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VNB14NV04-E

STMicroelectronics

VNB14NV04-E by STMicroelectronics

VNB14NV04-E by STMicroelectronics is a peripheral driver with built-in protections against transient, over current, over voltage, and thermal issues. It has a max seated height of 4.826 mm and a width of 9.15 mm. This IC type is commonly used as a buffer or inverter based peripheral driver for various applications.

Median Price

$1.634

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

-

10k+ parts

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300

$1.634

-

-

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Vyrian

USA . 6,838 parts In-Stock

1+ parts

-

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-

1k+ parts

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6,838

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-

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Anansix

USA . 2,176 parts In-Stock

1+ parts

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2,176

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-

-

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Digiode

USA . 1,330 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,330

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-

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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50

-

-

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ComSIT USA

USA . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.601

100+ parts

-

1k+ parts

$1.537

10k+ parts

-

1,000

$1.601

-

$1.537

-

Argo Parts USA

USA . 4,811 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

-

10k+ parts

-

4,811

$1.634

-

-

-

Continental Prestige Electronics

USA . 4,437 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

-

10k+ parts

$1.601

4,437

$1.634

-

-

$1.601

Aztec Data Supply Inc.

USA . 3,015 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

3,015

$3.600

-

-

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Advanced Electronics

New Zealand . 90 parts In-Stock

1+ parts

$7.814

100+ parts

$7.423

1k+ parts

$7.423

10k+ parts

-

90

$7.814

$7.423

$7.423

-

IDEA Electronic Components Group

UK . 218 parts In-Stock

1+ parts

$9.793

100+ parts

-

1k+ parts

$8.814

10k+ parts

-

218

$9.793

-

$8.814

-

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$13.495

100+ parts

-

1k+ parts

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80

$13.495

-

-

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MKK Technologies

India . 951 parts In-Stock

1+ parts

$18.416

100+ parts

-

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951

$18.416

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DigiPath Technology Company

USA . 951 parts In-Stock

1+ parts

$18.416

100+ parts

-

1k+ parts

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10k+ parts

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951

$18.416

-

-

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AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$19.661

100+ parts

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417

$19.661

-

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Semicontronic

India . 1,033 parts In-Stock

1+ parts

$20.500

100+ parts

$19.988

1k+ parts

$19.885

10k+ parts

-

1,033

$20.500

$19.988

$19.885

-

Microchip USA

USA . 193 parts In-Stock

1+ parts

$26.334

100+ parts

-

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193

$26.334

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-

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Ampacity Inc.

Singapore . 446 parts In-Stock

1+ parts

$27.500

100+ parts

-

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10k+ parts

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446

$27.500

-

-

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Kepictronics

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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15,000

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Lixinc

USA . 7,959 parts In-Stock

1+ parts

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7,959

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-

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RC Electronics

USA . 6,000 parts In-Stock

1+ parts

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6,000

-

-

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Parana Technologies

USA . 2,247 parts In-Stock

1+ parts

-

100+ parts

$11.710

1k+ parts

-

10k+ parts

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2,247

-

$11.710

-

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Perfect Parts

USA . 1,443 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,443

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-

-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

-

-

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Corphita

USA . 151 parts In-Stock

1+ parts

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151

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-

Overview

Discover the VNB14NV04-E by STMicroelectronics, a high-quality peripheral driver that offers unparalleled value and benefits. With its built-in protections against transients, over current, over voltage, and thermal issues, this product ensures reliable and safe performance. Whether you're designing automotive, industrial, or consumer electronics applications, the VNB14NV04-E is the perfect choice. Its small outline package, surface mount capability, and gull wing terminal form make it easy to integrate into your designs. Experience the advantages of the VNB14NV04-E and take your projects to new heights with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the peripheral drivers, making them suitable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the peripheral drivers onto circuit boards, making them ideal for mass production and streamlined assembly processes.

No. of Functions: 1

With a single function, these peripheral drivers offer a straightforward and focused solution, simplifying integration into various systems and reducing complexity.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility and easy placement within a range of electronic devices, facilitating seamless incorporation into diverse applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The inclusion of built-in protections against transients, over current, over voltage, and thermal issues helps safeguard both the peripheral drivers and the connected devices, enhancing reliability and preventing potential damage.

No. of Terminals: 2

With only two terminals, these peripheral drivers offer a simplified connection process, minimizing wiring intricacies and enabling efficient integration into various electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving installation in compact designs, making the peripheral drivers suitable for devices with limited board real estate.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity, ensuring reliable and low-resistance electrical connections, contributing to the overall efficiency of the peripheral drivers.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, reducing the chances of error during assembly, making the peripheral drivers more user-friendly.

Maximum Seated Height: 4.826 mm

The low maximum seated height makes these peripheral drivers suitable for devices with slim form factors, enabling compact designs without sacrificing functionality.

Width: 9.15 mm

The narrow width of the peripheral drivers allows for efficient utilization of board space, making them ideal for applications where available real estate is limited.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance ensures safe and reliable soldering during assembly processes, reducing the risk of solder joint failures and improving product quality.

Length: 10.2 mm

The compact length of these peripheral drivers allows for flexible placement within electronic devices, accommodating various design constraints and optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and soldering, ensuring strong mechanical connections and enhancing the durability of the peripheral drivers in challenging environments.

Turn-on Time: 4.5 us

The fast turn-on time of the peripheral drivers enables rapid response and action, enhancing the overall efficiency and performance of the connected devices.

Terminal Pitch: 2.54 mm

The standard terminal pitch ensures compatibility with commonly used connectors and sockets, allowing for straightforward integration into existing electronic systems.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, these peripheral drivers exhibit moderate moisture sensitivity, making them suitable for a wide range of environments and assembly processes.

Nominal Output Peak Current Limit: 18 A

The high nominal output peak current limit ensures the ability to drive demanding loads, making the peripheral drivers suitable for applications that require robust performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides flexibility and compatibility with different signal requirements, making the peripheral drivers versatile for various applications.

Turn-off Time: 25 us

The relatively fast turn-off time supports swift switching and control, facilitating responsive operation and enhancing the performance of the peripheral drivers.

Output Current Flow Direction: SINK

The output current flow direction being sink-based allows for efficient control and regulation of connected devices, making the peripheral drivers well-suited for a wide range of applications.

Technical Specifications

Peripheral Drivers VNB14NV04-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

18 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

4.826 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Turn-off Time:

25 us

Turn-on Time:

4.5 us

Width:

9.15 mm

Trade Compliance

VNB14NV04-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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