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VNB14N04

STMicroelectronics

VNB14N04 by STMicroelectronics

VNB14N04 by STMicroelectronics is a MOS technology peripheral driver with built-in protections for transient, over current, and thermal issues. It features an open-drain output polarity with a nominal output peak current limit of 14A. This small outline package is ideal for applications requiring buffer or inverter based interface ICs.

Median Price

$8.337

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 25 parts In-Stock

1+ parts

$8.337

100+ parts

$8.754

1k+ parts

$8.254

10k+ parts

-

25

$8.337

$8.754

$8.254

-

Vyrian

USA . 7,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,803

-

-

-

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Anansix

USA . 921 parts In-Stock

1+ parts

-

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-

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921

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Pegasus Components GmbH

Germany . 340 parts In-Stock

1+ parts

-

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-

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340

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-

-

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Digiode

USA . 197 parts In-Stock

1+ parts

-

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-

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197

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Nova Conductors

Japan . 58 parts In-Stock

1+ parts

-

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58

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,073 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

1,073

$2.070

-

-

-

AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$6.185

100+ parts

-

1k+ parts

-

10k+ parts

-

515

$6.185

-

-

-

Ampacity Inc.

Singapore . 826 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

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-

826

$8.500

-

-

-

Microchip USA

USA . 225 parts In-Stock

1+ parts

$9.597

100+ parts

-

1k+ parts

-

10k+ parts

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225

$9.597

-

-

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IDEA Electronic Components Group

UK . 1,714 parts In-Stock

1+ parts

$12.054

100+ parts

-

1k+ parts

$10.848

10k+ parts

-

1,714

$12.054

-

$10.848

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Corohmni

South Africa . 496 parts In-Stock

1+ parts

$12.082

100+ parts

-

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496

$12.082

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MKK Technologies

India . 2,084 parts In-Stock

1+ parts

$22.666

100+ parts

-

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2,084

$22.666

-

-

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DigiPath Technology Company

USA . 2,084 parts In-Stock

1+ parts

$22.666

100+ parts

-

1k+ parts

-

10k+ parts

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2,084

$22.666

-

-

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Semicontronic

India . 1,050 parts In-Stock

1+ parts

$33.500

100+ parts

$32.662

1k+ parts

$32.495

10k+ parts

-

1,050

$33.500

$32.662

$32.495

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Corphita

USA . 3,146 parts In-Stock

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3,146

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Continental Prestige Electronics

USA . 3,032 parts In-Stock

1+ parts

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3,032

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Argo Parts USA

USA . 1,358 parts In-Stock

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1,358

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Parana Technologies

USA . 820 parts In-Stock

1+ parts

-

100+ parts

$14.412

1k+ parts

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820

-

$14.412

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

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200

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Bastille Electronics

Australia . 33 parts In-Stock

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33

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Overview

Experience superior quality and performance with the VNB14N04 by STMicroelectronics, a leading manufacturer of innovative solutions. Designed for peripheral drivers, this product offers built-in protections against transient events, over current, and thermal issues. Its small outline package shape and open-drain output make it versatile for various applications. With a nominal output peak current limit of 14A and fast turn-on/off times, customers can rely on the VNB14N04 for efficient and reliable operation. Trust STMicroelectronics to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this peripheral driver lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable, this peripheral driver can easily be integrated onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space, making it easy to incorporate this peripheral driver into compact designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

With built-in protections against transient voltage, over current, and thermal issues, this peripheral driver ensures reliable and safe operation.

No. of Terminals: 2

With just 2 terminals, this peripheral driver offers simplicity in wiring and connection, reducing the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this peripheral driver suitable for applications where space is limited, without compromising on performance.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics of this peripheral driver allow for easy interfacing with other components, simplifying the overall circuit design.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good conductivity and resistance to corrosion, increasing the longevity of this peripheral driver.

Terminal Position: SINGLE

With a single terminal position, this peripheral driver offers straightforward installation and a clean layout on the PCB.

Maximum Seated Height: 4.6 mm

The low maximum seated height of 4.6 mm allows for a slim profile, making this peripheral driver suitable for applications with space constraints.

Technical Specifications

Peripheral Drivers VNB14N04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10.14 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

14 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

4.6 mm

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Turn-off Time:

7.5 us

Turn-on Time:

.5 us

Width:

9.15 mm

Trade Compliance

VNB14N04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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