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VNB14NV0413TR

STMicroelectronics

VNB14NV0413TR by STMicroelectronics

VNB14NV0413TR by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It supports a nominal voltage of 5V and can handle peak output currents up to 18A. Ideal for buffer or inverter applications, it features a small outline package for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NexGen Digital

USA . 3,767 parts In-Stock

1+ parts

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3,767

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Vyrian

USA . 2,671 parts In-Stock

1+ parts

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2,671

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Digiode

USA . 2,049 parts In-Stock

1+ parts

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2,049

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Anansix

USA . 1,197 parts In-Stock

1+ parts

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1,197

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Extreme Components

USA . 500 parts In-Stock

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500

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Semtec, LLC

USA . 30 parts In-Stock

1+ parts

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$6.518

100+ parts

-

1k+ parts

$5.866

10k+ parts

-

1,669

$6.518

-

$5.866

-

MKK Technologies

India . 2,062 parts In-Stock

1+ parts

$12.257

100+ parts

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2,062

$12.257

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DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

$12.257

100+ parts

-

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10k+ parts

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2,062

$12.257

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-

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AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$14.090

100+ parts

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393

$14.090

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$16.578

100+ parts

$15.086

1k+ parts

$13.594

10k+ parts

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100

$16.578

$15.086

$13.594

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Microchip USA

USA . 136 parts In-Stock

1+ parts

$121.737

100+ parts

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136

$121.737

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Corphita

USA . 4,130 parts In-Stock

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4,130

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Parana Technologies

USA . 1,525 parts In-Stock

1+ parts

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100+ parts

$7.794

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1,525

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$7.794

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Perfect Parts

USA . 99 parts In-Stock

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99

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Overview

Elevate your designs with the VNB14NV0413TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust peripheral driver ensures exceptional reliability and performance, featuring built-in protections against transient, overcurrent, and thermal issues, making it perfect for automotive and industrial applications. Experience peace of mind with its swift turn-on time and compact design, empowering you to create innovative projects without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable protection and performance in various operating environments.

Surface Mount: YES

Surface mount compatibility allows for easy integration into modern circuit designs, enhancing space efficiency.

Package Shape: RECTANGULAR

The rectangular shape facilitates optimal layout and assembly on printed circuit boards, reducing the footprint.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

These built-in protections ensure long-term reliability and safeguard the device against common electrical faults.

No. of Terminals: 2

Having just two terminals simplifies wiring and reduces the chances of potential connection issues.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact designs where space-saving is critical.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability, ensuring strong and dependable connections in assembly.

Terminal Position: SINGLE

A single terminal position simplifies installation and minimizes confusion during the manufacturing process.

Maximum Seated Height: 4.83 mm

The low height of this component allows it to fit well in designs with limited vertical space.

Width: 9.15 mm

The width is optimized for standard PCB layouts, easing integration into existing designs.

Maximum Time At Peak Reflow Temperature: 30 s

A quick reflow time contributes to overall production efficiency while ensuring proper solder joint formation.

Peak Reflow Temperature: 245 °C

This temperature is compatible with standard soldering processes, ensuring ease of manufacture.

Length: 10.2 mm

The length is balanced to optimize performance while maintaining a compact footprint.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and reliability in solder connections.

Nominal Supply Voltage: 5 V

Operating at a common voltage level makes it compatible with a wide range of electronic devices.

Turn-on Time: 4.5 us

A fast turn-on time ensures quick response in applications needing rapid signal changes.

Terminal Pitch: 2.54 mm

This standard pitch makes the component versatile in design applications and compatible with various PCB layouts.

Nominal Output Peak Current Limit: 18 A

The high current limit allows for significant power handling, making it suitable for demanding peripheral applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatility allows the driver to be used in a variety of signal processing applications.

Turn-off Time: 25 us

A reasonable turn-off time aids in maintaining proper signal timing without introducing delays.

Output Current Flow Direction: SINK

The sink current capability enables efficient control of peripheral devices, ensuring optimal power management.

Technical Specifications

Peripheral Drivers VNB14NV0413TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

18 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

4.83 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

25 us

Turn-on Time:

4.5 us

Width:

9.15 mm

Trade Compliance

VNB14NV0413TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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