reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and simplifying assembly processes.

Power Supplies (V): 0.75/5.5

Wide range of power supply options allows for flexibility in different operating conditions.

Maximum Output Current: 4.5 A

High maximum output current capability ensures compatibility with a wide range of peripheral devices that may require higher power.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can perform reliably in industrial settings with varying temperature conditions.

Technical Specifications

Peripheral Drivers NCP459FCT2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.75/5.5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCP459FCT2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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