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VNS3NV04D13TR

STMicroelectronics

VNS3NV04D13TR by STMicroelectronics

VNS3NV04D13TR by STMicroelectronics is a Peripheral Driver with 2 functions, built-in protections for transient, over current, and over voltage. It has 8 terminals in a small outline package style. This driver is ideal for applications requiring a nominal output peak current limit of 5A and sink output current flow direction.

Median Price

$12.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 2,000 parts In-Stock

1+ parts

$12.310

100+ parts

$9.230

1k+ parts

$8.000

10k+ parts

-

2,000

$12.310

$9.230

$8.000

-

Chip Stock

USA . 15,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,272

-

-

-

-

Vyrian

USA . 6,701 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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6,701

-

-

-

-

Digiode

USA . 1,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,979

-

-

-

-

Anansix

USA . 994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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994

-

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,825 parts In-Stock

1+ parts

$5.240

100+ parts

-

1k+ parts

$4.716

10k+ parts

-

1,825

$5.240

-

$4.716

-

AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$6.536

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$6.536

-

-

-

MKK Technologies

India . 401 parts In-Stock

1+ parts

$9.854

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$9.854

-

-

-

DigiPath Technology Company

USA . 401 parts In-Stock

1+ parts

$9.854

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$9.854

-

-

-

Aztec Data Supply Inc.

USA . 3,346 parts In-Stock

1+ parts

$11.240

100+ parts

-

1k+ parts

-

10k+ parts

-

3,346

$11.240

-

-

-

Corohmni

South Africa . 333 parts In-Stock

1+ parts

$14.063

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$14.063

-

-

-

Semicontronic

India . 299 parts In-Stock

1+ parts

$22.500

100+ parts

$21.938

1k+ parts

$21.825

10k+ parts

-

299

$22.500

$21.938

$21.825

-

Ampacity Inc.

Singapore . 1,427 parts In-Stock

1+ parts

$40.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,427

$40.500

-

-

-

Component Stockers USA

USA . 621 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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621

$99.990

-

-

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Lixinc

USA . 18,340 parts In-Stock

1+ parts

-

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18,340

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 14,545 parts In-Stock

1+ parts

-

100+ parts

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14,545

-

-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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Argo Parts USA

USA . 3,878 parts In-Stock

1+ parts

-

100+ parts

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3,878

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-

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Continental Prestige Electronics

USA . 2,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,509

-

-

-

-

Parana Technologies

USA . 1,332 parts In-Stock

1+ parts

-

100+ parts

$6.266

1k+ parts

-

10k+ parts

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1,332

-

$6.266

-

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Corphita

USA . 609 parts In-Stock

1+ parts

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100+ parts

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609

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Bastille Electronics

Australia . 21 parts In-Stock

1+ parts

-

100+ parts

-

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21

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Overview

Experience the unmatched quality and reliability of STMicroelectronics with the VNS3NV04D13TR peripheral driver. Designed with built-in protections for transient, over current, over voltage, and thermal issues, this product offers peace of mind while ensuring optimal performance. With a compact package style and dual terminal position, it is versatile and easy to integrate into a variety of applications. Trust STMicroelectronics to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers multiple functions in a single component, reducing the need for additional peripheral drivers and simplifying the overall design.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures safe operation by protecting against various potential hazards, improving reliability and preventing damage to connected devices.

No. of Terminals: 8

Provides ample connection points for interfacing with other components, allowing for versatile integration into diverse systems.

Package Style (Meter): SMALL OUTLINE

Occupies minimal space on the circuit board, facilitating a compact and efficient layout for the overall electronic system.

Terminal Finish: TIN LEAD

Offers reliable electrical contact and corrosion resistance, ensuring stable performance and longevity of the product.

Nominal Output Peak Current Limit: 5 A

Supports high current output capabilities, making it suitable for driving power-hungry peripherals and demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Enables effective signal amplification or inversion for interfacing with various devices, enhancing compatibility and flexibility in system design.

Output Current Flow Direction: SINK

Allows for efficient control of external devices that require current sinking capability, expanding the range of peripherals that can be interfaced.

Technical Specifications

Peripheral Drivers VNS3NV04D13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

1.35 us

Width:

3.9 mm

Trade Compliance

VNS3NV04D13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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