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ULN2003ADG4

Texas Instruments

ULN2003ADG4 by Texas Instruments

ULN2003ADG4 by Texas Instruments is a 7-bit buffer/inverter-based peripheral driver with open-collector output polarity. It operates b/w -40 to 125°C, supports a nominal voltage of 50V, and has built-in transient protections. Widely used in applications requiring sink current flow direction and standard input characteristics.

Median Price

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Lifecycle Status

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11

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Chip Stock

USA . 319,230 parts In-Stock

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Vyrian

USA . 4,796 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 867 parts In-Stock

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867

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Bristol Electronics

USA . 467 parts In-Stock

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467

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Pegasus Components GmbH

Germany . 93 parts In-Stock

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Ashlea Components Ltd

UK . 57 parts In-Stock

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Global Solutions Electronics Company

USA . 43 parts In-Stock

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Holdelec - ElecDif-Pro

France . 19 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 277 parts In-Stock

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$2.216

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$2.216

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$3.610

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$3.430

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$3.430

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20

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One Stop Electronics

USA . 675 parts In-Stock

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$7.500

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Parana Technologies

USA . 1,876 parts In-Stock

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DigiPath Technology Company

USA . 1,859 parts In-Stock

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$8.394

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$7.722

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ChromeModa Solutions

Germany . 6,009 parts In-Stock

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$8.565

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IDEA Electronic Components Group

UK . 1,467 parts In-Stock

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$8.565

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$8.137

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$7.708

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AZTECH Wire

Italy . 770 parts In-Stock

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Ampacity Inc.

Singapore . 703 parts In-Stock

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Semicontronic

India . 330 parts In-Stock

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Continental Prestige Electronics

USA . 6,932 parts In-Stock

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Corphita

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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Argo Parts USA

USA . 854 parts In-Stock

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Modulus Dynamics

Lithuania . 300 parts In-Stock

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Bastille Electronics

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Overview

Unlock the potential of your electronic designs with the ULN2003ADG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments provides top-quality products that meet the highest standards. The ULN2003ADG4 falls under the category of Peripheral Drivers, offering built-in transient protections and open-collector output characteristics. With its small outline package style and dual terminal position, this device is versatile and reliable for a wide range of applications. Experience the value and benefits of using the ULN2003ADG4 in your projects, where quality meets innovation to drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this peripheral driver lightweight and durable, ideal for various applications.

Surface Mount: YES

With surface mount capability, this peripheral driver can easily be integrated into PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy alignment during installation.

Built-in Protections: TRANSIENT

The built-in transient protection ensures the peripheral driver is safeguarded against voltage spikes, enhancing reliability and longevity.

No. of Terminals: 16

With 16 terminals, this peripheral driver can accommodate multiple connections, making it versatile for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications with limited real estate.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristics provide flexibility for interfacing with different logic levels, expanding compatibility with various systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the peripheral driver can function effectively in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, contributing to the product's long-term performance.

Technical Specifications

Peripheral Drivers ULN2003ADG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

7

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

50 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

ULN2003ADG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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