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VNB14NV04

STMicroelectronics

VNB14NV04 by STMicroelectronics

VNB14NV04 by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It features a nominal output peak current limit of 18 A and operates efficiently with a turn-on time of just 4.5 µs. Ideal for buffer or inverter applications, it ensures reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,292 parts In-Stock

1+ parts

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2,292

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Vyrian

USA . 2,282 parts In-Stock

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2,282

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Anansix

USA . 540 parts In-Stock

1+ parts

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540

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ComSIT Distribution GmbH

Germany . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 901 parts In-Stock

1+ parts

$12.370

100+ parts

-

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10k+ parts

-

901

$12.370

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IDEA Electronic Components Group

UK . 833 parts In-Stock

1+ parts

$12.666

100+ parts

-

1k+ parts

$11.399

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-

833

$12.666

-

$11.399

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Microchip USA

USA . 489 parts In-Stock

1+ parts

$23.093

100+ parts

-

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489

$23.093

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MKK Technologies

India . 1,429 parts In-Stock

1+ parts

$23.817

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1,429

$23.817

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DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$23.817

100+ parts

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1,429

$23.817

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Component Stockers USA

USA . 452 parts In-Stock

1+ parts

$99.990

100+ parts

-

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452

$99.990

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RC Electronics

USA . 35,000 parts In-Stock

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35,000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 6,470 parts In-Stock

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6,470

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 724 parts In-Stock

1+ parts

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$15.144

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724

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$15.144

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Corphita

USA . 464 parts In-Stock

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464

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Overview

Elevate your designs with the VNB14NV04 from STMicroelectronics, where quality meets innovation. This highly reliable peripheral driver ensures optimal performance across various applications, thanks to its built-in protections against transient, overcurrent, and thermal issues. With a compact design and swift response times, it simplifies integration while enhancing system efficiency. Trust in STMicroelectronics for unmatched durability and excellence that empowers your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, enhancing the longevity of the peripheral driver.

Surface Mount: YES

Surface mount technology allows for efficient use of board space, facilitating compact designs and improved manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape is commonly used in various applications, making it easier to integrate into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protection features enhance reliability and safety, safeguarding the device from electrical anomalies.

No. of Terminals: 2

Having only two terminals simplifies the design and connectivity, making it suitable for a wide range of applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables efficient use of space on the PCB, allowing for dense circuit designs.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies the routing of connections, making integration into designs more straightforward.

Maximum Seated Height: 4.826 mm

A low seated height allows for low-profile designs, making it suitable for compact electronic devices.

Width: 9.15 mm

With a moderate width, this peripheral driver fits well into various design layouts without requiring excessive space.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures optimal soldering conditions while protecting components from heat damage.

Peak Reflow Temperature °C: 245

Operating at a peak temperature of 245 °C ensures compatibility with standard soldering processes, facilitating easy integration.

Length: 10.2 mm

The length is suitable for various applications, allowing for flexible placement on PCBs.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical stability and soldering ease, ensuring robust connections.

Turn-on Time: 4.5 us

A fast turn-on time of 4.5 microseconds allows for quick response in high-speed applications, improving overall system performance.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard and compatible with many PCB layouts, making design integration easier.

Nominal Output Peak Current Limit: 18 A

The high output peak current limit of 18 A makes this product capable of handling demanding applications requiring significant power.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed for buffer or inverter configurations, this IC type enhances signal integrity, making it ideal for various signaling applications.

Turn-off Time: 25 us

A turn-off time of 25 microseconds allows for efficient signal processing, crucial for high-speed applications.

Output Current Flow Direction: SINK

The sink current flow direction is advantageous for interfacing with various logic levels and for driving loads effectively.

Technical Specifications

Peripheral Drivers VNB14NV04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

18 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

4.826 mm

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

25 us

Turn-on Time:

4.5 us

Width:

9.15 mm

Trade Compliance

VNB14NV04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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