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VNB14N0413TR

STMicroelectronics

VNB14N0413TR by STMicroelectronics

VNB14N0413TR by STMicroelectronics is a peripheral driver with a max output peak current limit of 14A. It has built-in protections for transient, over current, and thermal issues. This MOS technology-based device is commonly used as a buffer or inverter based peripheral driver.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,560 parts In-Stock

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4,560

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Vyrian

USA . 608 parts In-Stock

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608

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Anansix

USA . 79 parts In-Stock

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79

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Distributors (Availability)

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$4.452

100+ parts

$4.051

1k+ parts

$3.651

10k+ parts

-

50

$4.452

$4.051

$3.651

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$7.144

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354

$7.144

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AZTECH Wire

Italy . 608 parts In-Stock

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$8.956

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608

$8.956

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IDEA Electronic Components Group

UK . 422 parts In-Stock

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$10.127

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$9.115

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422

$10.127

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$9.115

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MKK Technologies

India . 1,849 parts In-Stock

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$19.044

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$19.044

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DigiPath Technology Company

USA . 1,849 parts In-Stock

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$19.044

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$19.044

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Ampacity Inc.

Singapore . 441 parts In-Stock

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$29.500

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441

$29.500

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Semicontronic

India . 1,128 parts In-Stock

1+ parts

$46.500

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$45.338

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$45.105

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1,128

$46.500

$45.338

$45.105

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Corphita

USA . 4,090 parts In-Stock

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4,090

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Continental Prestige Electronics

USA . 1,290 parts In-Stock

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Argo Parts USA

USA . 1,021 parts In-Stock

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Parana Technologies

USA . 233 parts In-Stock

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$12.109

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233

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$12.109

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Discover the VNB14N0413TR by STMicroelectronics, a top-notch peripheral driver that delivers exceptional quality and performance. As a leader in the industry, STMicroelectronics ensures that this product meets the highest standards in manufacturing. With its wide range of applications, this peripheral driver is perfect for various industries. But what truly sets it apart is its value to customers. Offering unrivaled benefits and advantages, the VNB14N0413TR guarantees superior performance, reliable protection against transients and overcurrents, and efficient thermal management. Don't miss out on the opportunity to enhance your systems with this outstanding product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the peripheral driver component.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and reducing assembly time.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Ensures reliable operation and protects the driver from potential damage in case of faults.

Max Seated Height: 4.6 mm

Low profile design allows for compact integration in various electronic devices.

Technology: MOS

Utilizes MOS technology for efficient performance and low power consumption.

Nominal Output Peak Current Limit: 14 A

Capable of handling high current loads, suitable for driving peripherals in demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers flexibility in interfacing with different peripherals and control systems.

Technical Specifications

Peripheral Drivers VNB14N0413TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10.14 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

14 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

4.6 mm

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

7.5 us

Turn-on Time:

.5 us

Width:

9.15 mm

Trade Compliance

VNB14N0413TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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