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VNS3NV04DP-E

STMicroelectronics

VNS3NV04DP-E by STMicroelectronics

VNS3NV04DP-E by STMicroelectronics is a peripheral driver with built-in thermal and overvoltage protections. It has 2 functions, 8 terminals, and a peak output current limit of 5A. Ideal for applications requiring sink output flow direction, it features a turn-on time of 1.35us and turn-off time of 10us in a small outline package style.

Median Price

$1.143

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.143

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-

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10

$1.143

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Chip Stock

USA . 10,950 parts In-Stock

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10,950

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Vyrian

USA . 8,293 parts In-Stock

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8,293

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Digiode

USA . 3,778 parts In-Stock

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3,778

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Anansix

USA . 2,501 parts In-Stock

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2,501

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Bristol Electronics

USA . 193 parts In-Stock

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193

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Atlantic Semiconductor

USA . 193 parts In-Stock

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193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 230 parts In-Stock

1+ parts

$1.143

100+ parts

-

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230

$1.143

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Continental Prestige Electronics

USA . 5,522 parts In-Stock

1+ parts

$1.143

100+ parts

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10k+ parts

$1.120

5,522

$1.143

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-

$1.120

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.143

100+ parts

-

1k+ parts

$1.086

10k+ parts

$1.063

2,000

$1.143

-

$1.086

$1.063

Argo Parts USA

USA . 1,932 parts In-Stock

1+ parts

$1.143

100+ parts

-

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1,932

$1.143

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.177

100+ parts

$1.118

1k+ parts

$1.118

10k+ parts

-

5,000

$1.177

$1.118

$1.118

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Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

$1.269

100+ parts

$1.256

1k+ parts

$1.218

10k+ parts

-

750

$1.269

$1.256

$1.218

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IDEA Electronic Components Group

UK . 802 parts In-Stock

1+ parts

$4.998

100+ parts

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1k+ parts

$4.499

10k+ parts

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802

$4.998

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$4.499

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Aztec Data Supply Inc.

USA . 330 parts In-Stock

1+ parts

$6.570

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330

$6.570

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MKK Technologies

India . 1,910 parts In-Stock

1+ parts

$9.399

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1,910

$9.399

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$9.399

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1,910

$9.399

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AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$15.762

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773

$15.762

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

1+ parts

$16.500

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1,143

$16.500

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Semicontronic

India . 1,615 parts In-Stock

1+ parts

$27.500

100+ parts

$26.812

1k+ parts

$26.675

10k+ parts

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1,615

$27.500

$26.812

$26.675

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RC Electronics

USA . 37,207 parts In-Stock

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37,207

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iodParts Technologies Inc.

India . 29,120 parts In-Stock

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Perfect Parts

USA . 20,820 parts In-Stock

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Lixinc

USA . 12,284 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,277 parts In-Stock

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5,277

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Microchip USA

USA . 5,035 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,644 parts In-Stock

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1,644

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Authorized Procurement Solutions

USA . 1,070 parts In-Stock

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1,070

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$4.340

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$4.340

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$4.340

900

-

$4.340

$4.340

$4.340

Parana Technologies

USA . 796 parts In-Stock

1+ parts

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$5.976

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796

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$5.976

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Benley Electronics

USA . 400 parts In-Stock

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400

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Kepictronics

USA . 125 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the VNS3NV04DP-E by STMicroelectronics, a top-tier manufacturer renowned for quality and reliability. As a leading peripheral driver in the industry, this product offers built-in protections against thermal issues and overvoltage, ensuring optimal functionality. With a compact design and high output peak current limit of 5A, this versatile component is ideal for a wide range of applications. Trust STMicroelectronics to deliver value and innovation, providing you with the competitive edge you need in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making this peripheral driver a reliable choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

No. of Functions: 2

Having 2 functions in one device provides versatility and functionality, making this peripheral driver suitable for a variety of applications.

Built-in Protections: THERMAL; OVER VOLTAGE

The built-in thermal and over voltage protections ensure the safety and reliability of connected devices and help prevent damage from potential electrical hazards.

No. of Terminals: 8

With 8 terminals, this peripheral driver offers flexibility in connecting to other components and peripherals, allowing for seamless integration into various electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for applications where size constraints are a concern.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75mm allows for a compact design, making this peripheral driver suitable for devices with limited space available.

Width: 3.9 mm

The narrow width of 3.9mm contributes to the overall compactness of the device, allowing for efficient use of space on the circuit board.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures that the peripheral driver can withstand the heat generated during the soldering process, leading to reliable connections.

Length: 4.9 mm

The short length of 4.9mm further enhances the compactness of this peripheral driver, making it a suitable choice for applications where size is a critical factor.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and secure soldering onto the circuit board, ensuring stable connections and reliable performance.

Turn-on Time: 1.35 us

The fast turn-on time of 1.35 microseconds ensures quick and efficient operation, making this peripheral driver ideal for high-speed applications.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27mm enables close spacing of terminals on the circuit board, contributing to the compact design of the overall system.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this peripheral driver is suitable for use in environments with moderate exposure to moisture, enhancing its reliability in various conditions.

Nominal Output Peak Current Limit: 5 A

The high nominal output peak current limit of 5A allows this peripheral driver to efficiently drive connected devices with higher power requirements, making it a versatile choice.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver provides compatibility with a wide range of components and peripherals, making it a versatile solution for different applications.

Turn-off Time: 10 us

The fast turn-off time of 10 microseconds ensures quick response and efficient operation, enhancing the overall performance of connected devices.

Output Current Flow Direction: SINK

The output current flow direction of sink allows this peripheral driver to effectively control and regulate the flow of current to connected devices, ensuring stable and reliable operation.

Technical Specifications

Peripheral Drivers VNS3NV04DP-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL; OVER VOLTAGE

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

1.35 us

Width:

3.9 mm

Trade Compliance

VNS3NV04DP-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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